Disclosed is an antenna including a radiating element, a co-planar ground plane element and a transmission line extending across at least a portion of the radiating element and the ground plane element. The transmission line includes a dielectric layer. The dielectric layer has a portion of a first major surface adjacent to the ground plane and a second major surface opposite and separated from the first surface. A shield is formed on the second major surface. At least one via extends through the dielectric layer to connect the shield to the ground plane. A feed line extends longitudinally through the dielectric layer from a feed point at a proximal end of the transmission line towards a distal end of the transmission line, the feed line being shielded along a portion of its length extending across the ground plane element by the shield with the distal end of the transmission line lying in register with the radiating element and coupling the feed line to the radiating element.

This document describes techniques, apparatuses, and systems utilizing a high-isolation transition design for differential signal ports. A differential input transition structure includes a first layer and a second layer made of a conductive metal and a substrate positioned between the first and second layers. The second layer includes a first section that electrically connects to a single-ended signal contact point and to a first contact point of a differential signal port. The first section includes a first stub based on an input impedance of the single-ended signal contact point and a second stub based on a differential input impedance associated with the differential signal port. The second layer includes a second section that electrically connects to a second contact point of the differential signal port and to the first layer through a via housed in a pad. The second section includes a third stub associated with the differential input impedance.

This document describes techniques, apparatuses, and systems utilizing a high-isolation transition design for differential signal ports. A differential input transition structure includes a first layer and a second layer made of a conductive metal and a substrate positioned between the first and second layers. The second layer includes a first section that electrically connects to a single-ended signal contact point and to a first contact point of a differential signal port. The first section includes a first stub based on an input impedance of the single-ended signal contact point and a second stub based on a differential input impedance associated with the differential signal port. The second layer includes a second section that electrically connects to a second contact point of the differential signal port and to the first layer through a via housed in a pad. The second section includes a third stub associated with the differential input impedance.

A fluid-cooled balun transformer that includes a substrate plate with a first and an opposite second face, a first and a second conductive element arranged on the first and the second face, respectively, wherein a first and a second signal port electrically is connected to the first and the second conductive element, respectively, and a cooling module, where the second conductive element is transformingly coupled to the first conductive element and electrically isolated therefrom, the cooling module includes a first tubular member, the first tubular member has a fluid inlet to receive a coolant fluid into the first tubular member, a flow channel to conduct a flow of coolant fluid within the first tubular member and a fluid outlet to release the coolant fluid from the first tubular member, and where the flow channel of the first tubular member is arranged in thermal contact with the first conductive element.

A fluid-cooled balun transformer that includes a substrate plate with a first and an opposite second face, a first and a second conductive element arranged on the first and the second face, respectively, wherein a first and a second signal port electrically is connected to the first and the second conductive element, respectively, and a cooling module, where the second conductive element is transformingly coupled to the first conductive element and electrically isolated therefrom, the cooling module includes a first tubular member, the first tubular member has a fluid inlet to receive a coolant fluid into the first tubular member, a flow channel to conduct a flow of coolant fluid within the first tubular member and a fluid outlet to release the coolant fluid from the first tubular member, and where the flow channel of the first tubular member is arranged in thermal contact with the first conductive element.

A semiconductor chip includes a first wireless communication circuit, a second wireless communication circuit, and an auxiliary path. The first wireless communication circuit includes a signal path, wherein the signal path includes a signal node. The second wireless communication circuit includes a mixer and a local oscillator (LO) buffer. The LO buffer is arranged to receive and buffer an LO signal, and is further arranged to provide the LO signal to the mixer. The auxiliary path is arranged to electrically connect the LO buffer to the signal node of the signal path, wherein the LO buffer is reused for a loop-back test function of the first wireless communication circuit through the auxiliary path.

A semiconductor chip includes a first wireless communication circuit, a second wireless communication circuit, and an auxiliary path. The first wireless communication circuit includes a signal path, wherein the signal path includes a signal node. The second wireless communication circuit includes a mixer and a local oscillator (LO) buffer. The LO buffer is arranged to receive and buffer an LO signal, and is further arranged to provide the LO signal to the mixer. The auxiliary path is arranged to electrically connect the LO buffer to the signal node of the signal path, wherein the LO buffer is reused for a loop-back test function of the first wireless communication circuit through the auxiliary path.

Microelectronic assemblies that include a lithographically-defined substrate integrated waveguide (SIW) component, and related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a package substrate portion having a first face and an opposing second face; and an SIW component that may include a first conductive layer on the first face of the package substrate portion, a dielectric layer on the first conductive layer, a second conductive layer on the dielectric layer, and a first conductive sidewall and an opposing second conductive sidewall in the dielectric layer, wherein the first and second conductive sidewalls are continuous structures.

Microelectronic assemblies that include a lithographically-defined substrate integrated waveguide (SIW) component, and related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a package substrate portion having a first face and an opposing second face; and an SIW component that may include a first conductive layer on the first face of the package substrate portion, a dielectric layer on the first conductive layer, a second conductive layer on the dielectric layer, and a first conductive sidewall and an opposing second conductive sidewall in the dielectric layer, wherein the first and second conductive sidewalls are continuous structures.

An electronic device may include a wireless circuit, and a coaxial cable device having an S-shaped balun segment coupled to the wireless circuit, and an antenna segment coupled to the S-shaped balun segment. The S-shaped balun segment may include a first inner conductor segment, and a first outer conductor segment surrounding the first inner conductor segment. The antenna segment may include a second inner conductor segment coupled to the first inner conductor segment, and a second outer conductor segment surrounding the second inner conductor segment and coupled to the first outer conductor segment, the second inner conductor segment extending from the second outer conductor segment.