An RFID includes a first conductive layer; a second conductive layer in which an antenna is formed; an insulating layer; and an IC chip. The antenna includes a first slot; a second slot facing the first slot; a coupling slot to couple the first slot with the second slot; a first adjustment slot coupled with one end of the first slot, and being wider than the first slot; a second adjustment slot coupled with another end of the first slot, and being wider than the first slot; a third adjustment slot coupled with one end of the second slot, and being wider than the second slot; a fourth adjustment slot coupled with another end of the second slot, and being wider than the second slot.

An electronic device includes a metal back cover and an antenna module. The metal back cover includes a slit. The antenna module is separated from the metal back cover and disposed far away from the slit. The antenna module includes an antenna radiator, a first ground radiator, and a connection radiator. The antenna radiator includes a first section, a second section, and a third section that are sequentially connected and form bends, and the first section has a feeding end. A first slot is formed between the first ground radiator, the first section, the second section, and a part of the third section. A width and length of the first slot are associated with a center frequency and impedance matching of a high frequency band.

An adapter device, a feeder device, and an antenna are provided. The adapter device includes a coaxial cable, an air dielectric microstrip, a ground plane, and a non-flat metal part. An outer conductor of the coaxial cable is electrically connected to the non-flat metal part, the non-flat metal part and the ground plane form non-flat capacitive coupling, and an inner conductor of the coaxial cable is electrically connected to the air dielectric microstrip. The outer conductor of the coaxial cable is grounded.

An antenna structure including a slot antenna and a wire antenna is disposed, and the antenna structure is excited to generate four antenna modes: a common mode slot antenna, a differential mode slot antenna, a common mode wire antenna, and a differential mode wire antenna in a symmetric feed manner and an anti-symmetric feed manner.

The present disclosure relates to a semiconductor package device including a stacked antenna structure with a high-k laminated dielectric layer separating antenna and ground planes, and a method of manufacturing the structure. A semiconductor die is laterally encapsulated within an insulating structure comprising a first redistributions structure. A second redistribution structure is disposed over and electrically coupled to the first redistribution structure and the die. The second redistribution structure includes the stacked antenna structure which includes first and second conductive planes separated by a high dielectric constant laminated dielectric structure. The first conductive plane includes openings and the second conductive plane is configured to transmit and receive electromagnetic waves through the openings in the first conductive plane.

Systems and apparatus are disclosed for a multiple orientation antenna for vehicle communications. An example multiple orientation antenna includes a housing and a first and second set of shutters embedded into the housing. The example multiple orientation antenna also includes a waveguide disposed within the housing defining a first and second set of slot antennas. The slot antennas of the first set of slot antennas are oriented to facilitate horizontal communication. The slot antennas of the second set of slot antennas are oriented to facilitate vertical communication. Additionally, the example multiple orientation antenna includes a rotation motor to rotate the housing.

A directional antenna array, to a radio-frequency antenna that includes one or more directional arrays and that is directional in one or two dimensions, and to a method for pointing the radio-frequency antenna and the associated computer program product. The directional antenna array comprises: a rectangular waveguide extending along a longitudinal axis, and comprising: a fixed portion with two lateral faces and an upper face, and a bottom part; a plurality of radiating elements placed on the fixed portion of the waveguide. The bottom part of the rectangular waveguide is movable translationally in a direction of movement parallel to the lateral faces, the maximum distance between the bottom part and the upper face being smaller than the distance between the lateral faces.

A beam steering system of a high-gain antenna includes an antenna configured to include a printed circuit board in which an antenna element is designed, and a ground plane, wherein the printed circuit board and the ground plane may be each adhered onto upper and lower surfaces of the antenna; a paraelectric material configured to be separated from the upper surface of the antenna with a predetermined distance and is divided into a plurality of cells, whose relative permittivity varies depending on a voltage applied to a pair of thin metallic conductor patches adhered to upper and lower surfaces of each cell; and a power supply unit configured to supply the voltage to the pair of thin metallic conductor patches which are each adhered to the upper and lower surfaces of the cell to face each other.

A radio communication apparatus includes an RF circuit formed on one surface of a printed board and configured to generate an RF signal, a transmission line configured to transmit the RF signal, a transmission line configured to transmit a signal different from the RF signal, a ground layer formed on another surface of the printed board, an antenna element configured to emit the RF signal supplied from the RF circuit through the transmission line, and a connection layer configured to bond together the antenna element and the ground layer. The antenna element includes a plurality of layered dielectric substrates, a metal film formed on surfaces of them, and a through hole formed to penetrate the dielectric substrate closest to the printed board. A part of the transmission line is disposed between any of the plurality of layered dielectric substrates.

A phase shifter circuit and a power divider are disclosed. The phase shifter circuit provides a (90/N)-degree phase shift for a signal with two or more frequencies, where N is an integer. The phase shifter circuit includes a first inductor, a first capacitor, a second inductor and a second capacitor. The first inductor is grounded, and is coupled to the first capacitor in series. The second inductor is grounded, and is coupled to the second capacitor in series. A first node between the first capacitor and the first inductor is coupled to a node between a second node between the second capacitor and the second inductor. The power divider includes plural circuit blocks cascaded in series. Each circuit block provides a (90/N)-degree phase shift for a signal with two or more operating frequencies.