A terminator has an upper dielectric layer provided on an upper broad wall of a post-wall waveguide, and a microstrip line (MSL) provided on the upper dielectric layer. A blind via has one end thereof connected with one end of the MSL and is inserted inside the post-wall waveguide. A chip resistor has one end thereof connected with the other end of the MSL and has the other end thereof connected with the upper broad wall.

Aspects of the subject disclosure may include, for example, a system that performs operations including detecting a signal degradation of guided electromagnetic waves bound to a transmission medium without utilizing an electrical return path, the guided electromagnetic waves having a non-optical frequency range, and adjusting an alignment of at least a portion of fields of the guided electromagnetic waves to mitigate the signal degradation. Other embodiments are disclosed.

A new two-probe waveguide slide screw load-pull tuner of which the probes share the same waveguide section; they are inserted diametrically at fixed depth into slots facing each other on opposite broad walls of the waveguide. The tuner does not have cumbersome adjustable vertical axes controlling the penetration of the probes and its low profile is optimized for on-wafer operations. The carriages holding the probes are moved along the waveguide using electric stepper motors or linear actuators. The calibration uses mutual de-embedding of initialized probes and is 20 or more times faster than the full probe permutations calibration.

An attenuation apparatus and a test system. The attenuation apparatus includes a signal transmission channel and at least one radiation loss structure, wherein the signal transmission channel is configured to perform transmission attenuation on the energy of a transmitted signal; the radiation loss structure is arranged in the signal transmission channel; the radiation loss structure has a first operating state and a second operating state; when the radiation loss structure is in the first operating state, the radiation loss structure is configured to perform radiation attenuation on the energy of a signal transmitted by the signal transmission channel; and when the radiation loss structure is in the second operating state, the radiation loss structure is configured to perform transmission attenuation on the energy of the signal transmitted by the signal transmission channel.

A waveguide assembly integrated with a semiconductor wafer is provided. The waveguide assembly includes a waveguide channel defined by internal walls of the wafer lined with a metallic layer, and having at least one port for transmission of the RF signal into or out of the waveguide channel. The waveguide assembly also includes a semiconductor obstacle member disposed in the waveguide channel. The waveguide assembly may be fabricated using etching and deposition processes for semiconductor devices. In use, selectively varying either one or both of frequency or power level of electromagnetic radiation applied to the obstacle member varies electrical conductance of the obstacle member, and thereby varies the electrical impedance of the obstacle member to transmission of the RF signal through the waveguide channel. The waveguide assembly may be used for switching, attenuating, routing, filtering, and transforming the RF signal.

A waveguide assembly integrated with a semiconductor wafer is provided. The waveguide assembly includes a waveguide channel defined by internal walls of the wafer lined with a metallic layer, and having at least one port for transmission of the RF signal into or out of the waveguide channel. The waveguide assembly also includes a semiconductor obstacle member disposed in the waveguide channel. The waveguide assembly may be fabricated using etching and deposition processes for semiconductor devices. In use, selectively varying either one or both of frequency or power level of electromagnetic radiation applied to the obstacle member varies electrical conductance of the obstacle member, and thereby varies the electrical impedance of the obstacle member to transmission of the RF signal through the waveguide channel. The waveguide assembly may be used for switching, attenuating, routing, filtering, and transforming the RF signal.

According to one embodiment, an electromagnetic wave attenuator includes a stacked member including a first planar portion. The first planar portion includes a first stacked body. The first stacked body includes a plurality of non-magnetic layers including Cr and Ti, and a plurality of first magnetic layers. A direction from one of the first magnetic layers to an other one of the first magnetic layers is along a first direction. One of the non-magnetic layers is between the one of the first magnetic layers and the other one of the first magnetic layers. The one of the first non-magnetic layers includes an amorphous region. The one of the first magnetic layers and the other one of the first magnetic layers include a crystal region.

An array antenna (100) having a layered configuration. The array antenna comprises a radiation layer (110) comprising a plurality of radiation elements (111) and a distribution layer (120) facing the radiation layer. The distribution layer is arranged to distribute a radio frequency, RF, signal to the plurality of radiation elements. The distribution layer comprises at least one distribution layer feed (121) and at least one first waveguide (122) arranged to guide the RF signal between at least one distribution layer feed and at least one radiation element. The array antenna further comprises at least a second waveguide (130) connected to at least one distribution layer feed (121). Any of the first (122) and the second (130) waveguides comprises plastics with a first type of surface treatment (313), where the first type of surface treatment comprising metallization. At least one radiation element is a dummy element terminated by an attenuation section, where the attenuation section is arranged on any of the waveguides (122, 130) connected to the dummy element and that comprises plastics. The attenuation section comprises a second type of surface treatment (314) arranged to attenuate the RF signal.

The present disclosure provides a tunable waveguide attenuator comprising a base structure with a bottom wall, a first side wall, and a second side wall, wherein the first side wall and the second side wall are arranged on opposite sides of the bottom wall, and wherein the bottom wall, the first side wall, and the second side wall enclose a hollow waveguide channel on three sides. The tunable waveguide attenuator further comprises a movable cover for the hollow waveguide channel that on a surface facing the bottom wall comprises a first section and a second section with different surface loss properties, wherein the movable cover is movable such that the area of the hollow waveguide channel that is covered by the first section and the second section changes with the movement of the movable cover.