This document describes techniques, apparatuses, and systems utilizing a high-isolation transition design for differential signal ports. A differential input transition structure includes a first layer and a second layer made of a conductive metal and a substrate positioned between the first and second layers. The second layer includes a first section that electrically connects to a single-ended signal contact point and to a first contact point of a differential signal port. The first section includes a first stub based on an input impedance of the single-ended signal contact point and a second stub based on a differential input impedance associated with the differential signal port. The second layer includes a second section that electrically connects to a second contact point of the differential signal port and to the first layer through a via housed in a pad. The second section includes a third stub associated with the differential input impedance.

A substrate integrated waveguide (SIW) cavity antenna is described that enables dual frequency and broadband operation, as well as enhanced protection from radio frequency interference (RFI) that may be present within an electronic device environment. The SIW cavity antenna includes a capacitively-coupled feed that is disposed within the volume of the SIW cavity antenna, which is enclosed on four sides via a set of electrically-conductive plates. The SIW cavity antenna radiates using the remaining two open sides as apertures. The SIW cavity antenna may include a meander line radiator to facilitate the operation of a second frequency band, as well as the use of a tuning stub to further enhance the impedance bandwidth.

Provided is a waveguide connection structure 1 in which two waveguides 10 and 20 respectively formed with waveguide paths 11 and 21 face each other, in which a choke groove 25 having a depth corresponding to a leakage prevention target frequency is provided, at the end face 20a of the waveguide 20, in a band-shaped region whose center is a center of the waveguide path 21, and which is bounded by an inner ellipse and an outer ellipse, the minor radius of the outer ellipse is longer than the minor radius of the inner ellipse by a length corresponding, and the choke groove 25 includes two groove portions 25a and 25b that are in contact with the inner ellipse and the outer ellipse and are located on the longer side of the rectangle, in the band-shaped region.

A millimeter wave apparatus, with a substrate, a transceiver in a first fixed position relative to the substrate, and a gas cell in a second fixed position relative to the substrate. The clock apparatus also comprises at least four waveguides.

In a described example, an apparatus includes a package substrate having a device side surface and a board side surface opposite the device side surface, a physics cell mounted on the device side surface having a first end and a second end, a first opening extending through the package substrate and lined with a conductor, aligned with the first end, a second opening extending through the package substrate and lined with the conductor, aligned with the second end, a millimeter wave transmitter module on the board side, having a millimeter wave transfer structure including a transmission line coupled to an antenna aligned with the first opening, and a millimeter wave receiver module mounted on the board side surface of the package substrate and having a millimeter wave transfer structure including a transmission line coupled to an antenna for receiving millimeter wave signals, aligned with the second opening.

A method of manufacturing a circuit board having waveguides including forming a waveguiding structure by injection molding. The waveguiding structure includes a plurality of waveguides arranged at intervals and at least one connecting portion connecting two adjacent waveguides. Each waveguide includes a waveguiding substrate and at least one protrusion on the waveguiding substrate. The connecting portion is removed to obtain at least two waveguides. A metal layer is formed to wrap the whole outer surface of each waveguide. A plurality of receiving grooves is formed to penetrate a wiring board. Each waveguide wrapped by the metal layer is embedded in one of the receiving grooves. The waveguides and the wiring board are fixed. A portion of the metal layer on a surface of each protrusion facing away from the waveguiding substrate is removed. A circuit board is also provided.

A radar assembly includes a rectangular-waveguide (RWG) and a printed-circuit-board. The rectangular-waveguide (RWG) propagates electromagnetic energy in a transverse electric mode (TE10) and in a first direction. The printed-circuit-board includes a plurality of conductor-layers oriented parallel to each other. The printed-circuit-board defines a substrate-integrated-waveguide (SIW) that propagates the electromagnetic energy in a transverse electric mode (TE10) and in a second direction perpendicular to the first direction, and defines a transition that propagates the electromagnetic energy between the rectangular-wave-guide and the substrate-integrated-waveguide. The transition includes apertures defined by at least three of the plurality of conductor-layers.

An interposer (16) and a substrate (10) incorporating the interposer (16) are provided. The interposer (16) includes one or more layers (18) and a cavity (20) defined in the one or more layers (18), the cavity (20) being configured as a waveguide for propagation of electromagnetic waves.

Microelectronic assemblies that include a lithographically-defined substrate integrated waveguide (SIW) component, and related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a package substrate portion having a first face and an opposing second face; and an SIW component that may include a first conductive layer on the first face of the package substrate portion, a dielectric layer on the first conductive layer, a second conductive layer on the dielectric layer, and a first conductive sidewall and an opposing second conductive sidewall in the dielectric layer, wherein the first and second conductive sidewalls are continuous structures.

A broadband transition coupling for transition between a waveguide and a printed circuit board with a substrate integrated waveguide is disclosed. The broadband transition coupling comprises a main body that encompasses an air-filled waveguide section and a transition section. The air-filled waveguide section comprises a first interface for the waveguide. The transition section provides a second interface for the printed circuit board. The transition section continuously tapers along the second interface in order to reduce a height of the transition section for transition coupling with the printed circuit board. Further, the present disclosure relates to a broadband system for processing electromagnetic signals.