A printed circuit board having an AoX antenna array and a feeding circuit is disclosed. The AoX antenna array has patch antenna disposed on a top layer of the printed circuit board, while the feeding circuit is disposed on the bottom layer. The signal traces that connect the ports of the antenna unit cells to the antenna selection switches are routed so that all are roughly equal in length with a minimal length of parallel sections between signal traces. Thus, the signal traces in the feeding circuit are created so as to minimize phase difference between signal traces and to minimize coupling. Coplanar waveguides, which utilize blind vias are used to further reduce coupling.

A multi-input multi-output (MIMO) antenna system includes a metal plate, a background scanning antenna, a plurality of working antennas, and an isolator module. The isolator module is mountable on the metal plate and includes a plurality of isolators that are in a ring configuration to form an isolated space therein, so that the background scanning antenna can be located in the isolated space and a plurality of working antennas are located outside of the isolated space, thereby ensuring good isolation of the background scanning antenna from the working antennas by the design of the isolator module.

A socket antenna module includes a patch antenna, a ground plane, and a shield can, the ground plane having a first side and second side, and the patch antenna being coupled to the first side, whereas the shield can is coupled to the second side opposite the first side. In another embodiment, a socket antenna module and transceiver assembly is disclosed that integrates the socket antenna module with a conventional transceiver.

Provided is an electronic device comprising an antenna for 5G communication according to the present invention. The electronic device comprises an array antenna which is implemented as a multi-layer substrate inside the electronic device and includes multiple antenna elements. Each of the multiple antenna elements of the array antenna may comprise: a patch antenna disposed on a specific layer of the multi-layer substrate and including a first patch and a second patch which are spaced a predetermined distance apart from each other; and a ground layer disposed under the patch antenna and having a slot. Meanwhile, the first patch and the second patch may be connected to the ground layer through multiple vias, and the multiple vias may be arranged in the longitudinal direction of the slot while being adjacent to the slot.

Provided are: a structure with a conductive pattern that can be obtained in a simple manufacturing process and that exhibits favorable interlayer adhesion; and a method for manufacturing same. An embodiment of the present invention provides a structure with a conductive pattern, the structure comprising a base material, and a copper-containing conductive layer arranged on the surface of the base material, wherein when a principal surface of the conductive layer on the side facing the base material is a first principal surface, and a principal surface of the conductive layer on the opposite side from the first principal surface is a second principal surface, the conductive layer: has a porosity of 0.01 to 50 volume percent in a first principal surface-side region that extends from the first principal surface to a depth of 100 nm in the thickness direction of the conductive layer.

A wafer stack structure includes an interlayer, a first wafer, and a second wafer. The interlayer has a first surface and a second surface opposite to the first surface. The intermediate layer includes a dielectric material layer and a redistribution layer embedded in the dielectric material layer. The first wafer is disposed on the first surface of the interlayer. The second wafer is disposed on the second surface of the interlayer. The second wafer is electrically connected to the first wafer through the redistribution layer of the interlayer.

Base station antennas include an externally accessible active antenna module releasably coupled to a rear of the housing. The base station antenna housing has a passive antenna assembly that cooperates with the active antenna module.

An antenna assembly comprising a base, a modem, a top lid and a housing is disclosed herein. The base is composed of an aluminum material. The modem is disposed on the base. The top lid is for the base, and the top lid comprises at least one antenna element disposed on an exterior surface. The housing covers the top lid and base. The top lid acts as an electro-magnetic barrier for the modem. A communication cable is connected to the modem at one end and extending to and connected to a vehicle internal router with a vehicle modem at the other end.

A semiconductor package includes a front redistribution structure having a first surface and a second surface, opposite to the first surface, a dielectric layer, an antenna substrate including a plurality of antenna members in the dielectric layer, a semiconductor chip having a connection pad connected to the plurality of antenna members, a conductive core structure having a first through-hole accommodating the antenna substrate and a second through-hole accommodating the semiconductor chip, and a rear redistribution structure including a conductive cover layer exposing an upper portion of the antenna substrate and covering an upper portion of the semiconductor chip, and a conductive via connecting the conductive cover layer to the conductive core structure.

The invention provides a magnetic inductive sensing device (30) comprising a loop antenna (10) for inductively coupling with electromagnetic (EM) signals emitted from a medium in response to stimulation of the medium with electromagnetic excitation signals. The device includes an electromagnetic shield (36) element which is arranged such as to intercept electromagnetic signals travelling to or from the antenna. The shield element is formed of conductive material such as to block electrical field components of incident signals but further incorporates a non-conductive gap in the material so as to prevent the formation of eddy currents. A loop of the antenna is broken by an opening, the opening being bridged by a capacitor, and the device comprises a signal processing means which is electrically coupled to the antenna via only a single point of the antenna, located to one side of the opening.