An interposer layer includes an integral waveguide to facilitate high speed (e.g., greater than 80 GHz) communication between semiconductor dies in a semiconductor package. An interposer layer may include a waveguide member and a dielectric layer disposed adjacent at least a portion of an exterior perimeter of the waveguide member. The waveguide member includes a material having a first relative permittivity. The dielectric member includes a material having a second relative permittivity that is less than the first relative permittivity. The waveguide member and the dielectric member form an interposer layer having an upper surface and a lower surface. A first conductive sheet may be disposed proximate the upper surface of the interposer layer and a second conductive sheet may be disposed proximate the lower surface of the interposer layer.

A component carrier including: i) a layer stack with at least one electrically insulating layer structure and at least one electrically conductive layer structure, ii) a cavity formed in the layer stack, iii) a dielectric element at least partially placed in the cavity, wherein the dielectric element and the layer stack are electromagnetically couple-able, and iv) an electrically insulating connection material between the dielectric element and the layer stack.

Embodiments may relate to an semiconductor package. The semiconductor package may include a die coupled with the face of the package substrate. The semiconductor package may further include a waveguide coupled with the face of the package substrate adjacent to the die, wherein the waveguide is to receive an electromagnetic signal from the die and facilitate conveyance of the electromagnetic signal in a direction parallel to the face of the package substrate. Other embodiments may be described or claimed.

To obtain a downsized dielectric filter suitable for a laminating structure, a dielectric filter is configured with use of a dielectric waveguide formed of a conductor pattern and vias in a laminating direction within a multilayer dielectric substrate, two strip lines formed in a planar direction of the multilayer dielectric substrate, and two strip line-waveguide converters each configured to perform transmission line conversion between the dielectric waveguide and each strip line. In this manner, it is possible to provide a dielectric filter for which an area to be occupied in the planar direction of the multilayer dielectric substrate is suppressed.

According to one aspect of the invention, there is provided a connector for connecting a waveguide and a board, comprising: a first opening part formed in a direction perpendicular to one side of a board and coupled to the one side of the board; a second opening part formed in a direction parallel to a longitudinal direction of a waveguide for signal transmission, wherein the waveguide is capable of being coupled to the second opening part; and a signal guide part connecting the first and second opening parts and including a hollowness surrounded by a conductive layer therein.

Radio frequency (RF) waveguides and related interconnect members are disclosed. The interconnect members can have a smaller footprint than WR15 flanges. Further, the interconnect members can be configured to mate with complementary interconnects without undergoing substantial relative rotation.

Aspects of the subject disclosure may include a generator that facilitates generation of an electromagnetic wave, a core, and a waveguide that facilitates guiding the electromagnetic wave towards the core to induce a second electromagnetic wave that propagates along the core. The core and/or the waveguide can be configured to reduce radiation loss of the second electromagnetic wave, propagation loss of the second electromagnetic wave, or a combination thereof. Other embodiments are disclosed.

Disclosed is a chip-to-chip interface using a microstrip circuit and a dielectric waveguide. A board-to-board interconnection device, according to one embodiment of the present invention, comprises: a waveguide which has a metal cladding and transmits a signal from a transmitter-side board to a receiver-side board; and a microstrip circuit which is connected to the waveguide and has a microstrip-to-waveguide transition (MWT), wherein the microstrip circuit matches a microstrip line and the waveguide, adjusts the bandwidth of a predetermined first frequency band among the frequency bands of the signal, and provides same to the receiver.

A waveguide assembly comprising a first waveguide, and a second waveguide designed as a dielectric multimodal waveguide, and a waveguide transition for transmitting an electromagnetic wave between the first waveguide and the second waveguide, the waveguide transition having a dielectric waveguide piece which is between the first waveguide and the second waveguide. The dielectric waveguide piece is capable of guiding a smaller mode number than the second waveguide, at least in a front section, facing the first waveguide.

A waveguide assembly, comprising an electrical circuit assembly, a dielectric waveguide with a longitudinal axis (A), and a waveguide transition lying therebetween for transmitting an electromagnetic wave between the electrical circuit assembly and the dielectric waveguide. The waveguide transition has a first electrically conductive plate and a second electrically conductive plate which are arranged between the electrical circuit assembly and the dielectric waveguide in an offset manner to each other in the direction of the longitudinal axis (A) of the dielectric waveguide.