An isolator includes an input connector configured to connect the isolator to a first device. The isolator also includes an output connector configured to connect the isolator to a second device. The isolator also includes a body including an outer shield. The isolator also includes a coupling member positioned at least partially within the outer shield. The coupling member is configured to electrically couple with the outer shield. The isolator also includes a coaxial circuit positioned at least partially around a first portion of the coupling member. The isolator also includes a toroid positioned at least partially around a second portion of the coupling member The isolator also includes a compression material configured to apply a force to the coaxial circuit and the toroid. The isolator also includes a signal conditioning circuit configured to condition signals communicated between the input connector and the output connector.

An isolator includes a body including an input connector and an output connector. The isolator also includes an outer shield positioned at least partially around a portion of the body. The isolator also includes a coupling member electrically coupled to the outer shield and positioned at least partially within the outer shield. The isolator also includes a coaxial circuit positioned at least partially around a first portion of the coupling member. The isolator also includes a toroid positioned at least partially around a second portion of the coupling member. The toroid is configured to filter radio frequency (RF) signals. The first portion and the second portion are axially-adjacent to one another. The isolator also includes a conditioning circuit in communication with the input connector and the output connector. The conditioning circuit is configured to condition the RF signals communicated between the input connector and the output connector.

A radiofrequency transmission line configured so as to allow a radiofrequency electrical signal to be transmitted between a first end and a second end, the transmission line including a main conductor and a ground plane electrically connected to an electrical ground of the transmission line.

The ground plane includes a set of portions that are connected in series between the first end and the second end and a set of second capacitors, the set of portions including a set of second portions, each second capacitor being inserted between two contiguous second portions.

Systems and methods for introducing DC bias in a radio frequency (RF) signal communicated over a transmission line are provided. In one example implementation, the RF system can include a transmission line having a first port and a second port. The transmission line can be configured to communicate an RF signal between a first port and a second port. One or more DC bias resistors can be coupled to the transmission line at a location between the first port and the second port. Each DC bias resistor can provide a path for injecting DC current to the transmission line to provide DC bias for the RF signal. Each DC bias resistor can be coupled to the transmission line via a point connection.

A low frequency and direct current (DC) signal blocking device includes a dielectric substrate layer; a low frequency and DC signal blocking transmission line on a first surface of the substrate layer, where the low frequency and DC signal blocking transmission line has an input end and an output end; a metal layer on a second surface of the substrate layer, where there is at least one gap on the metal layer such that the metal layer is separated into at least a first sub-region and a second sub-region, where the gap is configured to block at least one of a low frequency signal and a DC signal; the substrate layer disposed between the low frequency and DC signal blocking transmission line and the metal layer; and a metal plate, wherein a dielectric layer is disposed between the metal plate and the metal layer.

A radio-frequency signal grounding device for an antenna comprises: a substrate layer; a grounding transmission line on a first side of the substrate layer; a metal layer on a second side of the substrate layer, the metal layer including at least one gap such that the metal layer is divided into at least a first sub-region and a second sub-region, where the gap is configured to block at least one of a low frequency signal and a direct current signal; a metal plate; and a dielectric layer that is disposed between the metal plate and the metal layer. The radio-frequency signal grounding device can achieve good radio-frequency signal grounding and low frequency/direct current signal blocking within a limited space via a multi-coupling design.

Fabrication of superconducting devices that combine or separate direct currents and microwave signals is provided. A method can comprise forming a direct current circuit that supports a direct current, a microwave circuit that supports a microwave signal, and a common circuit that supports the direct current and the microwave signal. The method can also comprise operatively coupling a first end of the direct current circuit and a first end of the microwave circuit to a first end of the common circuit. The direct current circuit can comprise a bandstop circuit and the microwave circuit can comprise a capacitor. Alternatively, the direct current circuit can comprise a bandstop circuit and the microwave circuit can comprise a bandpass circuit. Alternatively, the microwave circuit can comprise a capacitor and the direct current circuit can comprise one or more quarter-wavelength transmission lines.

There is provided a converter for converting a received RF signal into a DC signal for powering a load, the converter comprising: a rectifier arranged to generate, based on the RF signal, the DC signal and one or more harmonics of the RF signal, and to output the DC signal and the one or more harmonics together with a component of the RF signal; a first planar transmission line arranged to guide the received RF signal to the rectifier; and a second planar transmission line arranged to receive from the rectifier the DC signal, the component of the RF signal and the one or more harmonics from the rectifier, and to reflect the one or more harmonics back towards the rectifier. The first planar transmission line is further arranged to reflect back towards the rectifier RF signals from the rectifier that are based on the reflected signals. The converter further comprises a low-pass filter for supplying the DC signal to the load, the low-pass filter comprising an inductor and a third planar transmission line that. connects the second transmission line to the inductor, wherein the third planar transmission line and the inductor are arranged to transmit the DC signal and to substantially block the component of the RF signal and the harmonics of the RF signal.

There is provided a dual-band converter operable to convert a first RF signal in a first frequency band and a second RF signal in a second frequency band that is separate from the first frequency band into a DC signal for powering a load. The converter comprises: a rectifier arranged to generate, based on the first and second RF signals, the DC signal and two or more harmonics of each of the first and second RF signals during operation of the dual-band converter; a planar transmission line arranged to guide the first and second RF signals to the rectifier and to receive a component of each of the harmonics generated by the rectifier during operation of the dual-band converter; a first stub and a second stub each connected to the planar transmission line and arranged to reflect, during operation of the dual-band converter, a component of a first harmonic and a component of a second harmonic of the first RF signal received from the rectifier, respectively; and a third stub and a fourth stub each connected to the planar transmission line and arranged to reflect, during operation of the dual-band converter, a component of a first harmonic and a component of a second harmonic of the second RF signal received from the rectifier, respectively.

A radio-frequency module includes a semiconductor device, a first signal line configured to transmit an electrical signal to the semiconductor device, a ground electrode, and a first discharge unit situated between the first signal line and the ground electrode, wherein the first discharge unit includes a first projection formed on the ground electrode and a second projection formed on the first signal line, and the first projection and the second projection are situated opposite each other, with a predetermined distance therebetween, and wherein when an effective wavelength of the transmitted electrical signal is denoted as g, and a length of the first projection is denoted as L, g and L are related as:

0<(L/g)0.1.