Various substrate-integrated waveguide (SIW) filtering crossover systems are described. An example SIW filtering crossover system may include: a substrate; a top metal plate placed on top of the substrate; a bottom metal plate placed beneath the substrate; a plurality of metalized via-holes in the substrate connecting the top metal plate and the bottom metal plate; and a plurality of grounded-coplanar-waveguides (GCPWs) coupled to sidewalls of the crossover system, wherein each of the GCPWs connects the crossover system to a respective microstrip line for signal transmission between the respective microstrip line and the crossover system.

Various substrate-integrated waveguide (SIW) filtering crossover systems are described. An example SIW filtering crossover system may include: a substrate; a top metal plate placed on top of the substrate; a bottom metal plate placed beneath the substrate; a plurality of metalized via-holes in the substrate connecting the top metal plate and the bottom metal plate; and a plurality of grounded-coplanar-waveguides (GCPWs) coupled to sidewalls of the crossover system, wherein each of the GCPWs connects the crossover system to a respective microstrip line for signal transmission between the respective microstrip line and the crossover system.

An RF power combiner functioning as a higher-order harmonics filter comprises: at least one pair of coaxially arranged disc-shaped metal conductors, at least one of the conductors having a central axial opening to accommodate a waveguide is provided. Facing surfaces of the disk-shaped metal conductors are shaped symmetrically with respect to the plane of symmetry of the disk-shaped metal conductors to form a plurality of consecutive, radially communicating concentric cavities having isosceles trapezoids with different bases in section. The smaller base of each trapezoid disposed closer to the central axis. The number of the concentric cavities is (2 k+1), where K is the number of signal harmonics being filtered.

A hybrid-harmonic waveguide filter includes transformer sections at end terminals of the harmonic waveguide filter, a number of corrugations along the length of the waveguide filter, and multiple ridge interconnects that couple the corrugations. By shaping the identical-cross-section ridge interconnects via single-pass wire electrical-discharge machining (EDM), low manufacturing cost is achieved along with continuous broadband rejection of TEn0 modes and an extremely high-power handling capability is observed.

A hybrid-harmonic waveguide filter includes transformer sections at end terminals of the harmonic waveguide filter, a number of corrugations along the length of the waveguide filter, and multiple ridge interconnects that couple the corrugations. By shaping the identical-cross-section ridge interconnects via single-pass wire electrical-discharge machining (EDM), low manufacturing cost is achieved along with continuous broadband rejection of TEn0 modes and an extremely high-power handling capability is observed.

A wireless communication module includes a wireless module board including an antenna, a frequency converter mounted on the wireless module board and configured to change a frequency of a wireless signal, an amplifier phase shifter mounted on the wireless module board and configured to change a phase and an intensity of the wireless signal, a band-pass filter mounted on the wireless module board so as to be provided between the frequency converter and the amplifier phase shifter, and a band-rejection filter formed on the wireless module board and composed of at least a portion of a plurality of wiring layers electrically connecting the frequency converter, the amplifier phase shifter, and the band-pass filter to each other.

A microwave or radio frequency (RF) device includes a substrate and a cover. The substrate has a first surface and an opposing second surface, the first surface including a first RF component and a second RF component electrically coupled to the first RF component in series. The cover is disposed over the first surface of the substrate, where the cover includes a first portion with a first width covering the first RF component, where the first portion and the first surface define a first waveguide cavity having the first width, and a second portion with a second width, less than the first width, covering the second RF component, where the second portion and the first surface define a second waveguide cavity having the second width.

A microwave or radio frequency (RF) device includes a substrate and a cover. The substrate has a first surface and an opposing second surface, the first surface including a first RF component and a second RF component electrically coupled to the first RF component in series. The cover is disposed over the first surface of the substrate, where the cover includes a first portion with a first width covering the first RF component, where the first portion and the first surface define a first waveguide cavity having the first width, and a second portion with a second width, less than the first width, covering the second RF component, where the second portion and the first surface define a second waveguide cavity having the second width.

A frequency selective coupler configured as a harmonic rejection filter includes an electromagnetic element configured to electromagnetically couple to a signal path between an output of a power amplifier and an antenna, an impedance network coupled between an isolated port of the coupler and ground, the impedance network configured to provide a harmonic filter response, and an electrically unconnected coupled port connected to the electromagnetic element.

A frequency selective coupler configured as a harmonic rejection filter includes an electromagnetic element configured to electromagnetically couple to a signal path between an output of a power amplifier and an antenna, an impedance network coupled between an isolated port of the coupler and ground, the impedance network configured to provide a harmonic filter response, and an electrically unconnected coupled port connected to the electromagnetic element.