Techniques for facilitating reduced thermal resistance attenuator on high-thermal conductivity substrates for quantum applications are provided. A device can comprise a substrate that provides a thermal conductivity level that is more than a defined thermal conductivity level. The device can also comprise one or more grooved transmission lines formed in the substrate. The one or more grooved transmission lines can comprise a powder substance. Further, the device can comprise one or more copper heat sinks formed in the substrate. The one or more copper heat sinks can provide a ground connection. Further, the one or more copper heat sinks can be formed adjacent to the one or more grooved transmission lines.

The present disclosure provides a signal conditioner, an antenna device and a manufacturing method. The signal conditioner includes: a microstrip line including a first portion and a second portion; an insulating layer including a first insulating layer covering the first portion; at least one electrode; a liquid crystal layer covering the microstrip line, the insulating layer, and the at least one electrode; and a common electrode line. A first end of the first portion is connected to a first end of the second portion. A second end of the first portion is connected to a second end of the second portion. The at least one electrode includes a first electrode on a side of the first insulating layer facing away from the first portion. The common electrode line is on a side of the liquid crystal layer facing away from the microstrip line.

Techniques for facilitating reduced thermal resistance attenuator on high-thermal conductivity substrates for quantum applications are provided. A device can comprise a substrate that provides a thermal conductivity level that is more than a defined thermal conductivity level. The device can also comprise one or more grooved transmission lines formed in the substrate. The one or more grooved transmission lines can comprise a powder substance. Further, the device can comprise one or more copper heat sinks formed in the substrate. The one or more copper heat sinks can provide a ground connection. Further, the one or more copper heat sinks can be formed adjacent to the one or more grooved transmission lines.

A low-profile passive slide screw load pull tuner is used on-wafer, especially in millimeter-wave frequencies from 25 to 110 GHz and above. It uses special rotating tuning probes insertable in a short slabline mounted inside the tuner housing, which holds the control gear. The tuner is mounted at an angle matching the angle of the wafer-probe, is connected directly of the wafer-probe and ensures optimum reflection factor tuning range.

A time and frequency domain signal conditioning device including one or more signal terminals, one or more rails, and a passive signal conditioning means for reducing a switching noise jitter signature present in an output signal of a feedback control loop circuitry with a plurality of noise carrying jittering ramps is disclosed. The passive signal conditioning means including the rails is characterized by a set of specified characteristics to condition pre-existing noise amplitude and slopes of the output signal such that the conditioned output signal cooperates with the feedback control loop circuitry. As a consequence, the switching noise jitter signature which is produced by transient noise displacement or noise perturbation in the time domain when the output signal jitters can be reduced in the output of the feedback control loop circuitry.

A variable attenuator is an attenuator which is formed by coupling two transmission lines having an electrical length of λ/4 corresponding to a wavelength λ of an input signal, has one end of one transmission line as an input terminal, has the other end of the one transmission line as a through terminal, has one end of the other transmission line as a coupling terminal and has the other end of the other transmission line as an output terminal, wherein the variable attenuator has a resistor pair having the same impedance at both the through terminal and the coupling terminal, and has a resistor pair having the same impedance at both the input terminal and the output terminal.

A laminated circuit assembly for filtering signals in one or more signal lines in, for instance, a quantum computing system is provided. In one example, the laminated circuit assembly includes one or more signal lines disposed within a substrate in a first direction. The laminated circuit assembly includes a dielectric portion of the substrate. The laminated circuit assembly includes a filter portion of the substrate extending in a first direction and containing a frequency absorbent material providing less attenuation to a first signal of a first frequency than to a second signal of a second, higher frequency. The filter portion is configured to attenuate infrared signals passing through the one or more signal lines.

A tunable frequency selective limiter is disclosed. In one or more embodiments, the tunable frequency selective limiter includes a first electrically conductive path. The tunable frequency selective limiter also includes a ferrimagnetic layer disposed adjacent to the first electrically conductive path. The tunable frequency selective limiter further includes a second electrically conductive path coiled around the first electrically conductive path and the ferrimagnetic layer. An electromagnetic current transmitting through the second electrically conductive path produces a magnetic field coupled to the ferrimagnetic layer. The tunable frequency selective limiter further includes a dielectric layer, wherein the ferrimagnetic layer is disposed on the dielectric layer. The portions of the second electrically conductive path that are at the interface of the dielectric layer and the ferrimagnetic layer may be embedded into the dielectric layer or may be disposed on the surface of the dielectric layer.

The technology described herein is directed towards a cryogenic-stripline microwave attenuator. A first high thermal conductivity substrate such as sapphire and a second high thermal conductivity substrate such as sapphire, along with a signal conductor comprising one or more attenuator lines between the substrates form a stripline. A compression component such as one or more screws, vias (plus clamps) and/or clamps presses the first high thermal conductivity substrate against one side of the signal conductor and presses the second high thermal conductivity substrate against another side of the signal conductor. The high thermal conductivity of the substrates facilitates improved thermalization, while the pressing of the substrates against the conductor reduces the thermal boundary (Kapitza) resistance and thereby, for example, improves thermalization and reduces thermal noise.

A force-controlled-switch comprises a diaphragm spring element and an absorber-plate. The absorber-plate is configured to absorb kinetic energy of the force-controlled-switch. In particular, the absorber-plate absorbs a part of the diaphragm-spring-element's kinetic energy.