A phase-shift unit includes: a first substrate and a second substrate provided opposite to each other; a medium layer provided between the first substrate and the second substrate; a microstrip line disposed at a side of the second substrate facing towards the first substrate; and a grounding layer provided at a side of the first substrate facing towards the second substrate and formed with a via hole; wherein a projection of the via hole onto the second substrate and a projection of the microstrip line onto the second substrate have an overlapped area therebetween; and wherein the via hole is configured to feed a phase-shifted microwave signal out of the phase-shift unit, or feed a microwave signal into the phase-shift unit such that the microwave signal is phase-shifted.

A phase shifter, a manufacture method for manufacturing a phase shifter, a drive method for driving a phase shifter, and an electronic device are provided. The phase shifter includes a dielectric substrate, and a transmission line, a dielectric layer, an insulating layer, and a metal layer on the dielectric substrate. In a direction perpendicular to a first surface of the dielectric substrate, the dielectric layer and the insulating layer are between the metal layer and the transmission line, a material of the dielectric layer is a semiconductor material; and an orthographic projection of the metal layer on the dielectric substrate, an orthographic projection of the insulating layer on the dielectric substrate, and an orthographic projection of the dielectric layer on the dielectric substrate at least partially overlap. The present disclosure provides a new phase shifter based on a metal-insulator-semiconductor capacitor structure.

An electronic device is provided, including: a first substrate, a plurality of phase shifters, a second substrate, a plurality of patches, a common electrode layer, and a dielectric layer. The plurality of phase shifters are disposed on the first substrate. The second substrate is disposed opposite to the first substrate. The plurality of patches are disposed on the second substrate. The dielectric layer is disposed between the common electrode layer and the second substrate and on the plurality of patches. In addition, a thickness of the dielectric layer is greater than or equal to 5 μm and less than or equal to a thickness of the second substrate.

Provided are a liquid crystal phase shifter and an antenna. The liquid crystal phase shifter includes a first substrate, a second substrate, a liquid crystal layer, and at least one phase shift unit. The first substrate includes a first flexible substrate and a first liquid crystal alignment layer located on a side of the first flexible substrate close to the second substrate. The second substrate includes a second flexible substrate and a second liquid crystal alignment layer located on a side of the second flexible substrate close to the first substrate. The phase shift unit includes a microstrip line and a phased electrode. The microstrip line is located between the first flexible substrate and the first liquid crystal alignment layer, and the phased electrode is located between the second flexible substrate and the second liquid crystal alignment layer.

A phase shifter, a phase shift degree compensation device, and a phase shift degree compensation method are provided. The phase shifter includes a first substrate and a second substrate that are oppositely arranged, a resonant circuit, a signal line, and a first alignment layer are on a side of the first substrate facing the second substrate, a conductive layer and a second alignment layer are on a side of the second substrate facing the first substrate, a liquid crystal layer is between the first alignment layer and the second alignment layer, and the resonant circuit is configured to detect an actual equivalent dielectric constant of the liquid crystal layer.

A phase-shift unit includes: a first substrate and a second substrate provided opposite to each other; a medium layer provided between the first substrate and the second substrate; a microstrip line disposed at a side of the second substrate facing towards the first substrate; and a grounding layer provided at a side of the first substrate facing towards the second substrate and formed with a via hole; wherein a projection of the via hole onto the second substrate and a projection of the microstrip line onto the second substrate have an overlapped area therebetween; and wherein the via hole is configured to feed a phase-shifted microwave signal out of the phase-shift unit, or feed a microwave signal into the phase-shift unit such that the microwave signal is phase-shifted.

A TFT substrate includes a dielectric substrate, a plurality of antenna element regions provided on the dielectric substrate, each antenna element region including a TFT and a patch electrode electrically connected to a drain electrode of the TFT, and a flattening layer provided on the dielectric substrate, located above a layer including the patch electrode, and formed of a resin.

A phase shifter and a method for operating the same, an antenna and a communication device are provided. The phase shifter includes: a first substrate and a second substrate opposite to each other; a dielectric layer between the first substrate and the second substrate; a first electrode on a side of the first substrate proximal to the second substrate; a second electrode on a side of the second substrate proximal to the first substrate; and a ground electrode on a side of the second substrate distal to the first substrate. The dielectric layer includes liquid crystal molecules, and the first electrode and the second electrode are configured to control rotation of the liquid crystal molecules according to different voltages respectively received by the first electrode and the second electrode. The second electrode has a one-piece structure.

A liquid crystal phase shifter and a fabrication method thereof, a liquid crystal antenna and an electronic device are provided. The liquid crystal phase shifter includes a first substrate, a first substrate and a liquid crystal layer. The first substrate includes a first surface and a first electrode provided on the first surface, the second substrate includes a second surface and a second electrode provided on the second surface, the liquid crystal layer is provided between the first electrode of the first substrate and the second electrode of the second substrate, and the first substrate and the second substrate constitute a tubular structure in which the first substrate and the second substrate are stacked with one of the first substrate and the second substrate being inside the other of the first substrate and the second substrate.

In an embodiment, a method of forming a delay line circuit may include forming a first ferro-electric material between a first conductor and a second conductor wherein the first conductor and the second conductor have a first resistivity. The first conductor may be configured to receive a d.c. bias signal. An embodiment may include forming a third conductor overlying the second conductor, the third conductor having a second resistivity that is less than the first resistivity, the third conductor connected to the second conductor at least at a plurality of points along a length of the third conductor. The third conductor may be configured to receive an RF signal and conduct the RF signal along the length of the third conductor.