H01P11/002

WAVE INTERFACE ASSEMBLY FOR AUTOMATIC TEST EQUIPMENT FOR SEMICONDUCTOR TESTING
20170229754 · 2017-08-10 ·

Embodiments of the present disclosure utilize customizable waveguide fabrication technologies (e.g., 3D printer technology) and patch antenna arrays to create adaptable wave interfaces that can provide efficient signal routing for an ATE system. In this fashion, embodiments of the present disclosure allow for arbitrary waveguide routing from port to port and create high density port spacing at the PCB level and which specifically eliminates the large flange required of prior art waveguides. Furthermore, embodiments include the ability to integrate different waveguide components, including power splitters, couplers, terminations, etc., into a single structure. Thus, embodiments of the present disclosure can reduce signal path losses and simplify the mechanical construction of ATE systems while eliminating the need for coax cables and minimizing the length of PCB microstrips.

PLATING METHODS FOR MODULAR AND/OR GANGED WAVEGUIDES FOR AUTOMATIC TEST EQUIPMENT FOR SEMICONDUCTOR TESTING
20170229757 · 2017-08-10 ·

Embodiments of the present disclosure perform incisions along the direction of the long axis of the waveguide, thereby exposing a trench structure which can be readily plated. Once divided and plated, the individual cut pieces can then be secured together to restore the original waveguide structure. In this fashion, multiple cut pieces can be secured together and used as “building blocks” to create a modular solution which can be used to provide a number of different customizable waveguide structures. Thus, embodiments of the present disclosure perform plating procedures in a less expensive manner while achieving the benefits of ganged waveguide structures. Moreover, embodiments of the present disclosure offer a modular approach to ganged waveguide design thereby allowing for end-user flexibility in testing.

Integrated Polarization Converter and Feed Horn

An integral waveguide device herein includes a polarizer component comprising a waveguide and a dielectric slab, the dielectric slab configured to change a polarization of a signal passing through the waveguide. The integral waveguide device also includes a feed horn for conveying signals between the waveguide and a parabolic antenna. The waveguide of the polarizer and the feed horn are manufactured as an integral component with the feed horn disposed at a first end of the waveguide.

Method for manufacturing a radio frequency applicator

A method for manufacturing a radio frequency (RF) applicator which includes covering a ceramic insert with a coating, wherein the ceramic insert has dimensions that substantially match an internal volume of an open-ended, hollow waveguide, and wherein the ceramic insert has a recess therein configured to accept a radio frequency emitter, heating the waveguide to a temperature that is above a melting point of the coating, placing the coated ceramic insert into the internal volume of the heated waveguide, wherein the internal volume is completely filled except for the recess, and cooling the waveguide, ceramic insert, and coating to a temperature below the melting point of the coating so that the coating solidifies and fills gaps between facing surfaces of the insert and the waveguide.

Twist for connecting orthogonal waveguides in a single housing structure
09812748 · 2017-11-07 · ·

A twist for coupling radiation between orthogonal waveguides is provided. The twist includes at least three cavities opening from at least one of a first X1-Y1 surface and a second X2-Y2 surface of a metal block. A first cavity has a first opening in a first Y-Z plane and a second opening in a second Y-Z plane offset from the first Y-Z plane by a first length. A second cavity shares the second opening with the first cavity and has a third opening in a third Y-Z plane offset from the second Y-Z plane by a second length and has at least two heights and at least two widths. A last cavity shares a next-to-last opening in a next-to-last Y-Z plane with a next-to-last cavity. The last cavity has a last opening in a last Y-Z plane offset from the next-to-last Y-Z plane by a last length.

MASS CUSTOMIZATION OF ANTENNA ASSEMBLIES USING METAL ADDITIVE MANUFACTURING
20220045420 · 2022-02-10 · ·

A method, system, and device provides components of an antenna assembly. Digital information representative of one or more characteristics of an antenna element of antenna assembly may be received by a processor. The processor may further receive a specification for the antenna element. The processor may adjust digital information representative of the antenna element to adjust the physical parameters of the component to meet the specification. The antenna assembly may be fabricated with the adjusted physical parameters.

Hollow metal waveguides having irregular hexagonal cross-sections formed by additive manufacturing
11211680 · 2021-12-28 · ·

A waveguide disclosed herein may be implemented as a hollow irregular hexagonal metal structure which receives an electromagnetic signal and propagates the signal through the hollow hexagonal metal structure. The waveguide may be fabricated using metal additive manufacturing techniques and include one or more downward facing and unsupported surfaces.

ADDITIVE MANUFACTURING FOR INTEGRATED CIRCUIT ASSEMBLY CONNECTORS
20210398922 · 2021-12-23 · ·

Cables, cable connectors, and support structures for cantilever package and/or cable attachment may be fabricated using additive processes, such as a coldspray technique, for integrated circuit assemblies. In one embodiment, cable connectors may be additively fabricated directly on an electronic substrate. In another embodiment, seam lines of cables and/or between cables and cable connectors may be additively fused. In a further embodiment, integrated circuit assembly attachment and/or cable attachment support structures may be additively formed on an integrated circuit assembly.

High frequency waveguide structure

An integrated circuit (IC) comprises a substrate, a first die mounted on the substrate, a second die mounted on the substrate and a waveguide structure mounted on the first die and the second die to enable high frequency wireless communication between the first die and the second die.

METHODS FOR CONDUCTIVELY COATING MILLIMETER WAVEGUIDES

A method of forming a waveguide comprises forming an elongate waveguide core including a dielectric material; and arranging a conductive sheet around an outside surface of the dielectric core to produce a conductive layer around the waveguide core.