A cell forming a metamaterial, comprises a patch conductor, a conductor layer arranged in parallel with the patch conductor, and a connection conductor configured to electrically connect the patch conductor and the conductor layer. The connection conductor forms a helical electrical path by a plurality of conductor lines and a plurality of vias which connect the conductor lines to the patch conductor and the conductor layer.

A microwave device, such as a waveguide, transmission line, waveguide circuit, transmission line circuit or radio frequency part of an antenna system, is disclosed. The microwave device comprises two conducting layers arranged with a gap there between, and a set of periodically or quasi-periodically arranged protruding elements fixedly connected to at least one of said conducting layers, thereby forming a texture to stop wave propagation in a frequency band of operation in other directions than along intended waveguiding paths, thus forming a so-called gap waveguide. All protruding elements are connected electrically to each other at their bases at least via the conductive layer on which they are fixedly connected, and some or all of the protruding elements are in conductive or non-conductive contact also with the other conducting layer. A corresponding manufacturing method is also disclosed.

Embodiments of the invention include waveguide switch rotors, stators, waveguide switch housings and meander clamping mechanisms. Embodiments of a meander clamping mechanism may be used to connect arbitrary objects to one another. A meander clamping mechanism is particularly useful for connecting a rotor to a motor shaft and also for securing a bearing between a stator and rotor.

A second conductor plane (102) is formed in a layer different from a layer in which a first conductor plane (101) is formed, and faces the first conductor plane (101). A first transmission line (104) is formed in a layer different from the layers in which the first conductor plane (101) and the second conductor plane (102) are formed, and faces the second conductor plane (102), and one end thereof is an open end. A conductor via (106) connects the other end of the first transmission line (104) and the first conductor plane (101). An insular conductor (112) is connected to a portion of the first transmission line (104) other than a portion thereof at which the transmission line (104) is attached to the conductor via (106), is located in a layer different from the layer in which the second conductor plane (102) is located, and faces the second conductor plane (102).

This invention enables Frequency Selective Surface (FSS) and Artificial Magnetic Conductor (AMC) which exhibits Electromagnetic Band Gap (EBG) in any of the substrate's layer from a small and thin systems and sub-systems in package to a large-format PCBs. The metamaterial substrate may be integrated with electronic circuit components or buried in PCBs for circuit designs capable of transmitting, receiving and reflecting electromagnetic energy, altering electromagnetic properties of natural circuit materials, enhancing electrical characteristics of electrical components (such as filters, antennas, baluns, power dividers, transmission lines, amplifiers, power regulators, and printed circuits elements) in systems and sub-systems circuit designs. The metamaterial substrate creates new electrical characteristics, properties and systems, sub-systems or component's specification not readily available with conventional circuit materials, substrates, and PCBs. The metamaterial substrate can be less than 70 m thick and buried into any PCB layer.

A connection member according to an embodiment includes a dielectric material, a penetrating via penetrating through the dielectric material, a first metal plane provided in the dielectric material, the first metal plane being perpendicular to an extension direction of the penetrating via, the first metal plane crossing the penetrating via, and a second metal plane provided n or on the dielectric material in parallel with the extension direction of the penetrating via, the second metal plane connected to the first metal plane.

A multi-layer waveguide comprising at least three physical layers assembled into a multi-layer waveguide. The layers are a top layer, one or more intermediate layer, and a bottom layer. The multi-layer waveguide further comprises a waveguide channel being an elongated aperture in at least one intermediate layer. At least one layer has a metasurface on a first surface facing a first adjoining layer, wherein the metasurface surrounds the elongated aperture and comprise thick and thin sections.

This document describes techniques and systems for planar surface features for waveguides and antennas. Two structures are arranged with opposing planar surfaces fixed adjacent to a separation plane dividing a channel (e.g., a waveguide, a feed network) to provide an energy path for propagating electromagnetic energy. Part of the channel is formed between side walls of a recessed groove within one opposing surface; another channel part is formed by an arrangement of surface features spaced and shaped on the other opposing surface. At least two surface features are adjacent protrusions contoured to compliment the sidewalls of the recessed groove. An area on each opposing surface between the recessed groove and the adjacent protrusions is configured to form the energy path through the channel including to prevent energy leakage from the separation plane dividing the channel.

In an embodiment, a 3D-printed electrical structure such as an electromagnetic bandgap is provided. The structure includes a dielectric material with an embedded electrical interconnect that functions like a via and electrically connects a first surface of the dielectric material with a second surface of the dielectric material such as a ground plane. Unlike conventional vias, the embedded interconnect is not limited to straight lines and can take a variety of shapes and paths in the dielectric material allowing for the electrical interconnect to have a longer length than the thickness of the dielectric material. Increasing the length of the electrical interconnect increases the inductance of the electrical interconnect which in turn increases the bandwidth and reduces the frequency of the electrical structure without an increase in the height of the dielectric material.

A multi-layer waveguide including at least three physical layers assembled into a multi-layer waveguide. The layers are a top layer, one or more intermediate layer, and a bottom layer. The multi-layer waveguide further includes a waveguide channel being an elongated aperture in at least one intermediate layer. At least one layer has a metasurface on a first surface facing a first adjoining layer, wherein the metasurface surrounds the elongated aperture and comprise thick and thin sections.