An antenna device includes a ground plate and an antenna element. The ground plate is a conductor member with a flat rectangular shape. The antenna element is a conductor member having a feed point electrically connected to a feeder line. A length of the ground plate in a predetermined direction is shorter than a target wavelength that is a wavelength of a radio wave to be transmitted or received. The ground plate is connected to a grounding cable at a connection position on the ground plate. The connection position is shifted from an edge of the ground plate by an odd multiple of ¼ of the target wavelength.

The present invention provides an antenna device having a simple configuration for multiband operation. The antenna device is provided with: a first antenna element which is provided in a first layer of a multi-layer substrate and has a first frequency band; a second antenna element which is provided in a second layer of the multi-layer substrate different from the first layer, and has a second frequency band lower than the first frequency band; a ground substrate; a first feeding line path extending from the first antenna element toward the ground substrate; a second feeding line path extending from the second antenna element toward the ground substrate; and a filter connecting the second antenna element and the around substrate, the filter passing a signal of the first frequency band and blocking a signal of the second frequency band.

The present invention provides an antenna device having a simple configuration for multiband operation. The antenna device is provided with: a first antenna element which is provided in a first layer of a multi-layer substrate and has a first frequency band; a second antenna element which is provided in a second layer of the multi-layer substrate different from the first layer, and has a second frequency band lower than the first frequency band; a ground substrate; a first feeding line path extending from the first antenna element toward the ground substrate; a second feeding line path extending from the second antenna element toward the ground substrate; and a filter connecting the second antenna element and the around substrate, the filter passing a signal of the first frequency band and blocking a signal of the second frequency band.

An airfoil system is provided that includes an airfoil. This airfoil includes a first exterior surface, a second exterior surface, a first airfoil segment and a second airfoil segment. The airfoil extends widthwise between the first exterior surface and the second exterior surface. The first airfoil segment includes first composite material and a receptacle. A base of the receptacle is embedded within the first composite material. The second airfoil segment includes second composite material and a key. A base of the key is embedded within the second composite material. The key is mated with the receptacle thereby attaching the second airfoil segment to the first airfoil segment.

A liquid level sensor system can include a container configured to hold a volume of a liquid and a monopole antenna arranged proximate the volume of the liquid. A radiofrequency circuit may be configured to apply a radio frequency signal to the monopole antenna and provide one or more signals indicative of a level of the volume of the liquid within the container based on a radio frequency characteristic of the monopole antenna.

A liquid level sensor system can include a container configured to hold a volume of a liquid and a monopole antenna arranged proximate the volume of the liquid. A radiofrequency circuit may be configured to apply a radio frequency signal to the monopole antenna and provide one or more signals indicative of a level of the volume of the liquid within the container based on a radio frequency characteristic of the monopole antenna.

In various embodiments, disclosed herein are systems and methods directed to the fabrication of a coreless semiconductor package (e.g., a millimeter (mm)-wave antenna package) having an asymmetric build-up layer count that can be fabricated on both sides of a temporary substrate (e.g., a core). The asymmetric build-up layer count can reduce the overall layer count in the fabrication of the semiconductor package and can therefore contribute to fabrication cost reduction. In further embodiments, the semiconductor package (e.g., a millimeter (mm)-wave antenna packages) can further comprise dummification elements disposed near one or more antenna layers. Further, the dummification elements disposed near one or more antenna layers can reduce image current and thereby increasing the antenna gain and efficiency.

Disclosed are an antenna connection apparatus, an antenna assembly, and an electronic device. The electronic device may be a mobile or fixed terminal with an antenna. A non-contact coupling connection between an antenna and a feed point or a ground point is implemented by using the antenna connection apparatus, to avoid arranging an elastic bonding pad or a flexible metal buffer material on the antenna and arranging an elastic pin and the flexible metal buffer material on the feed point or the ground point, thereby reducing connection cost of the antenna and a space occupied by the antenna connection apparatus in a mobile phone.

A method of tuning an electrically small antenna comprising a radiating element and a support structure comprises applying a force to the support structure to change a shape or a dimension of the radiating element to increase or decrease a frequency at which the electrically small antenna resonates.

A method of tuning an electrically small antenna comprising a radiating element and a support structure comprises applying a force to the support structure to change a shape or a dimension of the radiating element to increase or decrease a frequency at which the electrically small antenna resonates.