A semiconductor device package includes a substrate and a shielding layer. The substrate has a first surface, a second surface opposite to the first surface and a first lateral surface extending between the first surface and the second surface. The substrate has an antenna pattern disposed closer to the second surface than the first surface. The shielding layer extends from the first surface toward the second surface of the substrate. The shielding layer covers a first portion of the first lateral surface adjacent to the first surface of the substrate. The shielding layer exposes a second portion of the first lateral surface adjacent to the second surface of the substrate.

A semiconductor device package includes a substrate and a shielding layer. The substrate has a first surface, a second surface opposite to the first surface and a first lateral surface extending between the first surface and the second surface. The substrate has an antenna pattern disposed closer to the second surface than the first surface. The shielding layer extends from the first surface toward the second surface of the substrate. The shielding layer covers a first portion of the first lateral surface adjacent to the first surface of the substrate. The shielding layer exposes a second portion of the first lateral surface adjacent to the second surface of the substrate.

A hearing device is configured to be worn in an ear of a user, and is configured to provide an audio signal to the user. The hearing device comprises a circuit assembly. The circuit assembly comprises a printed circuit board assembly. The printed circuit board assembly comprises a first circuit board, a second circuit board, and a third circuit board between the first and second circuit boards. The circuit assembly comprises a battery, wherein the printed circuit board assembly is folded about the battery; and an antenna comprising an antenna element, the antenna being configured for emission and reception of electromagnetic radiation at a wavelength (λ); wherein the antenna element has a first end connected to a feed, wherein the feed is provided in a portion of the first or third circuit board which is adjacent an interconnection between the first and third circuit boards.

A hearing device is configured to be worn in an ear of a user, and is configured to provide an audio signal to the user. The hearing device comprises a circuit assembly. The circuit assembly comprises a printed circuit board assembly. The printed circuit board assembly comprises a first circuit board, a second circuit board, and a third circuit board between the first and second circuit boards. The circuit assembly comprises a battery, wherein the printed circuit board assembly is folded about the battery; and an antenna comprising an antenna element, the antenna being configured for emission and reception of electromagnetic radiation at a wavelength (λ); wherein the antenna element has a first end connected to a feed, wherein the feed is provided in a portion of the first or third circuit board which is adjacent an interconnection between the first and third circuit boards.

Provided is an antenna for receiving radio waves including frequencies in the L6 band unique to QZSS to realize accurate positioning by QZSS. A substrate-type antenna 1 comprises an arcuate antenna element 20 including a long arcuate antenna element 22 and a short arcuate antenna element 24, each of which includes an integral antenna element compatible with three frequency bands and a single antenna element compatible with one frequency band and arranged with a space from the integral antenna element. Each of the integral antenna element and the single antenna element extends from an outer peripheral part of the arcuate antenna element toward an inner peripheral part thereof. The substrate-type antenna 1 further comprises a plurality of connection units 34 connected to the long arcuate antenna element 22 and the short arcuate antenna element 24, respectively, and a coupler 30 to which the plurality of connection units 34 is coupled.

The concepts, systems, circuits and techniques described herein are directed toward a spiral antenna which may be provided using additive manufacturing technology so as to provide an antenna capable of operation at frequencies which are higher than spiral antennas manufactured using standard photo-etch or printed circuit board (PCB) manufacturing processes.

The concepts, systems, circuits and techniques described herein are directed toward a spiral antenna which may be provided using additive manufacturing technology so as to provide an antenna capable of operation at frequencies which are higher than spiral antennas manufactured using standard photo-etch or printed circuit board (PCB) manufacturing processes.

An antenna module includes an antenna substrate, a first semiconductor package, disposed on the antenna substrate, including a first connection member including one or more first redistribution layers, electrically connected to the antenna substrate, and a first semiconductor chip disposed on the first connection member, and a second semiconductor package, disposed on the antenna substrate to be spaced apart from the first semiconductor package, including a second connection member including one or more second redistribution layers, electrically connected to the antenna substrate, and a second semiconductor chip disposed on the second connection member. The first semiconductor chip and the second semiconductor chip are different types of semiconductor chips.

An antenna module includes an antenna substrate, a first semiconductor package, disposed on the antenna substrate, including a first connection member including one or more first redistribution layers, electrically connected to the antenna substrate, and a first semiconductor chip disposed on the first connection member, and a second semiconductor package, disposed on the antenna substrate to be spaced apart from the first semiconductor package, including a second connection member including one or more second redistribution layers, electrically connected to the antenna substrate, and a second semiconductor chip disposed on the second connection member. The first semiconductor chip and the second semiconductor chip are different types of semiconductor chips.

A semiconductor device package includes a first circuit layer and an emitting device. The first circuit layer has a first surface, a second surface opposite to the first surface and a lateral surface extending between the first surface and the second surface. The emitting device is disposed on the second surface of the first circuit layer. The emitting device has a first surface facing the second surface of the first circuit layer, a second surface opposite to the first surface and a lateral surface extending between the first surface and the second surface. The emitting device has a conductive pattern disposed on the second surface of the emitting device. The lateral surface of the emitting device and the lateral surface of the first circuit layer are discontinuous.