Patent classifications
H01P1/2005
Circuit board and electromagnetic bandgap structure thereof
A circuit board includes a dielectric layer, a conductive layer disposed on a surface of the dielectric layer, and an electromagnetic bandgap (EBG) structure disposed in the dielectric layer. The electromagnetic bandgap structure includes a via and a signal suppression board. Two opposite ends of the via are respectively connected to the electrically conductive layer and the signal suppression board respectively. The signal suppression board has at least one hollow pattern.
Structure and electronic circuit
A structure which cuts off propagation of an electromagnetic wave at one or more frequencies is provided. The structure comprises linear third conductors arranged on a plurality of different layers different from a first layer of a substrate including the first layer where a first conductor is formed and a second layer where a second conductor is formed, and at least one fourth conductor configured to connect one end of one conductor out of the third conductors to one end of another conductor out of the third conductors. At least one of the third conductors has a curved shape.
Photonic band gap accelerator
A preferred compact particle accelerator can include a cell arranged along a longitudinal axis along which a particle beam is accelerated. The preferred cell can include a first plate disposed substantially orthogonal to the longitudinal axis and a second plate disposed substantially parallel to the first plate. The preferred cell can also include a first set of rods connecting the first plate to the second plate and disposed at a first radius about the longitudinal axis. Preferably, the first set of rods each defines an elliptical cross section. The preferred cell can also include a second set of rods connecting the first plate to the second plate and each disposed at least at a second radius greater than the first radius. Optimized geometry of the elliptical rods and the periodicity of the rods in the lattice provide improved wakefield suppression and allow for significant gains in frequency and output.
BAND-PASS FILTERING STRUCTURE AND ANTENNA HOUSING
The present invention discloses a band-pass filtering structure and an antenna housing. The band-pass filtering structure includes a functional layer structure, where the functional layer structure includes two or more first dielectric layers and a second dielectric layer that is disposed between two first dielectric layers, a plurality of first conductive geometric structures displayed in a periodical arrangement are disposed on the first dielectric layer, a plurality of second conductive geometric structures displayed in a periodical arrangement are disposed on the second dielectric layer, the first conductive geometric structure includes two crossly-disposed conductive strips, and the second conductive geometric structure is a closed conductive geometric structure. The present invention resolves a technical problem that filtering performance of an existing band-pass filter is poor due to unreasonable structural design.
Ultra-wideband electromagnetic band gap (EBG) structure and circuit board
An ultra-wideband electromagnetic band gap (EBG) structure includes multiple EBG units in an array. Each EBG unit includes a power plane, a dielectric substrate and a ground plane from top to bottom. The power plane includes a patch, a coupled complementary split ring resonator (C-CSRR) and a plurality of semi-improved Z-bridge structures. Each edge of the patch is provided with a semi-improved Z-bridge structure. The C-CSRR is provided within a ring formed by the semi-improved Z-bridge structures. The Z-bridge structure includes a first horizontal branch, a first vertical branch, a second horizontal branch and a second vertical branch connected in sequence. The second vertical branch is connected to the patch. First horizontal branches of adjacent EBG units are connected to each other. A circuit board including the aforementioned EBG structure is also provided.
Waveguides And Transmission Lines In Gaps Between Parallel Conducting Surfaces
A microwave device is based on gap waveguide technology, and comprises two conducting layers (101, 102) arranged with a gap there between, and protruding elements (103, 104) arranged in a periodically or quasi-periodically pattern and fixedly connected to at least one of said conducting layers, thereby forming a texture to stop wave propagation in a frequency band of operation in other directions than along intended waveguiding paths. Sets of complementary protruding elements are either each formed in said pattern and arranged in alignment and overlying each other, the complementary protruding elements of each set forming part of the full length of each protruding element of the pattern, or the sets of complementary protruding elements are arranged in an offset complementary arrangement, the protruding elements of one set thereby being arranged in between the protruding elements of the other set.
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
A package structure comprising a die, a first molding compound encapsulating the die, an antenna structure and a reflector pattern disposed above the die is provided. Through vias penetrating through the first molding compound are disposed around the die. The reflector pattern is disposed on the die and the through vias. The antenna structure is disposed on the reflector pattern and electrically connected with the reflector pattern and the die. The antenna structure is wrapped by a second molding compound disposed on the reflector pattern.
Structure and wiring substrate
Provided is a structure including a first conductor plane (101); a second conductor plane (102); a first transmission line (104) that is formed in a layer different from the first conductor plane (101) and the second conductor plane (102); a second transmission line (105) that is disposed so as to face the second conductor plane (102) in a layer opposite to the first transmission line (104) with respect to the second conductor plane (102); a first conductor via (103) that connects one end of the first transmission line (104) with the first conductor plane (101); a second conductor via (106) that connects another end of the first transmission line (104) with one end of the second transmission line (105); and a slit (107) that is formed on the second conductor plane (102).
MICROELECTROMECHANICAL SWITCH WITH METAMATERIAL CONTACTS
A microelectromechanical switch having improved isolation and insertion loss characteristics and reduced liability for stiction. The switch includes a signal line having an input port and an output port between first and second ground planes. The switch also includes a beam for controlling activation of the switch. In some embodiments, the switch further includes one or more defected ground structures formed in the first and second ground planes, and a corresponding secondary deflectable beam positioned over each defected ground structure. In some embodiments, the switch includes a metamaterial structure for generating a repulsive Casimir force.
THREE-DIMENSIONAL LC ELECTRICAL RESONATOR DEVICE
The invention relates to a three-dimensional LC electrical resonator device having a given resonant frequency of 100 gigahertz or more, comprising: a separating layer; a first track made of a conductor and comprising two overlapping portions; and a second track made of a conductor, the second track comprising two overlapping portions and an inductive loop connecting the two overlapping portions, the first track and the second track respectively being formed on either side of the separating layer, each overlapping portion of the first track being placed facing a respective overlapping portion of the second track so as to form two capacitors that are spatially spaced apart from each other.