An embodiment of the present invention discloses a waveguide filter, which includes a first waveguide at an upper layer and a second waveguide at a lower layer. The first waveguide and the second waveguide are isolated from each other by a metal isolation layer. The first waveguide forms a first resonant cavity. The second waveguide forms a second resonant cavity. The first resonant cavity and the second resonant cavity overlap each other. A coupling slot is disposed at the metal isolation layer in an overlapping area.

A quantum circuit, a quantum chip, and a quantum computer. The quantum circuit includes qubits, adjacent qubits being coupled, and each of the qubits including: a first capacitor, a first end of the first capacitor being grounded; a second capacitor, a first end of the second capacitor and the first end of the first capacitor being commonly grounded; and a first device, including a first squid and a third capacitor that are connected in parallel, wherein parallel-connected first ends of the first squid and the third capacitor are connected to a second end of the first capacitor, and parallel-connected second ends of the first squid and the third capacitor are connected to a second end of the second capacitor. According to the present disclosure, parameters of at least one of a plurality of capacitors in a qubit circuit can be adjusted, so that the design of the capacitor is more flexible and less spatially limited, which facilitates design and layout of other circuit structures.

One or more embodiments relate to a superconducting qubit architecture that can be fabricated in one standard patterning step such as a lithographical step for example. Specifically, embodiments relates to a superconductor-constriction-superconductor Josephson junction (ScS JJ) qubit device for use in a quantum information processing environment. In one or more embodiments, the qubit device includes a substrate (a semiconductor substrate, an insulator substrate, and a dielectric substrate for example); a first superconducting pad formed on the substrate; and a second superconducting pad formed on the substrate, where the second superconducting pad coupled to and coplanar with the first superconducting pad.

In an aspect, an apparatus is disclosed that includes a surface-mounted integrated circuit package housing an active oscillator circuit; an integrated ceramic resonator formed from a ceramic substrate having an upper planar surface receiving the surface-mounted integrated circuit package, the integrated ceramic resonator including a plurality of conductive walls forming a conductive periphery of a ceramic cavity in the ceramic substrate, a conductive rod extending vertically into the ceramic cavity, wherein the conductive rod is isolated from contact with the conductive periphery of the ceramic cavity, a first conductive material extending vertically through the upper planar surface of the ceramic substrate for connecting the conductive periphery of the ceramic cavity to the surface-mounted integrated circuit package housing the active oscillator circuit; and a second conductive material extending through the upper planar surface of the ceramic substrate for connecting the conductive rod to the surface-mounted integrated circuit package.

Embodiments of an apparatus are disclosed that includes a first three dimensional (3D) inductor and a second 3D inductor. The first three dimensional (3D) inductor has a first conductive path shaped as a first two dimensional (2D) lobe laid over a first 3D volume. In addition, the second 3D inductor has a second conductive path, wherein the second 3D inductor is inserted into the first 3D inductor so that the second conductive path at least partially extends through the first 3D volume. Since second 3D inductor is inserted into the first 3D inductor, the 3D inductors may be coupled to one another. Depending on orientation and distances of structures provided by the 3D inductors, the 3D inductors may be weakly or moderately coupled.

A flip-chip employing an integrated cavity filter is disclosed comprising an integrated circuit (IC) chip comprising a semiconductor die and a plurality of conductive bumps. The plurality of conductive bumps is interconnected to at least one metal layer of the semiconductor die to provide a conductive fence that defines an interior resonator cavity for providing an integrated cavity filter in the flip-chip. The interior resonator cavity is configured to receive an input RF signal from an input transmission line through an input signal transmission aperture provided in an internal layer in the semiconductor die. The interior resonator cavity resonates the input RF signal to generate the output RF signal comprising a filtered RF signal of the input RF signal, and couples the output RF signal on an output signal transmission line in the flip-chip through an output transmission aperture provided in the aperture layer.

The present disclosure generally relates to a shielded patterned ground structure in a PCB. The PCB may be disposed in a hard disk drive. Conductive traces in PCBs can have the problem of common mode current flowing through the traces and thus increasing the magnitude of EMI noise. By providing a shielded patterned ground structure, the common mode current is reduced as is the magnitude of EMI noise, yet there is no negative impact to the differential signal.

An apparatus of an antenna is provided. The apparatus includes a first conductor plate disposed on an upper side of a single plate and comprising an aperture, a plurality of vias inserted to vertically penetrate through the single plate, a second conductor plate disposed on a lower side of the single plate, and a feed line for applying a signal to radiate to a dielectric resonator embedded as a cavity which is formed by the first conductor plate, the second conductor plate, and the vias. The aperture is in a size which produces multiple-resonance at an operating frequency.

Provided is a band-pass filter that includes a plurality of resonators that are electromagnetically coupled to each other. At least one of the plurality of resonators is a specific resonator to which a signal is input from outside or that outputs a signal to the outside. The specific resonator includes a conductor pin, a first surrounding conductor that surrounds the conductor pin in a radial direction, a dielectric that is positioned between the conductor pin and the surrounding conductor, a second surrounding conductor that surrounds the dielectric in an axial direction of the conductor pin, and an intermediate conductor that extends in a direction crossing the axial direction of the conductor pin and that electrically connects the conductor pin to the first surrounding conductor or the second surrounding conductor.

Plasma jet assemblies utilizing evanescent mode cavity resonators, and methods of making the same and using the same, are described.