Radiating cable (100; 100a; 100b; 100c; 100d; 100e) for radiating electromagnetic energy, comprising an inner conductor (110), an outer conductor (120) arranged radially outside of said inner conductor (110), and an isolation layer (130) arranged radially between said inner conductor (110) and said outer conductor (120), wherein said outer conductor (120) comprises one or more first openings (1202), and wherein said inner conductor (110) comprises a hollow waveguide (1100).

The subject disclosure relates to electroplating niobium titanium (Nb/Ti) with a metal capable of being soldered to. According to an embodiment, a structure is provided that comprises a Nb/Ti substrate and a metal layer plated on a portion of the Nb/Ti substrate. The metal layer comprises an electroplated metal layer plated on the portion of the Nb/Ti substrate using electroplating. The metal layer can comprise a metal capable of being soldered to, such as copper. In another embodiment, a cable assembly is provided that comprises a niobium titanium wire, a metal layer plated on a first portion of the niobium titanium wire, and a metal coaxial connector soldered to the metal layer.

A power divider/combiner has a main conductor defining an axis; an input connector having a center conductor, adapted to be coupled to a signal source, electrically coupled to the main conductor and having an axis coincident with the main conductor axis, and having a second conductor electrically coupled to a ground conductor; a cylinder conductor including an inner cylindrical surface radially exterior of and spaced apart from the main conductor, including an outer cylindrical surface, and having a cylinder axis coincident with the main conductor axis; and a plurality of output connectors, the output connectors having center conductors electrically coupled to the cylinder conductor and having respective second conductors electrically coupled to a second ground conductor. Methods are also disclosed.

Provided is a differential signal transmission cable, a multi-core cable, and a method of manufacturing a differential signal transmission cable that can suppress an increase in differential-to-common mode conversion quantity. The differential signal transmission cable includes two signal lines, an insulation layer covering a periphery of the two signal lines, and a plating layer covering the insulation layer. Differential-to-common mode conversion quantity of the differential signal transmission cable has a maximum value of 26 dB or less, in a frequency band of 50 GHz or less. In the method of manufacturing a differential signal transmission cable, dry ice blasting is performed on an outer peripheral surface of the insulation layer, and then corona discharge exposure is performed on the outer peripheral surface.

A ground isolation transmission line package device includes (1) ground isolation planes between, (2) ground isolation lines surrounding, or (3) such ground planes between and such ground isolation lines surrounding horizontal data signal transmission lines (e.g., metal signal traces) that are horizontally routed through the package device. The (1) ground isolation planes between, and/or (2) ground isolation lines electrically shield the data signals transmitted in signal lines, thus reducing signal crosstalk between and increasing electrical isolation of the data signal transmission lines. In addition, data signal transmission lines may be tuned using eye diagrams to select signal line widths and ground isolation line widths that provide optimal data transmission performance. This package device provides higher frequency and more accurate data signal transfer between different horizontal locations of the data signal transmission lines, and thus also between devices such as integrated circuit (IC) chips attached to the package device.

Spatial power-combining devices for higher frequency operation and increased bandwidth applications are disclosed. The spatial power-combining device includes a center waveguide section with a plurality of amplifier assemblies. The plurality of amplifier assemblies forms an input end and an output end, and an input inner conductor is mechanically attached to the input end, and an output inner conductor is mechanically attached to the output end. A method for joining a plurality of amplifier assemblies together to provide a center waveguide with an input end including an input connector receptacle and an output end including an output connector receptacle is also disclosed.

A high frequency cable includes a center conductor comprising one first wire, which is located at the center of the center conductor, and a plurality of second wires, which are located around that one first wire, and the one first wire and the plurality of second wires are stranded together. Respective outer peripheral surfaces of the plurality of second wires constitute a substantially continuous circular peripheral surface as an outer peripheral surface of the center conductor.

Cables, cable connectors, and support structures for cantilever package and/or cable attachment may be fabricated using additive processes, such as a coldspray technique, for integrated circuit assemblies. In one embodiment, cable connectors may be additively fabricated directly on an electronic substrate. In another embodiment, seam lines of cables and/or between cables and cable connectors may be additively fused. In a further embodiment, integrated circuit assembly attachment and/or cable attachment support structures may be additively formed on an integrated circuit assembly.

A method for making a composite substrate circulator comprising disposing a plurality of sleeves about a plurality of rods, disposing the plurality of rods and the plurality of sleeves in a plurality of openings in a block to form an assembly, and dividing the assembly to form a plurality of plates. Each plate includes a portion of the plurality of sleeves and the plurality of rods. The magnetic saturation (4PiMs) values of the rods and sleeves are chosen to decrease radially (rod has the highest 4PiMs).

A structure, such as a cable assembly, is provided that has a Nb/Ti substrate and a metal layer electroplated on a portion of the Nb/Ti substrate, wherein the metal layer has a metal capable of being soldered to, such as copper, and a metal coaxial connector soldered to the metal layer.