A method of forming a semiconductor device is provided. The method includes encapsulating with an encapsulant at least a portion of a semiconductor die and a package substrate, the encapsulant including an additive selectively activated by way of a laser. A first opening is formed in the encapsulant, the first opening exposing a predetermined first portion of the package substrate. The additive is activated at the sidewalls of the first opening. A second opening is formed in the encapsulant, the second opening encircling the first opening and exposing a predetermined second portion of the package substrate. The additive is activated at the sidewalls the second opening. A conductive material is plated on the additive activated portions of the encapsulant.

Described herein is an apparatus and a method for a cluster connector. The cluster connector comprises at least three coaxial-cable core conductors formed in an additive manufacturing process; a dielectric around each of the three coaxial-cable core conductors, formed in the additive manufacturing process; a metallic shield around each dielectric, formed in the additive manufacturing process; at least one stub on each metallic shield, formed in the additive manufacturing process; and a common ground connection connected to each metallic shield, formed in the additive manufacturing process.

According to one embodiment, a converter includes a first dielectric substrate; a second dielectric substrate provided above the first dielectric substrate through a first adhesive layer; a first signal line provided between the first dielectric substrate and the second dielectric substrate; a first via that penetrates the first dielectric substrate and is coupled to the first signal line on an upper side of the first via; and a first conductor plate provided at least one of below the first dielectric substrate and above the second dielectric substrate.

Provided are integrated electronic components which include a waveguide microstructure formed by a sequential build process and an electronic device, and methods of forming such integrated electronic components. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals.

A method for making a composite substrate circulator comprising disposing a plurality of sleeves about a plurality of rods, disposing the plurality of rods and the plurality of sleeves in a plurality of openings in a block to form an assembly, and dividing the assembly to form a plurality of plates. Each plate includes a portion of the plurality of sleeves and the plurality of rods. The magnetic saturation (4PiMs) values of the rods and sleeves are chosen to decrease radially (rod has the highest 4PiMs).

Disclosed herein is a wire that includes: a core wire made of a conductor; an insulating film covering an outer periphery of the core wire; a catalyst adsorption film covering an outer periphery of the insulating film, the catalyst adsorption film including a catalyst serving as a reaction start point of electroless plating; and an outer periphery conductor covering an outer periphery of the catalyst adsorption film.

A high power electrical signal power combiner including coaxial and integrated waveguide structures, and including thermal stress relief elements and impedance transformation elements is designed and constructed.

A method of thermally cooling a microwave coaxial cable run includes inserting in the cable run a bandpass filter, the bandpass filter including a power divider having an input RF connector defining a front end and the power divider having an output, the bandpass filter including a power combiner having an input coupled to the output of the power divider and the power combiner having an output RF connector defining a back end, and the bandpass filter having a heat sink mechanically secured between the power divider and the power combiner. Other methods and systems are also provided.

A process for making a self-aligned waveguide includes: disposing a central conductor layer on a substrate; disposing a mask layer on the central conductor layer; forming a mask from the mask layer; removing a portion of the central conductor layer; forming an undercut interposed between substrate and the mask; forming a central conductor; disposing a ground conductor layer on the mask and the substrate; removing a portion of the ground conductor layer disposed on the mask; forming a ground plane conductor from the ground conductor layer in response to removing the portion of the ground conductor layer; and removing the mask to make the self-aligned waveguide in which the undercut provides self-alignment of each of the inner walls of the ground plane conductor to each of the sidewalls of the central conductor, and the ground plane conductor is electrically isolated from the central conductor.

One or more devices and/or methods provided herein relate to a method for fabricating a filtering electronic device having a co-integrated impedance modification element and signal transmission line. An electronic structure can comprise a signal transmission line, and an impedance modification element adjacent to and external to the signal transmission line, wherein the impedance modification element comprises a structure having differentiated sections, along the signal transmission line, that provide corresponding differentiated impedances. In an embodiment, the impedance modification element can comprise a plurality of impedance sub-elements spaced apart from one another along and adjacent to the signal transmission line to facilitate the different impedances.