An antenna assembly for a transceiver having first antennas arranged on a circuit board, a transmitting and receiving circuit arranged on the circuit board. The first antennas are connected to the transmitting and receiving circuit. Second antennas and terminating resistors are arranged on the circuit board. Each second antenna is connected to one of the terminating resistors by means of a strip line. At least one first contact for measuring HF properties of one of the second antennas and / or at least one second contact for measuring HF properties of the terminating resistor connected to the measurement antenna is arranged on the circuit board. The strip line between the measurement antenna and the terminating resistor is disconnectable at a disconnection point, and the strip line forms, on the side of the disconnection point nearest the measurement antenna, a third contact for measuring the HF properties of the measurement antenna.

An antenna system mounted on a vehicle according to the present invention may comprise: a first circuit board configured to be mountable to a metal frame; a second circuit board disposed so as to be spaced apart a predetermined distance from the first circuit board through a metal supporter; and an antenna configured to emit a signal transmitted from a power supply unit, said signal being transmitted through a space between the first circuit board and the second circuit board.

The present description concerns a polarization cell (109) comprising a rectangular conductive plane having an off-centered opening, a terminal of application of an input signal located inside of the opening, a first switching element coupling the terminal to a first region of the conductive plane located in the vicinity of a first corner of the conductive plane and a second switching element coupling the terminal to a second region of the conductive plane located in the vicinity of a second corner of the conductive plane, the first and second corners being coupled by a same side of the conductive plane.

Embodiments of the disclosure include a Radio Detection and Ranging (Radar) system with reduced transmitter antenna and receiver antenna mutual coupling. The radar system includes a transmitter antenna disposed on a first side of the dielectric substrate and a receiver antenna disposed on the same side of the dielectric substrate. The radiation boundaries of the transmitter antenna and the receiver antenna are substantially parallel to a line connecting centroids of the transmitter antenna and the receiver antenna. The radar system also includes a ground plane disposed on a second side of the dielectric substrate, opposite to the first side, operatively connected to the transmitter antenna and the receiver antenna through probes. The ground plane comprises at least one groove, separating vertical projections of the transmitter antenna and the receiver antenna on the ground plane.

According to an implementation, a computing device includes electronic circuitry, and an antenna and heat venting chamber having an antenna radiating element disposed in at least a first plane, a ground plane element disposed in at least a second plane, a first side wall member defining a plurality of perforations, and a second side wall member having a portion that is disposed opposite to the first side wall member, where the portion of the second side wall member defines at least one opening. The computing device includes a cooling system configured to vent heat generated by the electronic circuitry through the antenna and heat venting chamber.

Some embodiments relate to a semiconductor module having an integrated antenna structure. The semiconductor module has an excitable element and a first ground plane disposed between a substrate and the excitable element. A second ground plane is separated from the first ground plane by the substrate. The second ground plane is coupled to the first ground plane by one or more through-substrate vias (TSVs) that extend through the substrate.

An electronically scanned antenna comprising a travelling wave guiding structure having a bottom conductor and a top conductor developing each along a first direction, the top conductor comprising a plurality of first conductive patches arranged periodically along said first direction and connected in series by tuning circuits; the electronically scanned antenna further comprising a plurality of amplifiers arranged for compensating resistive and radiation losses along the length of the travelling wave guiding structure.

An antenna device according to an embodiment of the present invention includes a dielectric layer, a radiation pattern disposed on a top surface of the dielectric layer, a signal pad electrically connected to the radiation pattern, and a ground pad spaced apart from the signal pad and having an isolation space. A length of the isolation space is greater than a length of the signal pad.

An antenna structure according to an embodiment of the present invention includes a dielectric layer, a radiator disposed on the dielectric layer, a transmission line branching from the radiator, a signal pad electrically connected to the radiator through the transmission line on the dielectric layer, and an external circuit structure bonded to the signal pad. The signal pad includes a bonding region that is bonded to the external circuit structure and a margin region that is not bonded to the external circuit structure and is adjacent to the bonding region. An area ratio of the margin region relative to the bonding region in the signal pad is 0.05 or more and less than 0.5.

An antenna device according to an embodiment of the present invention includes a substrate layer, an antenna unit formed on a top surface of the substrate layer, a circuit wiring disposed on the top surface of the substrate layer and directly connected to the antenna unit, a stress compensation layer covering the circuit wiring on the top surface of the substrate layer and having a thickness greater than a thickness of the substrate layer, a first dielectric layer formed on a bottom surface of the substrate layer to overlap the circuit wiring in a planar view, and a first ground layer overlapping the circuit wiring in the planar view with the first dielectric layer or the stress compensation layer interposed therebetween.