Patent classifications
H01P3/08
SIGNAL TRANSMISSION LINE AND METHOD FOR MANUFACTURING SIGNAL TRANSMISSION LINE
A conductor non-formed portion where no conductor layer exists is provided in a first ground conductor layer. A multilayer body is provided with a void where no insulating resin exists. At least a portion of the conductor non-formed portion is provided in a first area positioned at a right of a first interlayer connection conductor with respect to a multilayer body left-right direction and at left of a second interlayer connection conductor with respect to the multilayer body left-right direction in a view in a multilayer body downward direction. At least a portion of a void overlaps with the conductor non-formed portion in the view in the multilayer body downward direction and is provided above a first signal conductor layer with respect to a multilayer body up-down direction and below the first ground conductor layer with respect to the multilayer body up-down direction.
CIRCUIT BOARD, CIRCUIT BOARD CONNECTION STRUCTURE, AND METHOD OF MANUFACTURING CIRCUIT BOARD CONNECTION STRUCTURE
A circuit board includes a multilayer body including a main surface, a mounted conductor, and a signal conductor at an intermediate position in the lamination direction of the multilayer body, and a ground conductor on the main surface. The multilayer body includes a connection portion including a portion overlapping the mounted conductor and overlapping an external board joined via a conductive joint material through use of the mounted conductor, and a circuit portion. A first region, which is the region of a circuit portion of the ground conductor, includes opening holes and a second region, which is the region of a connection portion of the ground conductor, includes opening holes. The ratio of the opening area of the opening holes to that of the second region is larger than the ratio of the opening area of the opening holes to that of the first region.
CIRCUIT BOARD, CIRCUIT BOARD CONNECTION STRUCTURE, AND METHOD OF MANUFACTURING CIRCUIT BOARD CONNECTION STRUCTURE
A circuit board includes a multilayer body including a main surface, a mounted conductor, and a signal conductor at an intermediate position in the lamination direction of the multilayer body, and a ground conductor on the main surface. The multilayer body includes a connection portion including a portion overlapping the mounted conductor and overlapping an external board joined via a conductive joint material through use of the mounted conductor, and a circuit portion. A first region, which is the region of a circuit portion of the ground conductor, includes opening holes and a second region, which is the region of a connection portion of the ground conductor, includes opening holes. The ratio of the opening area of the opening holes to that of the second region is larger than the ratio of the opening area of the opening holes to that of the first region.
APPARATUS, SYSTEM, AND METHOD FOR ACHIEVING IMPROVED GROUND STATION DESIGN
A radio-frequency device comprising (1) a ceramic component that forms a hole and (2) a connector coupled to the ceramic component, wherein the connector comprises an electrically conductive pin that at least partially extends into the hole formed in the ceramic component. Various other apparatuses, systems, and methods are also disclosed.
APPARATUS, SYSTEM, AND METHOD FOR ACHIEVING IMPROVED GROUND STATION DESIGN
A radio-frequency device comprising (1) a ceramic component that forms a hole and (2) a connector coupled to the ceramic component, wherein the connector comprises an electrically conductive pin that at least partially extends into the hole formed in the ceramic component. Various other apparatuses, systems, and methods are also disclosed.
Liquid crystal phase shifter and antenna where effective lengths are different between an input feed terminal and multiple output feed terminals
Embodiments of the present disclosure provide a liquid crystal phase shifter and an antenna, which relate to the field of electromagnetic waves and can adjust carrier frequencies applicable to the liquid crystal phase shifter, improving compatibility of the liquid crystal phase shifter. The liquid crystal phase shifter includes at least one phase-shifting unit. The phase-shifting unit includes a microstrip line and a phase-controlled electrode, the microstrip line includes a plurality of sub-microstrip lines, each sub-microstrip line includes two ends and a transmission portion connected between the two ends, and any two adjacent sub-microstrip lines share one end. The phase-shifting unit further includes feed terminals located on a side of the first substrate facing away from the second substrate or on a side of the second substrate facing away from the first substrate, and each of the feed terminals overlaps the corresponding end respectively.
Millimeter wave module including first and second conductor patterns connected by first and second conductive members extending through an insulating substrate and methods of manufacture
Signal conductor patterns (21, 31) are respectively formed on a first main surface (101) and a second main surface (102) of an insulating substrate (100). Ground conductor patterns (222, 322) are formed on the first main surface (101) and the second main surface (102). A first conductive member (41) is formed in the insulating substrate (100) and electrically connects the signal conductor patterns (21, 31) in the thickness direction. A second conductive member (42) is formed in the insulating substrate (100) and connected to the ground conductor patterns (222, 322). A dielectric member (43) is disposed between the first conductive member (41) and the second conductive member (42), is in contact with the first conductive member (41) and the second conductive member (42), and has a dielectric constant different from the dielectric constant of the insulating substrate (100).
Millimeter wave module including first and second conductor patterns connected by first and second conductive members extending through an insulating substrate and methods of manufacture
Signal conductor patterns (21, 31) are respectively formed on a first main surface (101) and a second main surface (102) of an insulating substrate (100). Ground conductor patterns (222, 322) are formed on the first main surface (101) and the second main surface (102). A first conductive member (41) is formed in the insulating substrate (100) and electrically connects the signal conductor patterns (21, 31) in the thickness direction. A second conductive member (42) is formed in the insulating substrate (100) and connected to the ground conductor patterns (222, 322). A dielectric member (43) is disposed between the first conductive member (41) and the second conductive member (42), is in contact with the first conductive member (41) and the second conductive member (42), and has a dielectric constant different from the dielectric constant of the insulating substrate (100).
TRANSMISSION LINE
A transmission line. The transmission line includes a reference electrode. The transmission line also includes a stripline. The stripline meanders within a plane. The stripline has a non-planar profile when viewed along a direction parallel to the plane.
Transmission line and quantum computer
A transmission line has a first conductor layer extending in a first direction, a second conductor layer disposed on a side of a first surface of the first conductor layer via a first dielectric layer, the second conductor layer extending in the first direction, and a third conductor layer disposed on a side of a second surface of the first conductor layer opposite to the first surface, via a second dielectric layer, the third conductor layer extending in the first direction, wherein a width, in a second direction intersecting the first direction, of each of the second conductor layer and the third conductor layer is different at a plurality of locations in the first direction, and the first conductor layer, the second conductor layer, and the third conductor layer at least partially overlap each other in a plan view from a normal direction of the first surface.