A transition structure disposed in a package is disclosed. The transition structure comprises a first ground lead and a second ground lead; and a signal lead, disposed between the first ground lead and the second ground lead, wherein the first ground lead and the second ground lead have an exterior edge and an interior edge, the signal lead is coupled to a metal line formed on a printed circuit board (PCB) and a signal terminal of the die within the package; wherein an exterior gap formed between the first ground lead and the second ground lead at the exterior edge is wider than an interior gap formed between the first ground lead and the second ground lead at the interior edge.

A connector device of the present disclosure includes two waveguides configured to transmit a radio-frequency signal, a state monitoring unit configured to monitor a connection state of the two waveguides, and a control unit that is provided on a side of the waveguide, which is on a transmission side to transmit a radio-frequency signal, between the two waveguides and that stops transmission of the radio-frequency signal according to the connection state of the two waveguides, the state being monitored by the state monitoring unit.

Disclosed herein is a millimeter-wave dielectric waveguide connector that includes a first connector interface, a second connector interface, a dielectric material exposed at the first connector interface and the second connector interface, and a metal structure around the dielectric material, wherein the metal structure includes a flared portion at the first connector interfacea.

Aspects of the subject disclosure may include, a system that can be configured for generating an electromagnetic wave and coupling the electromagnetic wave to a transmission medium with a reduced loss of radiation of the electromagnetic wave into free space. The system can also be configured to receive an electromagnetic waves form the transmission medium with a reduced loss of radiation of the electromagnetic wave into free space. Other embodiments are disclosed.

The present disclosure provides systems and methods associated with mode conversion for electromagnetic field modification. A mode converting structure (holographic metamaterial) is formed with a distribution of dielectric constants chosen to convert an electromagnetic radiation pattern from a first mode to a second mode to attain a target electromagnetic radiation pattern that is different from the input electromagnetic radiation pattern. A solution to a holographic equation provides a sufficiently accurate approximation of a distribution of dielectric constants that can be used to form a mode converting device for use with one or more transmission lines, such as waveguides. One or more optimization algorithms can be used to improve the efficiency of the mode conversion.

A high-frequency filter consists of a housing, which includes resonators, each of which has at least one dielectric. The n resonators are arranged along a central axis. The n resonators are isolated from one another by at least n1 isolation devices. The n1 isolation devices have coupling openings, through which a coupling is established at a right angle to or with one component predominantly at a right angle to the H field. A first signal line terminal is inserted into the first resonator chamber through a first opening in the housing and is in contact with the respective dielectric there. In addition or alternatively, a second signal line terminal is inserted into the n.sup.th resonator chamber through a second opening in the housing and is in contact with the respective dielectric there.

In accordance with embodiments disclosed herein, there is provided a high-density low-loss cable and connector assembly. A cable assembly includes a first cable connector, a bulk cable section, and a first cable transition section. The bulk cable section includes a first plurality of conductive wires of a first wire thickness. The first cable transition section includes a second plurality of conductive wires that has a first distal end connected to the bulk cable section and a second distal end connected to the first cable connector. Each of the second plurality of conductive wires transitions from the first wire thickness at the first distal end to a second wire thickness that is less than the first wire thickness at the second distal end. Each of the second plurality of conductive wires in the first distal end is connected to a corresponding conductive wire of the first plurality of conductive wires.

Disclosed are devices, systems and methods regarding ceramic-substrate ultra-wideband (UWB) antennas that utilize surface-mount technology (SMT) for installation, integration and connection to external devices, electronics and systems. Numerous configurations are disclosed for elements comprising each antenna. This ensures that the disclosed antennas may be configured in design to address varying performance requirements as well as to optimize performance across portions of the UWB spectrum.

The present disclosure relates to a connector module, a communication circuit board, and an electronic device that are capable of satisfactorily suppressing the leakage of high-frequency electromagnetic waves. The connector module includes an opening and a conductive spring. The opening accepts the insertion of an end of a waveguide that transmits high-frequency electromagnetic waves. The conductive spring locks the waveguide when the waveguide inserted into the opening is pressed toward one inner side surface of the opening. Further, the conductive spring is disposed in a gap between the opening and the waveguide so as to come into contact with the opening and with the waveguide along a direction in which the waveguide transmits the electromagnetic waves. The present technology is applicable, for example, to an electronic device that establishes communication by using millimeter waves.

To provide a multilayer substrate for transmitting/receiving a high frequency signal, the substrate having a simplified configuration and excellent high frequency characteristics. This disclosure pertains to a multilayer substrate provided with: a plurality of dielectric layers laminated together with ground layers interposed therebetween; and a signal line for inputting and outputting a signal, the signal line being formed on the surface of the dielectric layer. The plurality of ground layers include an input-side ground layer part formed in the region on the signal-input side of the signal line, an output-side ground layer part formed in the region on the signal-output side of the signal line, and an intermediate ground layer part formed in the region between the input-side ground layer part and the output-side ground layer part. The input-side ground layer part and the output-side ground layer part each have fewer layers than the intermediate ground layer part.