A microwave heating device includes a variable frequency microwave power supply, a waveguide launcher, and a fixture to contain a material to be heated, with the fixture located directly adjacent to the end of the launcher. All heating occurs in the near-field region. This condition may be insured by keeping the thickness of the fixture or workpiece under one wavelength (at all microwave frequencies being used). The launcher is preferably a horn or waveguide configured to apply the microwave power to a small area to perform spot curing or repair operations involving adhesives and composites. The spot curing may secure components in place for further handling, after which a thermal or oven treatment will cure the remaining adhesive to develop adequate strength for service. A related method is also disclosed.

A microwave heating device includes a variable frequency microwave power supply, a waveguide launcher, and a fixture to contain a material to be heated, with the fixture located directly adjacent to the end of the launcher. All heating occurs in the near-field region. This condition may be insured by keeping the thickness of the fixture or workpiece under one wavelength (at all microwave frequencies being used). The launcher is preferably a horn or waveguide configured to apply the microwave power to a small area to perform spot curing or repair operations involving adhesives and composites. The spot curing may secure components in place for further handling, after which a thermal or oven treatment will cure the remaining adhesive to develop adequate strength for service. A related method is also disclosed.

Embodiments disclosed herein include waveguides. In an embodiment, a waveguide comprises a conductive shell and a first ridge within the conductive shell. In an embodiment, the first ridge extends away from the conductive shell. In an embodiment, the waveguide further comprises a first core over the first ridge, where the first core comprises a first dielectric material with a first permittivity. In an embodiment, the waveguide may further comprise a second core embedded in the first core, where the second core comprises a second dielectric material with a second permittivity that is greater than the first permittivity.

Embodiments disclosed herein include waveguides. In an embodiment, a waveguide comprises a conductive shell and a first ridge within the conductive shell. In an embodiment, the first ridge extends away from the conductive shell. In an embodiment, the waveguide further comprises a first core over the first ridge, where the first core comprises a first dielectric material with a first permittivity. In an embodiment, the waveguide may further comprise a second core embedded in the first core, where the second core comprises a second dielectric material with a second permittivity that is greater than the first permittivity.

An apparatus includes a tube including an inner surface, an inner diameter, and a length. The apparatus also includes a coil spring. The coil spring includes an outer surface, an outer diameter, and a plurality of coil elements arranged along a length of the coil spring. The coil spring can be positioned within the tube and the outer diameter of the coil spring can be less than the inner diameter of the tube. The coil spring can form a waveguide. Related methods of manufacture and systems are also described herein.

An apparatus includes a tube including an inner surface, an inner diameter, and a length. The apparatus also includes a coil spring. The coil spring includes an outer surface, an outer diameter, and a plurality of coil elements arranged along a length of the coil spring. The coil spring can be positioned within the tube and the outer diameter of the coil spring can be less than the inner diameter of the tube. The coil spring can form a waveguide. Related methods of manufacture and systems are also described herein.

According to an aspect, a waveguide system includes a first node, a second node, and a double-ridge waveguide. The double-ridge waveguide includes a metallic shell surrounding a waveguide core that forms a communication and radio frequency power transmission path in an aerospace environment. The first node is configured to propagate at least one communication channel and a radio frequency power transmission through the waveguide core to the second node during operation of the waveguide system in the aerospace environment.

Disclosed is a ridge guide waveguide including a conductive base, a conductive ridge protruding upward from the conductive base and extending along a predetermined wave transmission direction, an upper conductive wall located over the conductive base and the conductive ridge and spaced apart from the conductive ridge by a gap, and an electromagnetic bandgap structure arranged adjacent to the conductive ridge between the conductive base and the upper conductive wall.

A rotary-type data transmission device is provided. The rotary-type data transmission includes a first structure having a first surface and a second surface facing each other and including a first metal hollow waveguide including a first through hole passing through the second surface from the first surface in a center portion thereof, a second structure coupled to the first structure to support rotation of the first structure or to support rotation by the first structure, a first transceiver facing the first surface at a certain distance therebetween, coupled to the first structure, and including a first printed circuit board, a first meta waveguide, and a first transceiver, and a second transceiver facing the second surface at a certain distance therebetween, coupled to the second structure, and including a second printed circuit board, a second meta waveguide, and a second transceiver.

A wafer-scale die packaging device is fabricated by providing a high-k glass carrier substrate having a ceramic region which includes a defined waveguide area and extends to a defined die attach area, and then forming, on a first glass carrier substrate surface, a differential waveguide launcher having a pair of signal lines connected to a radiating element that is positioned adjacent to an air cavity and surrounded by a patterned array of conductors disposed over the ceramic region in a waveguide conductor ring. After attaching a die to the glass carrier substrate to make electrical connection to the differential waveguide launcher, a molding compound is formed to cover the die, differential waveguide launcher, and air cavity, and an array of conductors is formed in the molding compound to define a first waveguide interface perimeter surrounding a first waveguide interface interior.