H01P1/2005

Transmission line and antenna
11658372 · 2023-05-23 · ·

A transmission line having, for example, a first frequency-selecting surface.

Electromagnetic band gap structure and package structure
11658375 · 2023-05-23 · ·

An electromagnetic bandgap structure includes a plurality of resonators. Each of the resonators includes a dielectric substrate, a patch conductor formed on an upper surface of the dielectric substrate, and a conductor layer formed on a lower surface of the dielectric substrate. The patch conductor and the conductor layer are electrically connected to each other by via holes penetrating the dielectric substrate. A plurality of long holes and are formed on the lower surface of the dielectric substrate. A long hole conductor layer is formed on an inner wall surface of the long holes and. The conductor layer and the long hole conductor layer are electrically connected to each other to thereby form an integral conductor surface. The via holes are electrically connected to the conductor surface in the long holes and.

Flexible ceramic waveguides for terahertz applications and use as on-board interconnects

A terahertz (THz) waveguide and method for production allows for THz waveguides to be used in or on a printed circuit board (PCB) such that the propagation of THz waves require less power, result in less signal loss due to radiation or dispersion, and propagate more efficiently. Additionally, the position and/or geometry of a waveguide, as well as any additional antenna or coupling element, may be adjusted on or in the PCB such that the electromagnetic field of the waveguide may more efficiently couple with the electromagnetic field of the PCB.

Terahertz device and method for manufacturing terahertz device
11811365 · 2023-11-07 · ·

Terahertz device includes first resin layer, columnar conductor, wiring layer, terahertz element, second resin layer, and external electrode. Resin layer includes first resin layer obverse face and first resin layer reverse face. Columnar conductor includes first conductor obverse face and first conductor reverse face, penetrating first resin layer in z-direction. Wiring layer spans between first resin layer obverse face and first conductor obverse face. Terahertz element includes element obverse face and element reverse face, and converts between terahertz wave and electric energy. Second resin layer includes second resin layer obverse face and second resin layer reverse face, and covers wiring layer and terahertz element. External electrode, disposed offset in a direction first resin layer reverse face faces with respect to first resin layer, is electrically connected to columnar conductor. Terahertz element is conductively bonded to wiring layer.

TERAHERTZ DEVICE AND METHOD FOR MANUFACTURING TERAHERTZ DEVICE
20220302878 · 2022-09-22 ·

Terahertz device A1 includes first resin layer 21, columnar conductor 31, wiring layer 32, terahertz element 11, second resin layer 22, and external electrode 40. Resin layer 21 includes first resin layer obverse face 211 and first resin layer reverse face 212. Columnar conductor 31 includes first conductor obverse face 311 and first conductor reverse face 312, penetrating first resin layer 21 in z-direction. Wiring layer 32 spans between first resin layer obverse face 221 and first conductor obverse face 311. Terahertz element 11 includes element obverse face 111 and element reverse face 112, and converts between terahertz wave and electric energy. Second resin layer 22 includes second resin layer obverse face 221 and second resin layer reverse face 222, and covers wiring layer 32 and terahertz element 11. External electrode 40, disposed offset in a direction first resin layer reverse face 222 faces with respect to first resin layer 32, is electrically connected to columnar conductor 31. Terahertz element 11 is conductively bonded to wiring layer 32.

WAVEGUIDE FILTERS

A filter for filtering an electromagnetic wave and a filter design method are provided. The filter comprises a cavity with a first plate and a second plate, the first and second plates are opposite to each other. The first plate comprises a number of elements distributed on the side of the first plate facing the cavity, wherein a location of each element on the first plate is defined in a coordinate system. The second plate comprises a number of elements distributed on the side of the second plate facing the cavity according to the locations of the elements on the first plate, wherein each element is distributed on the second plate with an offset with respect to a corresponding element on the first plate.

Waveguides interconnected by flanges having glide symmetrically positioned holes disposed therein

The embodiments herein relate to a first waveguide comprising a first flange (103a) surrounding an end opening (105a) of the first waveguide (101a). The first flange (103a) comprises at least two holes (110) which are periodically distributed around the end opening (105a). The first waveguide (101a) is arranged to be connected to a second waveguide (101b) by connecting the first flange (103a) to a second flange (103b) of the second waveguide (101b) such that the end opening (105a) of the first waveguide (101a) faces an end opening (105b) of the second waveguide (101b) and such that the holes (110) in the first flange (103a) are at least partly glide symmetrically positioned with respect to holes (110) which are periodically distributed around the end opening (105b) of the second flange (103b).

Terahertz device and method for manufacturing terahertz device
11387783 · 2022-07-12 · ·

Terahertz device includes first resin layer, columnar conductor, wiring layer, terahertz element, second resin layer, and external electrode. Resin layer includes first resin layer obverse face and first resin layer reverse face. Columnar conductor includes first conductor obverse face and first conductor reverse face, penetrating first resin layer in z-direction. Wiring layer spans between first resin layer obverse face and first conductor obverse face. The terahertz element includes element obverse face and element reverse face, and converts between terahertz wave and electric energy. Second resin layer includes second resin layer obverse face and second resin layer reverse face, and covers wiring layer and terahertz element. External electrode, disposed offset in a direction first resin layer reverse face faces with respect to first resin layer, is electrically connected to columnar conductor.

CONTACTLESS TRANSMISSION LINE FOR WIRELESS POWER TRANSFER
20220216729 · 2022-07-07 ·

A system for wireless power transfer (WPT) is described. The WPT system may be used for charging of electric vehicles or other mobile platforms. The WPT system includes a gap waveguide base including a conductive waveguiding structure and a bandgap structure along at least the lateral sides of the waveguiding structure. The WPT system also includes a charging plate separate from the gap waveguide base. The charging plate includes a conductive plate having a receiving structure for receiving the electromagnetic field from the gap waveguide base through an air gap. The disclosed WPT system enables propagation of an electromagnetic field through the air gap, including electromagnetic fields in the very high frequency (VHF) band.

ANTENNA ARRAY BASED ON ONE OR MORE METAMATERIAL STRUCTURES
20220109246 · 2022-04-07 ·

An antenna array with a layered structure comprising a base layer with a metamaterial structure; a printed circuit board (PCB) layer; a feed layer arranged on the opposite side of the PCB from the RF IC(s); and a radiating layer arranged on the feed layer comprising a plurality of radiating elements, wherein the metamaterial structure is arranged to attenuate electromagnetic radiation propagating between the at least two adjacent waveguides in the frequency band.