A semiconductor package is provided. The semiconductor package includes a semiconductor die, a stack of polymer layers, redistribution elements and a passive filter. The polymer layers cover a front surface of the semiconductor die. The redistribution elements and the passive filter are disposed in the stack of polymer layers. The passive filter includes a ground plane and conductive patches. The ground plane is overlapped with the conductive patches, and the conductive patches are laterally separated from one another. The ground plane is electrically coupled to a reference voltage. The conductive patches are electrically connected to the ground plane, electrically floated, or electrically coupled to a direct current (DC) voltage.

A communication system includes a transmission line and a reception coupler that couples to the transmission line in an electromagnetic field and moves along the transmission line, wherein the reception coupler has end parts narrower than other parts with respect to a transmission direction of the transmission line.

The invention provides a transmission cable with a main baseline layer and a superimposed line layer. The main baseline layer includes a superimposed part, and a non-superimposed part. The superimposed line layer and the superimposed part form an unbendable part; the non-superimposed part forms a bendable par. The main baseline layer includes a first grounding layer, a first base layer stacked, a signal line layer, and a second base layer. The superimposed line layer includes a third base layer and a second grounding layer. The bendable part is small in thickness, so that the transmission cable provided by the invention has good bending performance, thereby improving the practicability of the transmission cable and prolonging the service life of the transmission cable.

Disclosed herein are dual-spiral common-mode filters, printed circuit boards (PCBs) comprising such dual-spiral common-mode filters, and devices comprising such dual-spiral common-mode filters and PCBs. A dual-spiral common-mode filter is patterned into the reference plane of a PCB. The dual-spiral common-mode filter comprises a first spiral portion connected to a second spiral portion. The spiral portions may be substantially identical, or mirror images of each other, or different from each other. One or more signal traces in a signal trace layer of the PCB pass over the dual-spiral common-mode filter. The disclosed dual-spiral common-mode filters can replace both conventional patterned ground structure (PGS) filters used for radio-frequency interference mitigation and the cutouts often used in the reference plane of a PCB to mitigate impedance mismatches due to DC blocking capacitors. Also disclosed herein are methods of making PCBs that include dual-spiral common-mode filters.

A stacked, multi-layer transmission line is provided. The stacked transmission line includes at least a pair of conductive traces, each conductive trace having a plurality of conductive stubs electrically coupled thereto. The stubs are disposed in one or more separate spatial layers from the conductive traces.

Embodiments of the invention may include a mm-wave waveguide. In an embodiment, the mm-wave waveguide may include a first dielectric waveguide and a second dielectric waveguide. A conductive layer may be used to cover the first dielectric waveguide and the second dielectric waveguide in some embodiments. Furthermore, embodiments may include a repeater communicatively coupled between the first dielectric waveguide and the second dielectric waveguide. In an embodiment, the repeater may be an active repeater or a passive repeater. According to an embodiment, a passive repeater may be integrated within the dielectric waveguide. The passive repeater may include a dispersion compensating material that produces a dispersion response in a signal that is substantially opposite to a dispersion response produced when the signal is propagated along the dielectric waveguide.

One embodiment can provide a method and system for compensating for timing skew in a differential pair transmission line on a printed circuit board (PCB). During operation, the system obtains a PCB comprising one or more layers and at least a differential pair transmission line. The differential pair transmission line comprises first and second transmission lines, with a respective transmission line coupled to at least one via extending through the one or more layers of the PCB. The system determines a difference in length between first and second transmission lines and determines a stub length of the at least one via based on the determined difference in length between the first and second transmission lines, thereby compensating for the time skew in the differential pair transmission line.

An adiabatic coaxial cable connector includes a chassis, and a planar transmission line within the chassis and having first and second ends. The coaxial cable connector further includes a first coaxial-to-planar transition within the chassis and connected to the first end of the planar transmission line, and a second coaxial-to-planar transition within the chassis and connected to the second end of the planar transmission line.

A semiconductor device includes a first transmission line. The semiconductor device includes a second transmission line. The semiconductor device includes a high-k dielectric material between the first transmission line and the second transmission line, wherein the high-k dielectric material partially covers each of the first transmission line and the second transmission line. The semiconductor device further includes a dielectric material directly contacting the high-k dielectric material, wherein the dielectric material has a different dielectric constant from the high-k dielectric material, and the dielectric material directly contacts each of the first transmission line and the second transmission line.

An electronic device includes a first body and a second body rotatably connected relative to each other through a pivot shaft having a metal portion, the first body including a first motherboard, the second body including a second motherboard; and a radio-frequency transmission line including at least one band-shaped line segment and at least two coplanar waveguide segments, the band-shaped line segment being coupled to the coplanar waveguide segments, in which one band-shaped line segment is located between two coplanar waveguide segments in an extending direction of the radio-frequency transmission line, the one band-shaped line segment is coupled to the pivot shaft to retain stationary relative to the pivot shaft, and the coplanar waveguide segments are spaced apart from the metal portion. The radio-frequency transmission line has a first end coupled to the first motherboard, and a second end coupled to the second motherboard.