In one embodiment of the present disclosure, an antenna apparatus includes a housing assembly including a radome portion and a lower enclosure portion, wherein the radome portion and lower enclosure portion are couplable to form an inner compartment for housing antenna components of the antenna assembly, an antenna stack assembly disposed within the inner compartment, wherein the antenna stack assembly generates heat when in operation, and a heat transfer system within the inner compartment configured to facilitate the flow of heat toward the radome portion.

A method for producing components of an outer skin of a vehicle with a film, which is back-molded at least from one a front side or rear side with clear plastics material, includes subjecting the film to a thermoforming process in order to generate the desired three-dimensional form. The film is subjected to further steps for preparation of the back-molding, including providing the film at least partially with a color layer. The film includes regions, through which other colors are intended to show through and be visible from the front side, or electromagnetic waves are intended to pass. The film may be punched-out in the regions to define punched-out portion in which components are inserted. The components are attached to the film by adhesive and/or overmolding on the rear side.

An all-metal antenna element with integrated common mode rejection realized with an all-metal fabrication and a balanced feed. Further, the present disclosure may provide an all-metal antenna element which may extend the bandwidth of the aperture, allow for simple linear frequency and platform scalability, and may improve the compatibility of arrays to modern digital phased array chains.

The present disclosure provides for an example stack of components for a display of a wearable device. The stack may include a first metal layer, a second metal layer, and an insulation layer separating the first and second metal layers. The first metal layer may be configured to be a touch screen and the second metal layer may be configured to be a near field communication antenna. The first metal layer may be connected to a first integrated circuit chip and the second layer may be connected to a second integrated circuit chip such that the touch sensor and the NFC antenna are on different circuits.

A radio-frequency module includes a multilayer substrate, a first semiconductor device, a second semiconductor device, a first mold layer, and a second mold layer. The multilayer substrate includes a plurality of stacked layers, and has a first major face and a second major face. The first mold layer seals the first semiconductor device. The second mold layer seals the second semiconductor device. The first major face includes a first recess. The first semiconductor device is mounted over a bottom face of the first recess. The second semiconductor device is mounted over the first major face so as to overlie the first recess. The first semiconductor device is connected with a metallic via that extends through a portion of the multilayer substrate from the bottom face of the first recess to the second major face. The first mold layer and the second mold layer are made of different materials.

A phase shifter is provided, which includes a first substrate, a second substrate, a liquid crystal layer, a plurality of first ring-shaped electrodes and a plurality of second ring-shaped electrodes. The first substrate and the second substrate are disposed opposite to each other. The liquid crystal layer is disposed between the first substrate and the second substrate. The plurality of first ring-shaped electrodes are disposed sequentially and in interval on a side of the first substrate close to the liquid crystal layer. The plurality of second ring-shaped electrodes are disposed sequentially and in interval on a side of the second substrate close to the liquid crystal layer. A plurality of vertical projections, projected by the plurality of first ring-shaped electrodes to the second substrate, and at least partially overlapped with the plurality of second ring-shaped electrodes, respectively.

An antenna includes: a dielectric layer; a reference electrode layer on a first surface of the dielectric layer and with a slot therein; radiation structure on a second surface of the dielectric layer. The radiation structure includes a plurality of radiation parts spaced apart from each other, each of which includes radiation elements spaced apart from each other. The plurality of radiation parts in each radiation structure include first radiation part and a second radiation part; and a first microstrip line and a second microstrip line are on the second surface. The first microstrip line is configured to feed power to the radiation elements in the first radiation part, and the second microstrip line is configured to feed power to the radiation elements in the second radiation part. The first microstrip line has a feed direction different from that of the second microstrip line.

According to various embodiment, an electronic device may include: a housing, a first substrate disposed in an inner space of the housing and including a first surface facing a first direction, a second surface facing a direction opposite to the first surface, and a first recess area at least partially corresponding to the first surface, a second substrate at least partially disposed in the first recess area of the first substrate, a third substrate at least partially disposed on one surface of the second substrate and including multiple antenna elements comprising at least one antenna, and a wireless communication circuit disposed on the second surface of the first substrate and electrically connected to the second substrate. The second substrate may include at least one matching circuit electrically connected to the wireless communication circuit corresponding to each of the multiple elements.

The present disclosure provides an antenna module including a substrate, a first antenna disposed on the substrate and a second antenna disposed on the substrate and spaced apart from the first antenna. The first antenna is configured to have a first operating frequency and the second antenna is configured to have a second operating frequency different from the first operating frequency. The antenna module further includes an element configured to focus an electromagnetic wave transmitted or received by the first antenna and the second antenna. A semiconductor device package is also disclosed.

A chip patch antenna includes an upper dielectric layer including a first dielectric material and a second dielectric material having different dielectric constants from each other and bonded to each other in a planar direction, a first patch antenna electrode and a second patch antenna electrode respectively disposed on one side of each of the first dielectric material and the second dielectric material, a lower dielectric layer spaced from the first dielectric material and the second dielectric material in a thickness direction, and a third patch antenna electrode and a fourth patch antenna electrode disposed on one side of the lower dielectric layer.