H01P1/36

INDIUM CONTAINING MAGNETIC GARNET MATERIALS
20220406499 · 2022-12-22 ·

Disclosed are embodiments of synthetic garnet materials for use in radiofrequency applications. In some embodiments, increased amounts of gadolinium can be added into specific sites in the crystal structure of the synthetic garnet by incorporating indium, a trivalent element. By including both indium and increased amounts of gadolinium, the dielectric constant can be improved. Thus, embodiments of the disclosed material can be advantageous in both above and below resonance applications, such as for isolators and circulators.

Temperature insensitive dielectric constant garnets

Embodiments of synthetic garnet materials having advantageous properties, especially for below resonance frequency applications, are disclosed herein. In particular, embodiments of the synthetic garnet materials can have high Curie temperatures and dielectric constants while maintaining low magnetization. These materials can be incorporated into isolators and circulators, such as for use in telecommunication base stations.

Temperature insensitive dielectric constant garnets

Embodiments of synthetic garnet materials having advantageous properties, especially for below resonance frequency applications, are disclosed herein. In particular, embodiments of the synthetic garnet materials can have high Curie temperatures and dielectric constants while maintaining low magnetization. These materials can be incorporated into isolators and circulators, such as for use in telecommunication base stations.

Integrated microstrip and substrate integrated waveguide circulators/isolators formed with co-fired magnetic-dielectric composites

Disclosed are embodiments of microstrip and substrate integrated waveguide circulators/isolators which can be integrated with a substrate. This composite structure can serve as a platform for other components, allowing for improved miniaturization of components. Embodiments of the disclosure can be particular advantageous in the high frequency ranges, such as above 1.8 GHz or above 3 GHz, which allows devices to be used in the 5G space.

Integrated microstrip and substrate integrated waveguide circulators/isolators formed with co-fired magnetic-dielectric composites

Disclosed are embodiments of microstrip and substrate integrated waveguide circulators/isolators which can be integrated with a substrate. This composite structure can serve as a platform for other components, allowing for improved miniaturization of components. Embodiments of the disclosure can be particular advantageous in the high frequency ranges, such as above 1.8 GHz or above 3 GHz, which allows devices to be used in the 5G space.

SPREAD SPECTRUM MODULATION TECHNIQUE FOR ISOLATION DEVICES

A device includes a transformer having primary windings and secondary windings, and a transmit circuit coupled to the primary windings. The transmit circuit is configured to receive an input signal, and provide a carrier signal to the primary windings responsive to the input signal. The device also includes a receive circuit coupled to the secondary windings. The receive circuit is configured to receive the carrier signal from the secondary windings, and provide an output signal responsive to the carrier signal. The receive circuit includes a variable capacitor coupled in parallel to the secondary windings, and a spread spectrum modulation circuit configured to modulate a capacitance of the variable capacitor.

SPREAD SPECTRUM MODULATION TECHNIQUE FOR ISOLATION DEVICES

A device includes a transformer having primary windings and secondary windings, and a transmit circuit coupled to the primary windings. The transmit circuit is configured to receive an input signal, and provide a carrier signal to the primary windings responsive to the input signal. The device also includes a receive circuit coupled to the secondary windings. The receive circuit is configured to receive the carrier signal from the secondary windings, and provide an output signal responsive to the carrier signal. The receive circuit includes a variable capacitor coupled in parallel to the secondary windings, and a spread spectrum modulation circuit configured to modulate a capacitance of the variable capacitor.

Magnetic materials with high curie temperatures and dielectric constants

Disclosed herein are ceramic materials, such as bismuth substituted garnets, which can have high curie temperatures and high dielectric constants. In certain implementations, indium can be incorporated into the ceramic to improve certain properties and to avoid calcium compensation. The ceramic materials disclosed herein can be particular advantageous for below resonance applications.

Magnetic materials with high curie temperatures and dielectric constants

Disclosed herein are ceramic materials, such as bismuth substituted garnets, which can have high curie temperatures and high dielectric constants. In certain implementations, indium can be incorporated into the ceramic to improve certain properties and to avoid calcium compensation. The ceramic materials disclosed herein can be particular advantageous for below resonance applications.

Low-field Assembled Isolator
20220294094 · 2022-09-15 ·

The present invention discloses a low-field assembled isolator, which includes a rectangular body, wherein the body includes an upper cavity and a lower cavity which are connected in a stacked manner; gaps are formed in four side surfaces of the body through the joint surfaces of the upper cavity and the lower cavity respectively; and the isolator further includes a U-shaped magnetic circuit cover plate and two L-shaped magnetic circuit baffles; and the two L-shaped magnetic circuit baffles are respectively disposed at two corners, away from the vertical plate, of the body so as to seal the joint between two adjacent gaps. The gaps at the joint of the upper cavity and the lower cavity are effectively and fully sealed, thereby effectively preventing signal leakage and improving the performance of the low-field assembled isolator.