An antenna installation structure includes an antenna substrate, an insulation layer, and a bonding material. The antenna substrate includes a dielectric base including first and second main surfaces, and an antenna conductor on the first main surface. The insulation layer is on the first main surface of the antenna substrate. The bonding material is between the insulation layer and a radiation side wall of a housing, is cured, and bonds the insulation layer to the radiation side wall. A linear expansion coefficient of the insulation layer is lower than a linear expansion coefficient of the bonding material and higher than a linear expansion coefficient of the antenna substrate.

A patch antenna structure is disclosed. The patch antenna structure includes a radome; a metal substrate disposed on one side of the radome and kept at a distance from the radome, a side wall of the radome facing to the metal substrate connecting with a feeding patch, or a side wall of the metal substrate facing to the radome connecting with a feeding patch; an antenna radiating patch attached to a side wall of the radome facing to the metal substrate, wherein the antenna radiating patch is kept at a certain distance from the metal substrate to maintain the radio frequency characteristics of the patch antenna.

A three-dimensional, 360 degree, omnidirectional multiple-input multiple-output wireless systems is described herein. The multiple-input multiple-output wireless system is comprised of a plurality of radio inputs, a plurality of radio-frequency converters, an RF signal distribution network, a plurality of transceivers, and a plurality of antennas. The multiple-input multiple-output wireless system may further have a plurality of planar stacks.

A radar sensor. The radar sensor includes a high-frequency component situated on a circuit board and a waveguide structure, which is connected via a coupling structure to the high-frequency component. The waveguide structure is formed in a mold, which is injection molded to a part of the circuit board supporting the high-frequency component.

The present disclosure relates to a multiple-input and multiple-output antenna apparatus, and particularly, includes a housing, a ray dome which is coupled to the top of one side of the housing in a longitudinal direction, and has an antenna assembly disposed between the ray dome and the housing, a PCB assembly which is disposed at the bottom of the antenna assembly, a top cooling part which is coupled to the top of the other side of the housing in the longitudinal direction, has a battery and an FPGA assembly disposed between the top cooling part and the housing, and dissipates upward the heat discharged from the FPGA assembly, and a side cooling part which is coupled to protrude to one side in a width direction between the housing and the top cooling part and the other side in the width direction therebetween, and moves and dissipates the heat generated from the FPGA assembly to one side and the other side of the housing in the width direction, thereby improving cooling performance.

In an antenna structure according to exemplary embodiments of the present invention, a metal layer provided as a rear metal case of the display panel, a protecting layer and an antenna electrode layer are laminated in this order. The rear metal case may be used as a ground layer so that an additional space for the antenna is secured, and signal efficiency and reliability may be improved.

The present disclosure provides a base station. It includes a radio board; at least one primary radiator disposed on the radio board; a multi-function block configured to protect and at least partly enclose the at least one primary radiator and the radio board; and at least one secondary radiator, located above the at least one primary radiator. At least a part of the multi-function block is located between the at least one primary radiator and the at least one secondary radiator.

An antenna subarray and a base station antenna are disclosed. The antenna subarray includes a reflection plate, a plurality of radiation surfaces, and a ground plate of the plurality of radiation surfaces. The ground plate is vertically disposed on the reflection plate, and includes an integrated bottom end structure and a plurality of branch structures. The bottom end structure is connected to the reflection plate, and a top end of a branch structure is connected to a radiation surface. A feeder layer is disposed on a side of the ground plate, and a dielectric layer is spaced between the ground plate and the feeder layer. A first polarized feeder and a second polarized feeder are disposed on the feeder layer. The ground plate may have both a “ground” function of a polarized feeder and a “ground” function of a balun. The first polarized feeder and the second polarized feeder can implement both a function of a polarized feeder of the radiation surface and a function of a balun feeder.

The present disclosure in at least one embodiment provides a wireless communication device, comprising a lower case, an upper radome, coupled to the lower case, creating a storage space between the lower case and the upper radome, an antenna disposed in the storage space, and a plurality of internal substrates, disposed between the antenna and the lower case in the storage space, of which one of the plurality of internal substrates is connected to the antenna, wherein each internal substrate of the plurality of internal substrates is disposed along a first direction parallel to a surface of the lower case facing the plurality of internal substrates.

A testing system and method for testing integrated circuits with radio frequency (RF) antennas is disclosed. The system includes an alignment plate for receiving a device under test (DUT) having an RF transmitting antenna, an enclosure surrounding but separated from the transmitting antenna, a receiving antenna in a telescopic enclosure, and a conversion circuit connected to the receiving antenna. The conversion circuit is configured to convert an RF output from the DUT to a direct current (DC) voltage. The DC voltage is used as a proxy for the RF output to test the DUT. When testing chips with RF ports, the chip or ports are surrounded by the enclosure which is non-radio reflective and includes antennas for receiving RF outputs disbursed around the enclosure, or a single antenna. If multiple receiving antennas are used, sequential testing can also detect directional transmission patterns to confirm that the direction is correctly calibrated.