An antenna array with a layered structure having a base layer with a metamaterial structure, a printed circuit board (PCB) layers, a feed layer arranged on the opposite side of the PCB from the RF IC(s), and a radiating layer arranged on the feed layer. The radiating layer having a plurality of radiating elements. The metamaterial structure is arranged to attenuate electromagnetic radiation propagating between the at least two adjacent waveguides in the frequency band.

An electromagnetic field band-stop filter includes a plurality of unit structures that have reflection characteristics on an electromagnetic wave of a predetermined frequency. Each of the plurality of unit structures includes: a plurality of electrode parts each of which is disposed along a side of a polygon in a non-contact manner with another electrode part; and a plurality of conductor parts which are provided for the plurality of electrode parts on a one-to-one basis and each of which has at least one bent portion between one end and other end, the one ends of the plurality of conductor parts being connected to the electrode parts on a one-to-one basis and the other ends of the plurality of conductor parts being connected at one point on an inner side of the electrode parts in the individual unit structure. The plurality of unit structures are regularly and two-dimensionally disposed by disposing electrode parts of the plurality of unit structures to be adjacent to each other with a spacing that reflects the predetermined frequency.

A waveguide assembly which includes an elongated waveguide element (1) and a connector body (2). The connector body (2) is connected to an end of the elongated waveguide element (1) and has a substantially planar bottom surface (24) and an opposing top surface (23). The connector body is made from a single piece of partially metallized dielectric. The connector body has a waveguide coupling element (21) adjacent to the elongated waveguide element (1). The connector body further has an arrangement of electromagnetic band gap elements (27) adjacent to the waveguide coupling element (21).

A method and apparatus for producing an RF part of an antenna system is disclosed, as well as thereby producible RF parts. The RF part has at least one surface provided with a plurality of protruding elements. In particular, the RF part may be a gap waveguide. The protruding elements are monolithically formed and fixed on a conducting layer, and all protruding elements are connected electrically to each other at their bases via the conductive layer. The RF part is produced by providing a die having a plurality of recessions forming the negative of the protruding elements of the RF part. The die may be a multilayer die, having several layers, at least some having through-holes to form the recessions. A formable piece of material is arranged on the die, and pressure is applied, thereby compressing the formable piece of material to conform with the recessions of the die.

An apparatus includes a substrate containing a cavity and a dielectric structure covering at least a portion of the cavity. The cavity is hermetically sealed. The apparatus also may include a launch structure formed on the dielectric structure and outside the hermetically sealed cavity. The launch structure is configured to cause radio frequency (RF) energy flowing in a first direction to enter the hermetically sealed cavity through the dielectric structure in a direction orthogonal to the first direction. Various types of launch structures are disclosed herein.

A 3D electromagnetic bandgap circuit includes: a dielectric layer having a first surface and an opposing second surface; a spiral element positioned on the first surface; a first surrounding element positioned on the first surface and surrounding the spiral element, but does not touch with the spiral element; a plane element positioned on the second surface and including a notch; a second surrounding element positioned on the second surface and surrounding the plane element, but does not touch with the plane element, wherein the second surrounding element further includes a protruding portion extending toward the notch; a first via passing through the dielectric layer, the spiral element, and the protruding portion; a second via passing through the dielectric layer, the plane element, and the first surrounding element; and a third via passing through the dielectric layer, the plane element, and the first surrounding element.

Aspects and examples provide improvement in the attenuation level near the passband within the stopband of the bandpass-type filter using a ladder-type circuit formed by a BAW resonator. In one example the filter includes a ladder-type circuit formed by a bulk acoustic wave (BAW) resonator, and a loop circuit connected between two distinct points on a signal path extending from an input to an output of the ladder-type circuit for phase-cancellation of signals at the two distinct points. The two distinct points may be the input and the output of the ladder-type circuit. The loop circuit may include a SAW resonator or a BAW resonator. The BAW resonator may be a film bulk acoustic resonator (FBAR) or solidly mounted resonator (SMR).

Complementary metamaterial elements provide an effective permittivity and/or permeability for surface structures and/or waveguide structures. The complementary metamaterial resonant elements may include Babinet complements of split ring resonator (SRR) and electric LC (ELC) metamaterial elements. In some approaches, the complementary metamaterial elements are embedded in the bounding surfaces of planar waveguides, e.g. to implement waveguide based gradient index lenses for beam steering/focusing devices, antenna array feed structures, etc.

Complementary metamaterial elements provide an effective permittivity and/or permeability for surface structures and/or waveguide structures. The complementary metamaterial resonant elements may include Babinet complements of split ring resonator (SRR) and electric LC (ELC) metamaterial elements. In some approaches, the complementary metamaterial elements are embedded in the bounding surfaces of planar waveguides, e.g. to implement waveguide based gradient index lenses for beam steering/focusing devices, antenna array feed structures, etc.

A coplanar waveguide may include a first transmission line extending between a first ground plane and a second ground plane at a first interconnect level. The coplanar waveguide may further include a shielding layer at a second interconnect level. The shielding layer may include a first set of conductive fingers coupled to the first ground plane. The first set of conductive fingers may be interdigitated with a second set of conductive fingers that are coupled to the second ground plane. Only a dielectric layer may be between the first set of conductive interdigitated fingers and the second set of conductive interdigitated fingers. The first ground plane, the second ground plane, the dielectric layer, and the shielding layer may form a capacitor.