A device for selectively reflecting an incident microwave signal or millimeter-wave signal includes multiple antennae disposed in an array. Each antenna has an input adapted to selectively receive a forward bias signal or a zero bias signal. The device also includes a diode disposed at each input of each antenna. The device also includes a switching device connected to each input, and configured to selectively apply a forward bias or zero bias to each of the diodes. In forward bias, each of the antennae detects the incident microwave signal or millimeter wave signal, and in zero bias, each of the antennae reflects the incident microwave signal or millimeter wave signal.

One example is an antenna structure with a metamaterial having a flexible metamaterial layer, a two-dimensional antenna layer and a spacer layer. The flexible metamaterial layer has a metamaterial thickness allowing the metamaterial layer to be attached to a curved conducting surface of a vehicle. The metamaterial layer is formed with a two-dimensional array of elements having a passive magnetic property with the array of elements formed with elongated individual elements each having a top end and a bottom end. The elongated individual elements have curved outer surfaces between the top end and the bottom end. The two-dimensional antenna layer receives electromagnetic signals. The spacer layer is located between the metamaterial layer and the antenna layer separating the metamaterial layer and the antenna layer.

The present invention relates to: a communication technique for merging, with IoT technology, a 5G communication system for supporting a data transmission rate higher than that of a 4G system; and a system therefor. The present invention provides an antenna module comprising: an antenna array for radiating beams through a top surface thereof, a dielectric disposed to be spaced apart from the top surface of the antenna array by a first preset length; a first reflector comprising a metallic material, and disposed to be spaced apart from the bottom surface of the dielectric by a second preset length; and a second reflector comprising a metallic material and disposed in the partial region of the bottom surface, of the dielectric, which faces the top surface of the antenna array.

An antenna structure includes a radiative antenna element disposed in a first conductive layer, a reflector ground plane disposed in a second conductive layer under the first conductive layer, a feeding network comprising a transmission line disposed in a third conductive layer under the second conductive layer, and at least one coupling element disposed in proximity to a feeding terminal that electrically couples one end of the transmission line to the radiative antenna element. The coupling element is capacitively coupled with the feeding terminal.

A transition structure for millimeter wave is provided. The transition structure includes a first layer signal element coupled to an end of a first transmission line and a plurality of first layer ground elements surrounding the end of the first transmission line equidistantly from the end of the first transmission line and disposed along two opposite sides of a strip body of the first transmission line equidistantly from the strip body of the first transmission line. The transition structure further includes an intermediate layer signal element coupled to the first layer signal element and a plurality of intermediate layer ground elements surrounding the intermediate layer signal element quasi-coaxially. A multilayer transition structure including a multilayer structure and the transition structure is also provided. Therefore, the problem of operating frequency caused by the thickness of the multilayer structure can be overcome, thereby increasing the resonance frequency of the multilayer structure.

An antennas-in-package (AiP) verification board is provided, which includes a carrier board configured for disposing an antenna array or an electronic circuit; and a plurality of SMPM connectors. The plurality of SMPM connectors are arranged in an array on the carrier board and electrically connected with the antenna array or the electronic circuit of the carrier board for testing the characteristics of the antenna array on the carrier board or the characteristics of the electronic circuit on the carrier board. The AiP verification board is fixed on a beamforming test platform. In addition to the aforementioned AiP verification board, an AiP verification board including a plurality of adaptor structures and an AiP verification board including a plurality of connectors and a plurality of adaptor structures are also provided.

Provided is a rapid over-the-air (OTA) production line test platform, including a device under test (DUT), an antenna array and two reflecting plates. The DUT has a beamforming function. The antenna array is arranged opposite to the DUT, and emits beams with beamforming. Two reflecting plates are disposed opposite to each other, and are arranged between the DUT and the antenna array. The beam OTA test of the DUT is carried out by propagation of the beams between the antenna array, the DUT and the two reflecting plates. Accordingly, the test time can be greatly shortened and the cost of test can be effectively reduced. In addition to the above-mentioned rapid OTA production line test platform, platforms for performing the OTA production line test by using horn antenna arrays together with bending waveguides and using a 3D elliptic curve are also provided.

One example is an antenna structure with a metamaterial having a flexible metamaterial layer, a two-dimensional antenna layer and a spacer layer. The flexible metamaterial layer has a metamaterial thickness allowing the metamaterial layer to be attached to a curved conducting surface of a vehicle. The metamaterial layer is formed with a two-dimensional array of elements having a passive magnetic property with the array of elements formed with elongated individual elements each having a top end and a bottom end. The elongated individual elements have curved outer surfaces between the top end and the bottom end. The two-dimensional antenna layer receives electromagnetic signals. The spacer layer is located between the metamaterial layer and the antenna layer separating the metamaterial layer and the antenna layer.

ABSTRACT One example of embodiments of the present disclosure includes a structure. The structure includes first pair conductors and at least one unit structure. The first pair conductors are separated from each other in a first direction. The unit structure is positioned between the first pair conductors. The unit structure includes a second conductor and a third conductor. The unit structure includes at least one unit resonator. The third conductor extends in an xy plane including an x direction. The third conductor is electrically connected to the first pair conductors. The third conductor is configured as a reference potential of the structure. The unit resonator overlaps with the third conductor in a z direction intersecting with the xy plane. The unit resonator is configured to uses the third conductor as the reference potential.

An antenna module to be provided to a vehicle includes: an array antenna configured to form a beam directed from an aperture provided in an exterior body panel of the vehicle, toward a vehicle outside; and a housing holding the array antenna in a vehicle inside.