Patent classifications
H01Q13/24
Low power chip-to-chip bidirectional communications
Methods and systems are described for receiving symbols of a codeword via wires of a multi-wire bus, the codeword representing an aggregate sum of a plurality of sub-channel constituent codewords, each sub-channel constituent codeword representing a weight applied to an associated sub-channel vector of a plurality of sub-channel vectors of an orthogonal matrix, generating a plurality of comparator outputs using a plurality of common-mode resistant multi-input comparators (MICs), each common-mode resistant MIC having a set of input coefficients representing a corresponding sub-channel vector of the plurality of sub-channel vectors, each sub-channel vector (i) mutually orthogonal and (ii) orthogonal to a common-mode sub-channel vector, outputting a set of forward-channel output bits formed based on the plurality of comparator outputs, obtaining a sequence of reverse-channel bits, and transmitting the sequence of reverse-channel bits by sequentially transmitting common-mode codewords over the wires of the multi-wire bus.
Communication system
A communication system disposed in a housing includes multiple communication devices each of which performing a wireless communication with one another. The communication devices include a specific communication device disposed on a mounting surface. The specific communication device includes at least one antenna structure, and the at least one antenna structure includes at least one antenna. The at least one antenna structure is disposed between the mounting surface and a predetermined wall surface of the housing. A gap between an outer shell of the at least one antenna structure and the predetermined wall surface of the housing is smaller than a wavelength of a radio wave used in the wireless communication of the communication devices. The at least one antenna of the specific communication device has a directivity in a direction parallel to the mounting surface.
Communication system
A communication system disposed in a housing includes multiple communication devices each of which performing a wireless communication with one another. The communication devices include a specific communication device disposed on a mounting surface. The specific communication device includes at least one antenna structure, and the at least one antenna structure includes at least one antenna. The at least one antenna structure is disposed between the mounting surface and a predetermined wall surface of the housing. A gap between an outer shell of the at least one antenna structure and the predetermined wall surface of the housing is smaller than a wavelength of a radio wave used in the wireless communication of the communication devices. The at least one antenna of the specific communication device has a directivity in a direction parallel to the mounting surface.
Wireless access point device
A wireless access point device includes a main frame, an antenna module, a signal transceiving element, an unlocking assembly and a fastener. The main frame includes a casing and a first connection portion formed with a fastening recess, connected to the casing and communicates with the internal space. The signal transceiving element is located in the casing. The antenna module includes a waveguide and a second connection portion disposed on one end of the waveguide. The second connection portion is detachably connected to the first connection portion to couple to the signal transceiving element. The unlocking assembly is movably located in the fastening recess. The fastener includes a buckle, and an elastic member that is connected to the second connection portion and the buckle. The antenna module is fixed on the main frame when the buckle is inserted into the fastening recess.
Wireless access point device
A wireless access point device includes a main frame, an antenna module, a signal transceiving element, an unlocking assembly and a fastener. The main frame includes a casing and a first connection portion formed with a fastening recess, connected to the casing and communicates with the internal space. The signal transceiving element is located in the casing. The antenna module includes a waveguide and a second connection portion disposed on one end of the waveguide. The second connection portion is detachably connected to the first connection portion to couple to the signal transceiving element. The unlocking assembly is movably located in the fastening recess. The fastener includes a buckle, and an elastic member that is connected to the second connection portion and the buckle. The antenna module is fixed on the main frame when the buckle is inserted into the fastening recess.
LOW POWER CHIP-TO-CHIP BIDIRECTIONAL COMMUNICATIONS
Methods and systems are described for receiving symbols of a codeword via wires of a multi-wire bus, the codeword representing an aggregate sum of a plurality of sub-channel constituent codewords, each sub-channel constituent codeword representing a weight applied to an associated sub-channel vector of a plurality of sub-channel vectors of an orthogonal matrix, generating a plurality of comparator outputs using a plurality of common-mode resistant multi-input comparators (MICs), each common-mode resistant MIC having a set of input coefficients representing a corresponding sub-channel vector of the plurality of sub-channel vectors, each sub-channel vector (i) mutually orthogonal and (ii) orthogonal to a common-mode sub-channel vector, outputting a set of forward-channel output bits formed based on the plurality of comparator outputs, obtaining a sequence of reverse-channel bits, and transmitting the sequence of reverse-channel bits by sequentially transmitting common-mode codewords over the wires of the multi-wire bus.
DIELECTRIC WAVEGUIDE, TERAHERTZ CIRCUIT AND TERAHERTZ INTEGRATED CIRCUIT
An UC dielectric waveguide of the embodiments includes: a dielectric substance wiring propagating a terahertz wave; and a medium disposed around the dielectric substance wiring and having a large refractive index difference with respect to the dielectric substance wiring. A THz circuit of the embodiments includes a dielectric substance THz circuit connected between a first and second UC dielectric waveguides. The dielectric substance THz circuit includes a circuit including a linear-shaped UC dielectric waveguide, a bent-shaped UC dielectric waveguide, and a Y-coupled branch circuit. There are included a first holding unit holding the first UC dielectric waveguide and a second holding unit holding the second UC dielectric waveguide. The THz circuit of the embodiments may include a 2×2 evanescent coupler. Provided is a THz circuit having mechanical strength obtained by applying the UC dielectric waveguide having high confinement and transmission efficiencies of THz waves with a simple structure.
Antenna
An antenna is provided, including: a first substrate, having has a first and a second surfaces parallel to each other and having a dielectric; a second substrate, having a third and a fourth surfaces parallel to each other, the third surface being disposed to face and abut the second surface, having a dielectric; a first radiation conductor, formed on the first surface; a second radiation conductor, formed on the third surface; and a power supply, supplying power to the first and second radiation conductors. A position of the power supply is disposed from centers of the first and second radiation conductors by distance d. A distance between a position where a reflection loss with respect to the second high-frequency signal becomes the smallest and the centers is d0, d/d0 is equal to or larger than 4/3.
Antenna
An antenna is provided, including: a first substrate, having has a first and a second surfaces parallel to each other and having a dielectric; a second substrate, having a third and a fourth surfaces parallel to each other, the third surface being disposed to face and abut the second surface, having a dielectric; a first radiation conductor, formed on the first surface; a second radiation conductor, formed on the third surface; and a power supply, supplying power to the first and second radiation conductors. A position of the power supply is disposed from centers of the first and second radiation conductors by distance d. A distance between a position where a reflection loss with respect to the second high-frequency signal becomes the smallest and the centers is d0, d/d0 is equal to or larger than 4/3.
High performance low profile antennas
A leaky travelling wave array of elements provide a broadband radio frequency antenna.