A conductor in a laminar structure, such as a printed circuit board or thin-film stack, is closely flanked by at least one open trench filled with an ambient medium (e.g., air, another gas, vacuum) of a lower dielectric loss than the conductor's surrounding dielectric. The trench may be made by any suitably precise method such as laser scribing, chemical etching or mechanical displacement. A thin layer of dielectric may be left on the sides of the conductor to prevent oxidation or other reactions that may reduce conductivity. When the conductor carries a signal, part of an electric and/or magnetic field that would ordinarily travel through the surrounding dielectric encounters the low-loss ambient medium (e.g. air) in the trench. The effective dielectric loss surrounding the conductor is lowered, reducing signal attenuation and crosstalk, particularly at high frequencies.

A conductor in a laminar structure, such as a printed circuit board or thin-film stack, is closely flanked by at least one open trench filled with an ambient medium (e.g., air, another gas, vacuum) of a lower dielectric loss than the conductor's surrounding dielectric. The trench may be made by any suitably precise method such as laser scribing, chemical etching or mechanical displacement. A thin layer of dielectric may be left on the sides of the conductor to prevent oxidation or other reactions that may reduce conductivity. When the conductor carries a signal, part of an electric and/or magnetic field that would ordinarily travel through the surrounding dielectric encounters the low-loss ambient medium (e.g. air) in the trench. The effective dielectric loss surrounding the conductor is lowered, reducing signal attenuation and crosstalk, particularly at high frequencies.

A wire bundle includes insulated wires. The insulated wires each includes a conductor core covered with an insulator and is quad-twisted to form the wire bundle. The wire bundle has an annular shape including an inner perimeter and an outer perimeter in a cross section perpendicular to an axis line of the wire bundle. A shape of the outer perimeter is a square or a quasi-square. The quasi-square is a shape formed by curving at least one side of a square to a radial inside direction of the annular shape in the cross section. The insulated wires each has, in the cross section, a shape connecting a plurality of vertexes including two adjacent vertexes of the square or the quasi-square and two vertexes present on the inner perimeter.

A two-core flat cable includes a pair of metal wires, an insulating covering that bundles and covers the pair of metal wires along a longitudinal direction thereof, the insulating covering having an oval cross-sectional shape, an electrically conductive shield that is in direct contact with the covering along an entire perimeter of the covering so as to cover the covering, and an insulating sheath that covers the shield.

Embodiments of the present invention are directed to providing a time delay to a shortened trace in a differential microstrip trace pair. By adding back metal to a ground plane associated with a DC blocking capacitor, a time delay can be added to the shortened trace. The cutout associated with the longer trace remains unaltered. In a further embodiment, both cutouts can be modified with the addition of metal, with the cutout associated with the shorter trace receiving more metal than the other cutout. In a further embodiment of the present invention, a cutout associated with a connector can be modified to add back metal in the cutout. The cutout associated with the shorter trace is modified while the other cutout is left unchanged.

A multilayer substrate includes an insulator that includes a first region and a second region that is thinner than the first region, and a first signal line and a second signal line that are structured to extend across the first region and the second region. In a region in which the first signal line and the second signal line face each other, a line width of the first signal line and a line width of the second signal line are smaller in the second region than in the first region, and a distance between the first signal line and the second signal line is smaller in the second region than in the first region.

A conductor in a laminar structure, such as a printed circuit board or thin-film stack, is closely flanked by at least one open trench filled with an ambient medium (e.g., air, another gas, vacuum) of a lower dielectric loss than the conductor's surrounding dielectric. The trench may be made by any suitably precise method such as laser scribing, chemical etching or mechanical displacement. A thin layer of dielectric may be left on the sides of the conductor to prevent oxidation or other reactions that may reduce conductivity. When the conductor carries a signal, part of an electric and/or magnetic field that would ordinarily travel through the surrounding dielectric encounters the low-loss ambient medium (e.g. air) in the trench. The effective dielectric loss surrounding the conductor is lowered, reducing signal attenuation and crosstalk, particularly at high frequencies.

This disclosure relates generally to an electronic assembly and method having a first electrical connection point and a second electrical connection point and a differential interconnect coupling the first electrical connection point to the second electrical connection point, the differential interconnect including first and second transmission traces including a interior edges and a exterior edges opposite the interior edges, the second interior edge facing the first interior edge, and stub traces, each stub trace coupled to one of the first and second transmission traces and projecting from one of the first interior edge, the first exterior edge, the second interior edge, and the second exterior edge. A substantially equal number of stub traces project from the first exterior edge and the second exterior edge. At least twice as many stub traces project from the first and second exterior edges as project from the first and second interior edges.

A communication device is provided wherein a number of the pairs of transmission lines is N, each pair of the transmission lines comprises (N1) stages of sub-transmission lines generating a same amount of crosstalk as that caused at a connector, and (N1) stages of connecting portions comprise a transmission path of the connector and a first stage sub-transmission line, and (N1) stages of the connecting portions to connect an i th stage sub-transmission line and an (i+1) th stage sub-transmission line by the straight/cross connection, and wherein each pair of the transmission lines is different in all pairs in a number of the connecting portion having the cross connection; and as a j th stage connecting portion in any one pair of the transmission lines has cross connection, a (Nj) th stage connecting portion in the any one pair of the transmission lines also has cross connection.