Multipath reception by an antenna is reduced by mounting the antenna on a semi-transparent ground plane that has a controlled distribution of layer impedance over a central region and a peripheral region. The central region includes a continuous conductive segment on which the ground element of the antenna is disposed. The distribution of the layer impedance over the peripheral region is configured by multiple conductive segments electromagnetically coupled by lumped circuit elements. A semi-transparent ground plane can be fabricated by depositing a metal film on a dielectric substrate and etching grooves into the metal film to form a desired pattern of conductive segments. Lumped circuit elements can be fabricated as discrete devices, surface mount devices, and integrated circuit devices. Various semi-transparent ground planes can be configured for linearly-polarized and circularly-polarized radiation.

An antenna device comprises a cell structure including a plurality of cells made up of a multi-layer structure including a conductor layer and a dielectric layer, arranged in a matrix, and further comprises a first antenna element and a second antenna element arranged over the cell structure. The cells are configured to have artificial magnetic conductor effects corresponding to different frequency bands in a first direction and a second direction, and the first antenna element and the second antenna element are arranged parallel to the surface of the cell structure, respectively along the first direction and the second direction.

A detection-system for a vehicle to detect the presence of one or more object relative to the vehicle comprises a module-housing, a radar sensor component located within the module-housing for emitting a radar beam and receiving reflected signals in a detection mode. The radar sensor component comprises means for emitting a defrost beam in a defrost mode; the defrost beam overlapping the radar beam. The detection-system further comprises an absorber material located in the field of view of the defrost beam to absorb the energy of the defrost beam and to warm up in view to provide a defrosting effect.

A semiconductor package includes a supporting wiring structure including a first redistribution dielectric layer and a first redistribution conductive structure; a frame on the supporting wiring structure, having a mounting space and a through hole, and including a conductive material; a semiconductor chip in the mounting space and electrically connected to the first redistribution conductive structure; a cover wiring structure on the frame and the semiconductor chip and including a second redistribution dielectric layer and a second redistribution conductive structure; an antenna structure on the cover wiring structure; a connection structure extending in the through hole and electrically connecting the first redistribution conductive structure to the second redistribution conductive structure; and a dielectric filling member between the connection structure in the through hole and the frame and surrounding the semiconductor chip, the frame, and the connection structure.

A semiconductor package includes a substrate, an electronic component, a dielectric layer a transmitting antenna, a receiving antenna and a FSS (Frequency selective surface) antenna. The electronic component is disposed on and electrically connected with the substrate. The dielectric layer has a dielectric upper surface. The transmitting antenna and the receiving antenna are formed adjacent to the substrate. The FSS antenna is formed adjacent to the dielectric upper surface of the dielectric layer. The FSS antenna is separated from the substrate by the dielectric layer in a wireless signal emitting direction.

An object is to advantageously control a phase of an electromagnetic wave with high efficiency at target operational frequency band. A phase control device (10) comprising a two-dimensional array of three-dimensional units (101) and configured to shift a phase of an electromagnetic wave passing through the three-dimensional units (101). The two nearest three-dimensional units (101) having same phase shift coverage are configured such that the distance difference from phase center of the phase control device (10) to the units (101) is a wavelength of a reference frequency f.sub.k, and the reference frequency f.sub.k is higher than center frequency f.sub.c of operational frequency band and not higher than the highest frequency f.sub.h of the operational frequency band.

An electromagnetic shielding member (11) includes a substrate (12) having a three-dimensional shape, and a conductive layer member (13) that is disposed on the substrate (12) and reflects an electromagnetic wave in a wavelength-selective manner.

A wire grid device having transmission power characteristics and a power extinction ratio in a terahertz wave band that cannot be achieved conventionally. A cutout is formed between one end and an opposite end of a rectangular metal thin plate to form a plurality of grid plates each having an elongated grid part between the one end and the opposite end. The grid plates are stacked in such a manner that the grid parts of the grid plates are spaced at a given interval and face each other, thereby forming a grid plate stack. In this case, spacers are inserted between one ends and between opposite ends of adjacent ones of the grid plates to form parallel flat plates configured by the grid parts. The grid plate stack forming the parallel flat plates operates as a polarizer for a terahertz wave band.

A slotted electrically conductive structure attachable to a substrate and configured to enhance penetration of an incidental radio wave through the substrate is disclosed. The structure allows a substantial portion of the incidental radio wave to penetrate from a first region to a second region through the substrate. The slotted electrically conductive structure comprises a metallic base layer of transparent metal or metal oxide; and one or more patterned slots provided on the metallic base layer. Each of the patterned slots comprises a plurality of feature elements covering an entire area of the patterned slot. The structure reduces thermal energy loss through the substrate and the plurality of feature elements is configured to allow the incidental radio wave to pass through the slotted electrically conductive structure. A multilayer structure comprising the slotted electrically conductive structure and a film structure having randomly distributed irregularly shaped protrusions or pits is also provided.

Systems and methods for producing electromagnetic devices are provided. The systems and methods allow for an electromagnetic device having both a substrate (e.g., polymer) and conductive material (e.g., metal) to be manufactured without using masks or other outside objects disposed over a surface (e.g., the substrate) onto which the conductive material is deposited. In one exemplary embodiment, the method includes performing additive manufacturing using a polymer to produce a device having a plurality of interconnected walls and a plurality of frequency selective surface elements, and then coating portions of the device with a conductive material. A plurality of shadowing features are formed as part of one or more of the walls to protect the frequency selective surface elements from being coated by the conductive material. Other methods, and a variety of systems that can result from the disclosed methods, are also provided.