A multi-beam antenna includes a plurality of radiating elements and a lens that is positioned to receive electro-magnetic radiation from at least one of the radiating elements, the lens comprising a composite dielectric material. The composite dielectric material comprises a foamed base dielectric material having particles of a high dielectric constant material embedded therein, the high dielectric constant material having a dielectric constant that is at least three times a dielectric constant of the foamed base dielectric material.

The present invention relates to a communication technique which fuses a 5G communication system with IoT technology to support higher data transmission rates after a 4G system, and system thereof. In addition, the present invention provides an antenna assembly which comprises: an antenna array which includes at least one antenna; a film layer which is made of at least one insulating material, spaced apart from the antenna array by a predetermined first distance and joined to one side of a window; and an installation aid which has a surface fixed and attached to the window and the other surface on which an antenna array seating portion is formed.

The present invention relates to a communication technique which fuses a 5G communication system with IoT technology to support higher data transmission rates after a 4G system, and system thereof. In addition, the present invention provides an antenna assembly which comprises: an antenna array which includes at least one antenna; a film layer which is made of at least one insulating material, spaced apart from the antenna array by a predetermined first distance and joined to one side of a window; and an installation aid which has a surface fixed and attached to the window and the other surface on which an antenna array seating portion is formed.

An electronic device is provided. The electronic device includes a housing that has a first plate facing a first direction, a second plate facing a second direction and opposite to the first plate, and a lateral member surrounding a space between the first plate and the second plate. The electronic device further includes an antenna structure disposed to be substantially parallel to the second plate in the space, and including at least one antenna element disposed to face the second plate. Also, the electronic device includes a dielectric disposed, in the space, to overlap, at least in part, with the antenna structure without exceeding a half area of the antenna structure when the second plate is viewed from above, and a wireless communication circuit configured to form a directional beam, at least in part, through the at least one antenna element.

A system includes a transceiver to communicate with a predetermined target; one or more antennas coupled to the transceiver each electrically or mechanically steerable to the predetermined target; and an edge processing module coupled to the transceiver and one or more antennas to provide low-latency computation for the predetermined target.

An integrated circuit package is described comprising an integrated circuit die and an antenna structure coupled to the integrated circuit die and comprising a stacked arrangement of metal and dielectric layers, wherein a first metal layer includes a planar antenna and at least one further metal layer comprises an artificial dielectric layer. The integrated circuit package may improve the directionality of the antenna and reduces the sensitivity of the antenna to the printed circuit board on which the integrated circuit package is mounted.

An integrated circuit package is described comprising an integrated circuit die and an antenna structure coupled to the integrated circuit die and comprising a stacked arrangement of metal and dielectric layers, wherein a first metal layer includes a planar antenna and at least one further metal layer comprises an artificial dielectric layer. The integrated circuit package may improve the directionality of the antenna and reduces the sensitivity of the antenna to the printed circuit board on which the integrated circuit package is mounted.

An antenna system is described, comprising at least one antenna element provided on a printed circuit board material and a lens unit with a lens body made of a dielectric material, the lens unit being directly connected to the antenna element. The lens unit comprises a lower side facing the antenna element and an upper side being located opposite to the lower side. Further, the upper side has at least one of a convex surface and a Fresnel lens shaped surface. The lens unit also comprises at least one recess filled by the antenna element in a mounted state of the antenna system.

An antenna system is described, comprising at least one antenna element provided on a printed circuit board material and a lens unit with a lens body made of a dielectric material, the lens unit being directly connected to the antenna element. The lens unit comprises a lower side facing the antenna element and an upper side being located opposite to the lower side. Further, the upper side has at least one of a convex surface and a Fresnel lens shaped surface. The lens unit also comprises at least one recess filled by the antenna element in a mounted state of the antenna system.

Systems and methods are provided for enhancing the electrical performance of ultra-wideband (UWB) electronically scanned arrays (ESA) for use in multifunctional, electronic warfare, communications, radar, and sensing systems. Embodiments of the present disclosure provide designed metal and dielectric elements placed above the arbitrary radiator (i.e., in the superstrate region) to simultaneously aid impedance and polarization challenges. These elements can be compatible with arbitrary antenna element types.