A microwave heating device includes a variable frequency microwave power supply, a waveguide launcher, and a fixture to contain a material to be heated, with the fixture located directly adjacent to the end of the launcher. All heating occurs in the near-field region. This condition may be insured by keeping the thickness of the fixture or workpiece under one wavelength (at all microwave frequencies being used). The launcher is preferably a horn or waveguide configured to apply the microwave power to a small area to perform spot curing or repair operations involving adhesives and composites. The spot curing may secure components in place for further handling, after which a thermal or oven treatment will cure the remaining adhesive to develop adequate strength for service.

A power sensor system, assembly and method for use as a power sensor standard in the 50 to 75 GHz frequency range. The power sensing system comprises a housing comprising a dual ridged waveguide impedance transformer, and a resistive component attachable to a back side of the housing. The resistive component comprises a terminating element electrically, but not thermally isolated from a sensing element. The sensing element operates at a constant resistance and is perpendicularly oriented to the terminating element.

An oscilloscope probe includes a tip network, a low-loss signal cable, and a terminating assembly. The tip network is connected to the signal cable and is configured to electrically connect to a device under test via a tip network node. The terminating assembly includes an amplifier, a feedback network and a terminating attenuator. The amplifier has an inverting input, a non-inverting input connected to ground, and an amplifier output configured to connect to an oscilloscope input. The feedback network is connected between the inverting input and the amplifier output. The terminating attenuator includes a first loop circuit and a second loop circuit. The first loop circuit is provided between the signal cable and the inverting input of the amplifier. The second loop circuit is provided between the signal cable, and ground. Resistance of terminating resistors in the loop circuits are selected to match characteristic impedance of the signal cable.

An oscilloscope probe includes a tip network, a low-loss signal cable, and a terminating assembly. The tip network is connected to the signal cable and is configured to electrically connect to a device under test via a tip network node. The terminating assembly includes an amplifier, a feedback network and a terminating attenuator. The amplifier has an inverting input, a non-inverting input connected to ground, and an amplifier output configured to connect to an oscilloscope input. The feedback network is connected between the inverting input and the amplifier output. The terminating attenuator includes a first loop circuit and a second loop circuit. The first loop circuit is provided between the signal cable and the inverting input of the amplifier. The second loop circuit is provided between the signal cable, and ground. Resistance of terminating resistors in the loop circuits are selected to match characteristic impedance of the signal cable.

A microwave heating device includes a variable frequency microwave power supply, a waveguide launcher, and a fixture to contain a material to be heated, with the fixture located directly adjacent to the end of the launcher. All heating occurs in the near-field region. This condition may be insured by keeping the thickness of the fixture or workpiece under one wavelength (at all microwave frequencies being used). The launcher is preferably a horn or waveguide configured to apply the microwave power to a small area to perform spot curing or repair operations involving adhesives and composites. The spot curing may secure components in place for further handling, after which a thermal or oven treatment will cure the remaining adhesive to develop adequate strength for service. A related method is also disclosed.

The present application discloses embodiments that relate to a radar system. The embodiments may include a plurality of radiating waveguides each having a waveguide input. The embodiments also include an attenuation component, which can be located on a circuit board. The embodiments further include a beamforming network. The beamforming network includes a beamforming network input. The beamforming network also includes a plurality of beamforming network outputs, where each beamforming network output is coupled to one of the waveguide inputs. Additionally, the beamforming network includes a coupling port, wherein the coupling port is configured to couple at least one waveguide of the system to a component external to the waveguide.

A coaxial power sensor assembly configured to provide a broadband matched termination utilizing coplanar waveguide topology while simultaneously providing a source of heat energy for a surface mount chip thermistor element to measure applied input power. The coaxial thermal power sensor is comprised of a thin film resistive device on a dielectric substrate and a surface mount chip thermistor element placed in close planar proximity to the resistive device in order to maximize the heat flux via a closely coupled thermal path to the thermistor and alter the bias current through the resistance to be measured. The power sensor is intended to function from DC to 70 GHz, but the same should not be construed as a limitation.

An integrated spring mounted chip termination for converting energy of a circuit into heat to be absorbed by a heatsink. The integrated spring mounted chip termination includes an input tab configured to connect to the circuit. The integrated spring mounted chip termination also includes a chip termination having a top surface. The chip termination includes an input contact located on the top surface and configured to connect to the input tab, a resistor element located on the top surface and connected to the input contact, and a ground contact located on the top surface and connected to the resistor element. The integrated spring mounted chip termination also includes a formed ground spring connected to the ground contact of the chip termination, the formed ground spring configured to attach the chip termination to the heatsink, such that the chip termination and the heatsink are in contact.

An integrated spring mounted chip termination for converting energy of a circuit into heat to be absorbed by a heatsink. The integrated spring mounted chip termination includes an input tab configured to connect to the circuit. The integrated spring mounted chip termination also includes a chip termination having a top surface. The chip termination includes an input contact located on the top surface and configured to connect to the input tab, a resistor element located on the top surface and connected to the input contact, and a ground contact located on the top surface and connected to the resistor element. The integrated spring mounted chip termination also includes a formed ground spring connected to the ground contact of the chip termination, the formed ground spring configured to attach the chip termination to the heatsink, such that the chip termination and the heatsink are in contact.

A power coupler includes an input port, first and second output ports and an antenna element that is electrically coupled between the first output port and the second output port or that is electrically coupled to an isolation port of the power coupler. The power coupler is configured to split a radio frequency signal incident at the input port and/or to combine radio signals incident at the respective first and second output ports.