Patent classifications
H01Q1/405
Antenna module including printed circuit board and base station including the antenna module
The present disclosure relates to a communication method and system for converging a 5.sup.th-Generation (5G) communication system for supporting higher data rates beyond a 4.sup.th-Generation (4G) system with a technology for Internet of Things (IoT). The present disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. An antenna module and a base station including the antenna module. The antenna module includes a printed circuit board in which at least one layer is stacked, a feeding unit disposed at one surface of the printed circuit board, and a first antenna spaced apart from the feeding unit by a predetermined first length.
ANTENNA SYSTEM AND ANTENNA CIRCUIT BOARD
Provided is an antenna system useful for communication using high-frequency waves. The antenna system (100) comprises a first glass layer (101) that transmits high-frequency waves; a low-dielectric layer (103) having a lower dielectric constant than that of the first glass layer (101), the low-dielectric layer disposed adjacent to the first glass layer (101) and transmitting the high-frequency waves entering through the first glass layer (101); and an antenna circuit board (107) disposed adjacent to the low-dielectric layer (103) and including a high-frequency insulation layer (105) that receives the high-frequency waves entering through the low-dielectric layer (103).
Modular and stackable antenna array
A modular phased array antenna that includes a plurality of modular antenna array blocks assembled together as a single antenna array and an array face having an array plate and a radiator and radome assembly for each modular block interlocked and aligned to create a single monolithic array face. Each modular antenna array block includes: a plurality of transmit/receive integrated multichannel module (TRIMM) cards, each TRIMM card including power and beamforming signals, where power and beamforming signals are connected in parallel to each modular antenna array block, a plurality of radiators for radiating antenna signals having a radiator face, a radome integrated with the plurality of radiators and interfacing directly to the radiator face, where the radome does not extend beyond the radiator face, and a frame for supporting the TRIMM cards.
AERIAL VEHICLE HAVING ANTENNA ASSEMBLIES, ANTENNA ASSEMBLIES, AND RELATED METHODS AND COMPONENTS
An aerial vehicle includes a body and an antenna assembly mounted to the body. The antenna assembly includes a fairing component comprising a hollow body, a conductive coating formed on at least an inner surface of the fairing component, a plurality of antenna elements formed in the conductive coating, each antenna element including a first slot line defining a first transmission line and a second slot line defining a second transmission line, an insulator sleeve disposed within the fairing component, wherein an outer surface of the insulator sleeve at least substantially matches an inner surface of the fairing component, and a plurality of cable assemblies operably coupled to the plurality of antenna elements, wherein each cable assembly is coupled to a respective antenna element.
MOBILE TERMINAL
Disclosed is a mobile terminal. The mobile terminal comprises a body, an insulating bezel surrounding the periphery of the body, and a wire that is located in the insulating bezel and that acts as an antenna. The wire comprises a first line segment and at least two bending line segments that are connected to the first line segment. The bending line segments bend and extend into convex shapes from the connecting position of the first line segment, at least one bending line segment acts as the ground point of the antenna, and at least one bending line segment acts as the feed point of the antenna.
Ruggedized antennas and systems and methods thereof
An antenna includes at least one antenna element mounted on a substrate and extending normally thereto. The at least one antenna element is constructed from a plurality of antenna components, one of which is an upper antenna component that is furthest from the substrate. A support material surrounds the at least one antenna element and is disposed between the antenna components. A material layer is disposed on the upper antenna component and the support material. Heating elements may be interposed between the upper antenna component and the material layer, and an additional material layer, such as an ablative layer, may be disposed on the material layer.
RADIO-FREQUENCY MODULE AND COMMUNICATION DEVICE
A radio-frequency module includes a mounting substrate, a transmission circuit element, and a reception circuit element. The mounting substrate has a first main surface and a second main surface. The transmission circuit element is provided on a signal path for a transmission signal of a first communication band. The reception circuit element is provided on a signal path for a reception signal of a second communication band. The second communication band is higher than the first communication band. The transmission circuit element is disposed on a same side of the mounting substrate as the first main surface of the mounting substrate. The reception circuit element is disposed on a same side of the mounting substrate as the second main surface of the mounting substrate.
Integrated circuit testing for integrated circuits with antennas
A testing system and method for testing integrated circuits with radio frequency (RF) antennas is disclosed. The system includes an alignment plate for receiving a device under test (DUT) having an RF transmitting antenna, an enclosure surrounding but separated from the transmitting antenna, a receiving antenna in a telescopic enclosure, and a conversion circuit connected to the receiving antenna. The conversion circuit is configured to convert an RF output from the DUT to a direct current (DC) voltage. The DC voltage is used as a proxy for the RF output to test the DUT. When testing chips with RF ports, the chip or ports are surrounded by the enclosure which is non-radio reflective and includes antennas for receiving RF outputs disbursed around the enclosure, or a single antenna. If multiple receiving antennas are used, sequential testing can also detect directional transmission patterns to confirm that the direction is correctly calibrated.
Aerial vehicle having antenna assemblies, antenna assemblies, and related methods and components
An aerial vehicle includes a body and an antenna assembly mounted to the body. The antenna assembly includes a fairing component comprising a hollow body, a conductive coating formed on at least an inner surface of the fairing component, a plurality of antenna elements formed in the conductive coating, each antenna element including a first slot line defining a first transmission line and a second slot line defining a second transmission line, an insulator sleeve disposed within the fairing component, wherein an outer surface of the insulator sleeve at least substantially matches an inner surface of the fairing component, and a plurality of cable assemblies operably coupled to the plurality of antenna elements, wherein each cable assembly is coupled to a respective antenna element.
ENCAPSULATED MULTI-BAND MONOPOLE ANTENNA
An encapsulated multi-band monopole antenna is provided. Two or more sets of at least four monopole elements are encapsulated in a substrate. Conductive paths are arranged so that each element of a set of monopole element is connected to an element of each of the other sets of monopole elements.