Patent classifications
H01Q1/422
ANTENNA MODULE, CONNECTION MEMBER, AND COMMUNICATION DEVICE EQUIPPED WITH THE SAME
An antenna module includes a first substrate, a second substrate, a connection member connected between the first substrate and the second substrate, and an FEM disposed on the connection member. A radiating element is disposed on the first substrate. An RFIC for supplying a radio frequency signal to the radiating element is disposed on the second substrate. The connection member transmits radio frequency signals between the RFIC and the radiating element. The FEM amplifies radio frequency signals transmitted between the RFIC and the radiating element. The FEM is disposed at a position between a connecting point with the first substrate and a connecting point with the second substrate on the connection member.
DIELECTRIC-CORE ANTENNAS SURROUNDED BY PATTERNED METALLIC METASURFACES TO REALIZE RADIO-TRANSPARENT ANTENNAS
A transparent dielectric-core antenna surrounded by patterned metallic metasurfaces. The patterned metallic metasurface acts as a conductive medium for surface current to flow and efficiently radiate fields driven by a power source. Furthermore, the patterned metallic metasurface can strongly reduce the electrical presence of the dielectric-core to realize a radio-transparent antenna to nearby systems at any desired frequency band while still maintaining good radiation and matching properties. Such an antenna concept may be applied to a variety of geometries.
RADIO-FREQUENCY MODULE AND COMMUNICATION APPARATUS
A radio-frequency module includes: a module substrate; a first circuit component and a second circuit component that are disposed inside the module substrate; and a metal shield plate set to a ground potential. The module substrate includes a dielectric part including a first dielectric material, and a dielectric part including a second dielectric material and located inward of the dielectric part, the second dielectric material having a relative permittivity different from that of the first dielectric material. The metal shield plate is disposed between the first circuit component and the second circuit component and in the dielectric part.
INTEGRATED BASE STATION ANTENNA
An integrated base station antenna comprises a passive antenna that includes a front radome, a matching dielectric layer and a rear radome; and an active antenna mounted on the back of the passive antenna. A distance between the rear radome of the passive antenna and the matching dielectric layer is a first distance, and the distance between the active antenna and the rear radome of the passive antenna is a second distance, where the first distance is selected as 0.25 + n/2 times the equivalent wavelength, where n is a positive integer, and the second distance is selected as 0.25 + N/2 times the equivalent wavelength, where N is a natural number. The equivalent wavelength is within the range of 0.8 to 1.2 times of the wavelength corresponding to a center frequency of an operating frequency band of the radiating elements in the active antenna.
FILTER DEVICE, AND HIGH-FREQUENCY FRONT END CIRCUIT AND DIPLEXER THAT ARE EQUIPPED WITH THE FILTER DEVICE
A filter device includes a main body, a first inductor, a second inductor, and a third inductor that are provided in the main body to transfer signals from an antenna terminal to a first terminal. The first inductor is connected to the antenna terminal and the second inductor is connected to the first terminal. The third inductor is connected to a signal transfer path between the first inductor and the second inductor. In a plan view from a normal direction of the main body, the first inductor and the second inductor are adjacent to each other.
SEMICONDUCTOR PACKAGE STRUCTURE HAVING ANTENNA ARRAY
A semiconductor package structure is provided. The structure includes a package substrate having a first surface and a second surface opposite to the first surface and including a ground layer embedded therein. A semiconductor die is formed on the first surface of the package substrate and an antenna pattern layer is formed on the second surface of the package substrate and electrically coupled to the semiconductor die. The structure also includes a first connector and a second connector formed on the second surface of the package substrate and arranged adjacent to the antenna pattern layer. The first connector is electrically coupled to the semiconductor die and electrically isolated to the ground layer, and the second connector is electrically coupled to the ground layer. A wireless communication device including the semiconductor package structure is also provided.
Wideband dual-polarized antenna
The application discloses a wideband dual-polarized antenna, including a reflective plate and a radiating element mounted on the reflective plate. The radiating element includes four dipoles which are combined together to be arranged on the reflective plate; two arms of each dipole are respectively connected to top ends of two conductor, and bottom ends of the conductor are connected to a common base and are placed on the reflective plate; a focusing member with a conical structure is mounted above the radiating element, and includes conductive members and dielectric members. The conductive members are arranged on the dielectric members in an axisymmetrical manner, are supported by the dielectric members and are arranged above the dipoles. The beamwidth is adjusted by arranging the focusing member with the conical structure above the radiating element so that the wideband dual-polarized antenna has the beamwidth reaching the desired range, has lower cross polarization ratio.
Electronic device
An electronic device which includes a radome, a bottom cover connected to the radome, and a printed circuit board disposed between the radome and the bottom cover. The radome includes a top shell, an insulating member and at least one fastening members. The insulating member is made of expanded polystyrene and has at least one recess. The fastening member is embedded in the insulating member. The top shell covers the insulating member and includes polycarbonate.
Wideband phased array antenna for millimeter wave communications
A wideband phased array antenna is provided. The wideband phased array antenna includes a plurality of antenna cells. Each of the antenna cells is configured to communicate over a frequency band ranging from 24 GHz to 52 GHz. Furthermore, one or more of the antenna cells includes a driven element and a parasitic element. The driven element is disposed on a first substrate that includes a first dielectric material. The parasitic element is disposed on a second substrate positioned relative to the first substrate such that a gap is defined between the first substrate and the second substrate. The second substrate includes a second dielectric material that is different than the first dielectric material.
ROOF ANTENNA FOR VEHICLES AND WATERTIGHT STRUCTURE FOR ROOF ANTENNA FOR VEHICLES
A roof antenna attached to a vehicle includes an adhesive applied to a designated thickness, an upper case formed in a streamlined dome shape having an opened lower surface, and a lower case combined with the upper case, the lower case shielding the opened lower surface of the upper case and provided with an antenna module mounted on an upper surface of the lower case, wherein the lower case is combined with a roof of the vehicle, one surface of a pad formed of the adhesive is applied to a lower surface of the lower case, and another surface of the pad formed of the adhesive is attached to the roof.