A display apparatus and a method for manufacturing the display apparatus are provided. The display apparatus includes: a flexible panel which includes a display region and a non-display region, where the non-display region includes a bending sub-region and a back sub-region connected to the bending sub-region and arranged opposite to the display region, a multiplexer is arranged in the back sub-region; and a shielding electrode layer located on a side of the multiplexer away from the back sub-region, an orthographic projection of the multiplexer onto a plane where the shielding electrode layer is located being within the shielding electrode layer.

A semiconductor device may include an antenna array and a grounding assembly configured to at least partially electrically shield the antenna array. The grounding assembly may include a first grounding layer comprising a first plurality of openings and a second grounding layer comprising a second plurality of openings. The second grounding layer may at least partially occlude the first plurality of openings of the first grounding layer when viewed from above the antenna array.

A cost-effective process and structure is provided for a thermal dissipation element for semiconductor device packages incorporating antennas that can incorporate RF/EMI shielding from the antenna elements. Certain embodiments provide incorporated antenna element structures as part of the same process. These features are provided using a selectively-plated thermal dissipation structure that is formed to provide shielding around semiconductor device dies that are part of the package. In some embodiments, the thermal dissipation structure is molded to the semiconductor device, thereby permitting a thermally efficient close coupling between a device die requiring thermal dissipation and the dissipation structure itself.

The disclosure provides an electronic device having an electromagnetic shielding structure for preventing an antenna performance degradation. The disclosed electronic device may include: an antenna disposed in some areas of the electronic device; a printed circuit board; and a display module including a display panel, one or more signal lines coupled to the display panel, and a flexible substrate on which the one or more signal lines are disposed. The flexible substrate may include: a conductive layer coupled to the printed circuit board in a curved state and configured to shield an electromagnetic wave radiated from the one or more signal lines to the antenna; and a stress neutralization layer of which a material can be deformed over time in response to a shape of the flexible substrate coupled in a curved state. The stress neutralization layer may be disposed between the flexible substrate and the conductive layer.

A portable information handling system structure located between housing hinges along one side of the housing has first and second antenna disposed at opposing ends with a cooling fan between the first and second antenna and over the antenna structure to isolate the first and second antenna. In one embodiment, a parasitic element disposed between the first and second antenna and under the cooling fan has resonance tuned to isolate wireless signals of a frequency supported by the first and second antenna.

An information handling system to wirelessly transmit and receive data at an antenna may include a base housing metal chassis containing components of the information handling system including a thermal vent, an audio vent, and an antenna vent, the antenna vent being co-located with the thermal vent and audio vent; and the co-located antenna vent including: partitions defining a width of an aperture formed at the co-located antenna vent to accommodate a target frequency range; a monopole antenna system formed within the co-located antenna vent including a parasitic coupling element; and a grounding wall defined along an edge of the co-located antenna vent.

An information handling system to wirelessly transmit and receive data at an antenna may include a processor; a memory; a power management unit; a display housing containing components of the information handling system, the display housing including a handle and a handle lug to secure the handle to the display housing; a wireless adapter and an antenna to transmit data wirelessly via a WLAN antenna; and handle lug parasitic coupling device operatively coupled to the handle lug to parasitically couple the WLAN antenna to a handle lug parasitic coupling device and handle lug to create a multi-band WLAN antenna.

The wireless RF semiconductor system is described for use in wireless communication devices that operate in frequency range from approximately 6 GigaHertz (GHz) to 100 GHz. The system comprises of at least one RF antenna and at least one RF integrated circuit fabricated (or built) on the same semiconductor substrate inside a one single packaged module. The wireless RF semiconductor system is described in a variety of different configurations with its functionality divided up over several single chip circuits. The system simplifies assembly, reduces size and cost, and allows for a quick time to market, while maximizing the RF performance demanded by fixed and mobile 4G, 5G and other wireless standards. The system uses a novel idea of configuration and packaging of active and passive RF components into a single module. This in turn allows RF manufacturers to unlock the potential of very high frequencies operation that were previously thought too expensive and unattainable to average user. The wireless RF semiconductor system can be implemented in both mobile solutions (such as phones and tablets) and fixed applications (such as repeaters, base-stations, and distributed antenna systems).

An antenna apparatus includes: a feed line; a first ground layer including surface disposed above or below the feed line and spaced apart from the feed line; and an antenna pattern electrically connected to an end of the feed line and configured to transmit and/or receive a radio frequency (RF) signal, wherein the first ground layer includes a first protruding region protruding in a first longitudinal direction of the surface toward the antenna pattern and at least partially overlapping the feed line above or below the feed line, and second and third protruding regions protruding in the first longitudinal direction from positions spaced apart from the first protruding region in opposite lateral directions of the surface.

Disclosed is an antenna including a radiating element, a co-planar ground plane element and a transmission line extending across at least a portion of the radiating element and the ground plane element. The transmission line includes a dielectric layer. The dielectric layer has a portion of a first major surface adjacent to the ground plane and a second major surface opposite and separated from the first surface. A shield is formed on the second major surface. At least one via extends through the dielectric layer to connect the shield to the ground plane. A feed line extends longitudinally through the dielectric layer from a feed point at a proximal end of the transmission line towards a distal end of the transmission line, the feed line being shielded along a portion of its length extending across the ground plane element by the shield with the distal end of the transmission line lying in register with the radiating element and coupling the feed line to the radiating element.