A wiring board (10) includes a substrate (11) and a mesh wiring layer (20) disposed on the substrate (11) and including a plurality of wiring lines (21, 22). The substrate (11) has a transmittance of 85% or more for light with a wavelength of 400 nm or more and 700 nm or less. The wiring lines (21, 22) have a surface roughness Ra, and the surface roughness Ra is 100 nm or less.

An antenna device according to an embodiment of the present invention includes a dielectric layer, an antenna unit disposed on a top surface of the dielectric layer, and a ground layer disposed on a bottom surface of the dielectric layer. The ground layer has a first mesh structure that includes first cut portions therein. A radiation coverage is expanded by the ground layer.

Provided is a glass substrate with which it is possible to reduce dielectric loss in high-frequency signals, and which also has excellent thermal shock resistance. This invention satisfies the relation {Young's modulus (GPa)×average thermal expansion coefficient (ppm/° C.) at 50-350° C.}≤300 (GPa.Math.ppm/° C.), wherein the relative dielectric constant at 20° C. and 35 GHz does not exceed 10, and the dielectric dissipation factor at 20° C. and 35 GHz does not exceed 0.006.

An antenna stack structure according to an embodiment includes an antenna substrate layer, an antenna unit disposed on one surface of the antenna substrate layer and including a radiator and an antenna pad, and a pad ground and an insulating layer disposed at the same level on an opposite surface of the antenna substrate layer facing the one surface. The antenna pad is superimposed over the pad ground in a thickness direction. Radiation properties can be improved utilizing the antenna pad.

A light-transmitting antenna includes a substrate, a first and a second conductive pattern. The first and the second conductive pattern is disposed on a first and a second surface of the substrate respectively. The first conductive pattern includes a first feeder unit, a first and a second radiation unit, a first and a second coupling unit and a first parasitic unit. The first feeder unit is connected to the second radiation unit. The first and the second radiation unit are located between the first and the second coupling unit. One side and the other side of the first parasitic unit is connected to the second coupling unit and adjacent to the first coupling unit respectively. The second conductive pattern includes a second feeder unit, a third coupling unit, a second parasitic unit, and a fourth coupling unit.

The purpose of the present invention is to provide a photosensitive resin composition that yields a cured film having exceptional heat resistance, elongation, chemical resistance, permittivity, and dielectric tangent while being curable under low-temperature heat treatments, the percentage of film remaining after development being exceptional. To solve the above problem, the photosensitive resin composition of the present invention has the following configuration. Specifically, a photosensitive resin composition that contains a resin (A) and a photopolymerization initiator (B), said resin (A): containing one or more structural units selected from the group consisting of specific structural units represented by formula (1), formula (3), and formula (5); and also containing one or more structural units selected from the group consisting of structural units represented by formula (2), formula (4), and formula (6).

A MIMO communication system is provided. The system may include a first antenna comprising a first cavity, a first plurality of RF ports for generating a feed wave within the first cavity, and a first plurality of sub-wavelength artificially structured material elements as arranged on a surface of the first cavity as RF radiators. The first antenna is configured to generate a plurality of radiation patterns respectively corresponding to the first plurality of ports. The system may also include a second antenna comprising a second cavity and a second plurality of sub-wavelength artificially structured material elements arranged on a surface of the second cavity.

A method for manufacturing a liquid-crystal antenna device is provided. The method includes step (a) providing a first mother substrate. The first mother substrate includes a first region and a second region. The first region has a plurality of first sides. An extension line of at least one of the first sides divides the second region into a first part and a second part. The method also includes the following steps: (b) forming a first electrode layer on the first region and the second region, and (c) cutting the first mother substrate along the first sides of the first region.

An antenna system and method for fabricating an antenna are provided. The antenna system includes a substrate and an antenna. The antenna includes a conductive particle based material applied onto the substrate. The conductive particle based material includes conductive particles and a binder. When the conductive particle based material is applied to the substrate, the conductive particles are dispersed in the binder so that at least a majority of the conductive particles are adjacent to, but do not touch, one another.

A liquid crystal antenna is provided. The liquid crystal antenna includes a first substrate, a second substrate, a liquid crystal layer, a plurality of transmission electrodes including a first transmission electrode and a second transmission electrode, a plurality of signal lines including a first signal line and a second signal line, a plurality of signal terminals including a first signal terminal and a second signal terminal, and a ground electrode. A transmission electrode is electrically connected to a signal terminal through at least one signal line. The first transmission electrode is connected to the first signal terminal through the first signal line, and the second transmission electrode is connected to the second signal terminal through the second signal line. A resistance of the first signal line is A, and a resistance of the second signal line is B, where A/B is less than 10.