Disclosed embodiments can pertain to process indicator enhancements. A process indicator can include a dye material that has electrical properties such as conductivity and capacitance that can be employed to determine whether observed conditions are acceptable or not to sterilize medical equipment. Furthermore, the indicators can employ amplification, a specialized antenna, or both to allow signals, such as an electronic property value, to be communicated through sterilization containers that can shield or degrade signals. A number and location of indicators can also be determined and utilized to assist in visual inspection of the indicators as well as automatic evaluation.

A display apparatus and an antenna assembly are provided. The display apparatus includes: a display; a first circuit board including at least one electronic part configured to process an image signal for displaying an image on the display; a second circuit board including at least one antenna configured to transmit and receive a radio frequency (RF) signal for communication between the display apparatus and an external apparatus; and a spacer provided between the first circuit board and the second circuit board, and configured to space the first circuit board and the second circuit board apart from each other. Thus, radiation performance in the antenna is improved with easy design based on the structure of the display apparatus. Thus, radiation performance in the antenna is improved with easy design based on the structure of the display apparatus.

An electromagnetic-wave-transmissive module of a vehicle radar is provided to minimize a dielectric impact reflection effect, which occurs when an electromagnetic wave radiated from an antenna is transmitted through a radome and a transmissive cover The electromagnetic-wave-transmissive module includes one or more of a radome covering the antenna and a transmissive cover, which is disposed to be spaced apart from a front side of the antenna and through which a radio wave radiated from the antenna and then transmitted through the radome is subsequently transmitted. At least one coating layer, which includes PTFE and which has a dielectric permittivity higher than the dielectric permittivity of air and lower than the dielectric permittivity of the radome and the transmissive cover, is formed on the surface of at least one of the radome and the transmissive cover.

A package includes an upper level mounted to a lower level. The upper level includes a stack formed by insulating layers and conductive elements and includes a first conductive track of an antenna. A plastic element rests on the stack. A first cavity is defined in the plastic element. A second conductive track of the antenna is located on a wall of the plastic element (for example, in or adjacent to the first cavity). A second cavity is also defined in the plastic element surrounding the first cavity. A third conductive track of the antenna is located on a wall of the plastic element (for example, in the second cavity). A third cavity is delimited between the upper and lower levels and an integrated circuit chip is mounted within the third cavity and electrically connected to the antenna.

A radome for a radar sensor of a motor vehicle, having at least one main body facing the radar sensor, through which main body radar beams are intended to pass and which is made of at least one optically non-transparent material, which radome has a first dielectric constant at least on a side facing away from the radar sensor, wherein the radome also has an optically transparent foil with a second dielectric constant which lies between the first dielectric constant and the dielectric constant of air, said foil being applied on the side facing away from the radar sensor and at least in the region of the main body through which the radar beams are intended to pass.

According to an embodiment, a multi-layer antenna structure comprises a printed circuit board including an IC for processing an RF signal, a feeding line connected to the IC, and a feeding pad connected to the feeding line, a conductive lower layer tightly contacting the printed circuit board and including a feeding hole in an area connected with the feeding pad and vertically open and a waveguide connected to the feeding hole and disposed on an upper surface thereof, and a conductive upper layer tightly contacting the conductive lower layer and including an antenna slot pattern in an area corresponding to the waveguide and vertically open. The waveguide may include a bottom surface positioned lower than an upper surface thereof, a side surface extending from each of two opposite ends of the bottom surface to the upper surface, and a protrusion protruding upward from a center portion of the bottom surface.

A stacked patch antenna array includes: a conductive ground plane configured to connect to a plurality of electrical transmission lines for transmitting and/or receiving electrical signals; a driven layer adjacent to the conductive ground plane formed of a dielectric material and comprising a plurality of first resonant circular patches, each electrically connecting to a respective electrical transmission line such that a received electrical signal excites and generates an electromagnetic signal and/or a received electromagnetic signal excites and generates an electrical signal; an electrically insulating spacer adjacent to the driven layer; and a coupled layer adjacent to the electrically insulating spacer formed of a dielectric material and comprising a plurality of second resonant circular patches which are symmetrically positioned with respect to the first circular resonant patches of the driven layer and excited by the electromagnetic waves generated by the first resonant circular patches, wherein the electrically insulating spacer electrically separates the driven layer and the coupled layer having a thickness such that the resonances of the first and second resonant circular patches constructively combine.

A radar sensor. The radar sensor includes a high-frequency component situated on a circuit board and a waveguide structure, which is connected via a coupling structure to the high-frequency component. The waveguide structure is formed in a mold, which is injection molded to a part of the circuit board supporting the high-frequency component.

In one embodiment of the present disclosure, an antenna assembly includes a patch antenna array including an upper patch antenna layer, a lower patch antenna layer, and a spacer therebetween, wherein the spacer includes a plurality of apertures defined by cell walls, wherein the each aperture aligns with an upper patch antenna element and a lower patent antenna element from the patch antenna array.

Disclosed are embodiments of a microelectronics package that includes: first and second substrates (each having first and second sides); a chip; and a multi-element antenna connected to the chip. The chip is mounted on the first side of the first substrate. A first antenna element of the antenna is on the second side of the first substrate and electrically connected to the chip. The first side of the second substrate is adhered to the second side of the first substrate (i.e., covering the first antenna element). A second antenna element of the antenna is on the second side of the second substrate overlaying the first antenna element and physically separated therefrom by at least one ultra-low-K dielectric region within the first side of the second substrate and/or the second side of the first substrate. Optionally, the package includes multiple chips and/or multiple antennas. Also disclosed are associated method embodiments.