A novel and useful a single layer RFIC/MMIC structure including a package and related redistribution layer (RDL) based low loss grounded coplanar transmission line. The structure includes a package molded around an RF circuit die with a single redistribution layer (RDL) fabricated on the surface thereof mounted on an RF printed circuit board (PCB) via a plurality of solder balls. Coplanar transmission lines are fabricated on the RDL to conduct RF output signals from the die to PCB signal solder balls. The signal trace transition to the solder balls are funnel shaped to minimize insertion loss and maximize RF isolation between channels. A conductive ground shield is fabricated on the single RDL and operative to shield the plurality of coplanar transmission lines. The ground shield is electrically connected to a ground plane on the PCB via a plurality of ground solder balls arranged to surround the plurality of coplanar RF transmission lines and signal solder balls, and are operative to couple the ground shield to the ground plane on the PCB and provide an electrical return path for the plurality of coplanar transmission lines. Ground vias on the printed circuit board can be either located under the ground solder balls or between them.

Systems and methods for isolating radio frequency (RF) signals in high frequency circuit assemblies, including but not limited to 5G communication systems, are provided. The circuit assemblies include an RF suppression structure, which can be in the form of a low ohm resistor, that extends across a transmission line, and that has contacts that are electrically joined to a ground plane. Alternatively or in addition, the circuit assemblies include a low ohm resistor that extends over a transition between a signal via and an end of a transmission line, and that has contacts that are electrically joined to a ground plane. A circuit assembly as disclosed herein can further include multiple low ohm resistors spaced apart from one another by a distance that is a fraction of a wavelength of a highest frequency signal carried by the transmission line.

A radio frequency (RF) device includes a chip comprising a plurality of vias and at least a hot via; a signal lead and a ground lead disposed under a back side of the chip; and a signal metal sheet, a first ground metal sheet and a second ground metal sheet disposed on a top side of the chip. The signal metal sheet crosses over the first gap formed between the signal lead and the ground lead. The first ground metal sheet and the second ground metal sheet are coupled to the ground lead through the plurality of vias. The first ground metal sheet and the second ground metal sheet substantially surround the signal metal sheet.

Miniature slow-wave transmission lines are described having an asymmetrical ground configuration. In some embodiments, the asymmetrical ground configuration facilitates a reduction in size. Non-uniform auxiliary conductors may be disposed above or below the co-planar waveguide to facilitate a reduction in the length of the miniature slow-wave transmission lines. Phase shifters may be implemented having a reduced size by including one or more miniature slow-wave transmission lines.

An apparatus includes a signal splitter configured to receive an input signal for transmission and to split the input signal to form two or more sub-signals. The apparatus further includes a first amplifier configured to generate a first amplified sub-signal, a second amplifier configured to generate a second amplified sub-signal, a first launcher coupled to the first amplifier and to a waveguide, and a second launcher coupled to the second amplifier and to the waveguide. The first and second launchers are coupled to the waveguide such that a first radiative signal generated by the first launcher responsive to the first amplified sub-signal and a second radiative signal generated by the second launcher responsive to the second amplified sub-signal are combined in the waveguide to form a transmission signal corresponding to the input signal.

A film transmission line according to an embodiment of the present invention includes a dielectric layer, and an electrode line disposed on the dielectric layer. The electrode line has an effective efficiency of 200%/μm or more at a frequency of 5 GHz or more. The film transmission line may be applied to a high frequency thinned antenna and an image display device.

A planar micro-electromechanical system (MEMS)-based phase shifter is described which comprises a dielectric substrate, a grounded coplanar waveguide (GCPW) transmission line for carrying input and output signals, a high-resistivity silicon (HRS) slab coated with metallic gratings over the GCPW line, and a MEMS actuator for adjusting a distance between the HRS slab and the GCPW line to provide a phase shift.

Various examples related to metaconductor based skins and transmission lines are provided. In one example, a flexible metaconductor skin includes a flexible substrate; at least one layer of non-ferromagnetic metal disposed on the flexible substrate; and a layer of ferromagnetic metal disposed on the at least one layer of non-ferromagnetic metal. The flexible metaconductor skin can be used as a multi-layer coplanar waveguide (CPW) transmission line.

A coplanar waveguide transmission line and a design method thereof are provided. The coplanar waveguide transmission line includes a first dielectric substrate, a center conductor strip, and two ground conductor strips. The first dielectric substrate has a first surface and a second surface opposite to each other. The center conductor strip and the ground conductor strips are stacked and fixed to the first surface. The center conductor strip includes a first segment and a second segment. A width of the first segment is greater than a width of the second segment, so that the first segment and the second segment form a step structure. A rectangular groove recessed toward the second surface is defined in the first surface, and a part of the center conductor strip is stacked and fixed to a side, distal from the second surface, of the rectangular groove to form a defected ground structure.

The present invention discloses an improved RF interface board and a laminated assembly having a RF interface board having an inner and an outer part. The laminated assembly includes a dielectric support having a first and a second surfaces and at least a first and a second RF transmission strips disposed on the dielectric support. The first and the second RF transmission strips are electrically isolated from each other, are configured to be connected to a connector at the outer part, and are each configured to be connected to a different conductive element at the inner part. The first RF transmission strip is on the first surface of the dielectric support.