Patent classifications
H01Q9/0407
ANTENNA MODULE AND METHOD FOR MANUFACTURING THE SAME
An antenna module and a method for manufacturing an antenna module are provided. The antenna module includes a first dielectric substrate, a first antenna and a second antenna. The first dielectric substrate has a top surface, a bottom surface and a first side surface between the top surface and the bottom surface. The first antenna is formed on the top surface of the first dielectric substrate. The second antenna is formed on the first side surface of the first dielectric substrate.
ARRAY ANTENNA
An array antenna includes a flexible substrate formed by stacked liquid crystal polymer (LCP) layers and has at least one feed point. At least one serial antenna is arranged on the flexible substrate, and a microstrip is extended from the feed point to connect a plurality of radiating elements in series to form the serial antenna. The tail end one of the radiating elements of the serial antenna is connected to one end of a ground microstrip, and another end of the ground microstrip is short-circuited to the ground. The length of the ground microstrip is approximately one fourth of the wavelength of the center frequency of the array antenna. Feeding sections where microstrips feeding to the radiating elements are in a horn and/or groove shape. Desired frequency and bandwidth may be obtained by adjusting lengths and widths of feeding sections respectively.
Ground plane booster antenna technology for wearable devices
A wireless wearable device comprises a radiating system that contains at least a non-resonant element disposed in different arrangements within a radiating structure in the radiating system, featuring compact dimensions and an adequate performance when operating on a carrier living body.
SEMICONDUCTOR PACKAGE INCLUDING ANTENNA
A semiconductor package includes a supporting wiring structure including a first redistribution dielectric layer and a first redistribution conductive structure; a frame on the supporting wiring structure, having a mounting space and a through hole, and including a conductive material; a semiconductor chip in the mounting space and electrically connected to the first redistribution conductive structure; a cover wiring structure on the frame and the semiconductor chip and including a second redistribution dielectric layer and a second redistribution conductive structure; an antenna structure on the cover wiring structure; a connection structure extending in the through hole and electrically connecting the first redistribution conductive structure to the second redistribution conductive structure; and a dielectric filling member between the connection structure in the through hole and the frame and surrounding the semiconductor chip, the frame, and the connection structure.
Magnetodielectric metamaterials and articles including magnetodielectric metamaterials
Magnetodielectric (MD) metamaterials have a magnetodielectric (MD) substrate of a ferrite composition or composite having a characteristic impedance matching an impedance of free space and at least one frequency selective surface (FSS). The FSS has a plurality of frequency selective surface elements disposed in a pattern and supported on the MD substrate. The FSS has a conducting composition and is configured to permit one or more of transmission, reflection, or absorption at a selected resonant frequency or selected frequency band. Articles incorporating magnetodielectric metamaterials are provided.
Nodes for high frequency fixed wireless access network
A high frequency data network access system leverages commodity WiFi chipsets and specifically multi spatial stream (e.g., 802.11 ac) chipsets in combination with electrically steered patch array antenna systems at the subscriber nodes. In addition, for thermal control, the high frequency components are mounted to a main body that includes a heat sink and a chimney. These components are also separated from components operating at baseband to avoid interference.
Single-layer wide angle impedance matching (WAIM)
A single-layer Wide Angle Impedance Matching (WAIM) and method for using the same are described. In one embodiment, the antenna comprises: an aperture having a plurality of antenna elements operable to radiating radio-frequency (RF) energy; and a single-layer wide angle impedance matching (WAIM) structure coupled to the aperture to provide impedance matching between the antenna aperture and free space.
ANTENNA SYSTEM FOR VEHICLES
An antenna system for vehicles includes a first antenna attached in a vicinity of a windshield of a vehicle; and a second antenna attached in a vicinity of a rear glass of the vehicle, wherein the first antenna and the second antenna are configured to transmit and receive an electromagnetic wave in a predetermined frequency band F, and wherein defining a region A and a region B with respect to a vehicle center axis extending in a traveling direction of the vehicle, so as to bisect a vehicle width of the vehicle from a viewpoint in a direction normal to a horizontal plane, the first antenna is arranged in the region A, and the second antenna is arranged in the region B.
ANTENNA DEVICE AND ARRAY ANTENNA DEVICE
An antenna device includes: a dielectric substrate having a feed line and a radiation unit provided on a first surface and having a ground conductor provided on a second surface opposite to the first surface; and a pair of second slits that is provided on a side of the radiation unit facing a side to which the feed line is connected and expands in directions away from each other toward the side to which the feed line is connected when the first surface is viewed from above.
INTEGRATED ANTENNA ARRAY AND BEAMFORMER IC CHIPS WITH INTER-STAGE AMPLIFICATION
An antenna apparatus includes a first component layer having a plurality of antenna elements forming an antenna array. A second component layer includes: (i) a plurality of RFICs coupled to the antenna elements, where each RFIC has active beamforming circuitry to adjust signals communicated with one or more of the antenna elements, and a portion of a first stage of a beamforming network (BFN); and (ii) an additional stage and a further stage of the BFN, each disposed externally of the RFICs. At least some of the RFICs include an intermediate amplifier coupled between the additional and further stages of the BFN.