A superconducting circulator device and method of operation. The superconducting circulator device comprises more than two resonators of equal static resonance frequency chained to a ring system by strong coupling. Each of the resonators comprises an adjustable inductor built into the each one of the resonators. The device comprises also a set of ports, each one of the ports coupled to a corresponding one of the more than two resonators, a set of modulators, each one of the modulators positioned adjacently to a corresponding one of the adjustable inductor, and a set of modulation control ports. Each of the modulation control ports is connected to a corresponding modulator of the set of modulators such that each of the modulation control ports controls the related static resonance frequency of the related resonators and such that the ring system is modulatable.

A device includes: a substrate; a first superconductor layer on the substrate, the first superconductor layer having a first kinetic inductance; and a second superconductor layer on the first superconductor layer, the second superconductor layer having a second kinetic inductance that is lower than the first kinetic inductance, in which the second superconductor layer covers the first superconductor layer such that the second superconductor layer and the first superconductor layer have a same footprint, with the exception of at least a first region where the second superconductor layer is omitted so that the first superconductor layer and the second superconductor layer form a circuit element having a predetermined circuit parameter.

A device includes: a first chip including a qubit; and a second chip bonded to the first chip, the second chip including a substrate including first and second opposing surfaces, the first surface facing the first chip, wherein the second chip includes a single layer of superconductor material on the first surface of the substrate, the single layer of superconductor material including a first circuit element. The second chip further includes a second layer on the second surface of the substrate, the second layer including a second circuit element. The second chip further includes a through connector that extends from the first surface of the substrate to the second surface of the substrate and electrically connects a portion of the single layer of superconducting material to the second circuit element.

A set of superconducting devices is interconnected in a lattice that is fabricated in a single two-dimensional plane of fabrication such that a superconducting connection can only reach a first superconducting device in the set while remaining in the plane by crossing a component of a second superconducting device that is also located in the plane. A superconducting coupling device having a span and a clearance height is formed in the superconducting connection of the first superconducting device. A section of the superconducting coupling device is separated from the component of the second superconducting device by the clearance in a parallel plane. A potential of a first ground plane on a first side of the component is equalized with a second ground plane on a second side of the component using the superconducting coupling device.

A superconducting circulator device may be provided. The superconducting circulator device comprises more than two resonators of equal static resonance frequency chained to a ring system by strong coupling. Each of the resonators comprises an adjustable inductor built into the each one of the resonators. The device comprises also a set of ports, each one of the ports coupled to a corresponding one of the more than two resonators, a set of modulators, each one of the modulators positioned adjacently to a corresponding one of the adjustable inductor, and a set of modulation control ports. Each of the modulation control ports is connected to a corresponding modulator of the set of modulators such that each of the modulation control ports controls the related static resonance frequency of the related resonators and such that the ring system is modulatable.

A microfabricated laminated conductor, comprising at least two flat metallic conductors held together parallel by their edges by a first dielectric material anchor, such that there exists a gap of between several nanometers and several micrometers between most of the at least two flat metallic conductors.

A superconducting circulator device may be provided. The superconducting circulator device comprises more than two resonators of equal static resonance frequency chained to a ring system by strong coupling. Each of the resonators comprises an adjustable inductor built into the each one of the resonators. The device comprises also a set of ports, each one of the ports coupled to a corresponding one of the more than two resonators, a set of modulators, each one of the modulators positioned adjacently to a corresponding one of the adjustable inductor, and a set of modulation control ports. Each of the modulation control ports is connected to a corresponding modulator of the set of modulators such that each of the modulation control ports controls the related static resonance frequency of the related resonators and such that the ring system is modulatable.

A cryogenic electronic package includes a first superconducting multi-chip module (SMCM), a superconducting interposer, a second SMCM and a superconducting semiconductor structure. The interposer is disposed over and coupled to the first SMCM, the second SMCM is disposed over and coupled to the interposer, and the superconducting semiconductor structure is disposed over and coupled to the second SMCM. The second SMCM and the superconducting semiconductor structure are electrically coupled to the first SMCM through the interposer. A method of fabricating a cryogenic electronic package is also provided.

A set of superconducting devices is interconnected in a lattice that is fabricated in a single two-dimensional plane of fabrication such that a superconducting connection can only reach a first superconducting device in the set while remaining in the plane by crossing a component of a second superconducting device that is also located in the plane. A superconducting coupling device having a span and a clearance height is formed in the superconducting connection of the first superconducting device. A section of the superconducting coupling device is separated from the component of the second superconducting device by the clearance in a parallel plane. A potential of a first ground plane on a first side of the component is equalized with a second ground plane on a second side of the component using the superconducting coupling device.

The proposed device includes a first chip (102) comprising a superconducting quantum bit and a second chip (104) bonded to the first chip, the second chip including a substrate (108) having first and second opposing surfaces. The first surface (101) facing the first chip includes a layer (105) of superconductor material which includes a first circuit element. The second chip further includes a second layer (107) on the second surface (103) which includes a second circuit element, and a through connector (109) that extends from the first surface to the second surface and electrically connects a portion of the superconductor material layer to the second circuit element.