An electronic device includes a first conductive plate, a second conductive plate that is spaced from the first conductive plate and is disposed parallel to the first conductive plate, a conductive element that is disposed in a space between the first conductive plate and the second conductive plate, a wireless communication circuit that is electrically connected with the first conductive plate and the conductive element, and a printed circuit board that is coupled with at least one side of the first conductive plate, at least one side of the second conductive plate, and one end of the conductive element. The wireless communication circuit is configured to transmit/receive a first radio frequency (RF) signal having a vertical polarization characteristic using the first conductive plate and the second conductive plate and to transmit/receive a second RF signal having a horizontal polarization characteristic using the conductive element.

An antenna comprises a printed circuit board that includes a central feed point and a plurality of antenna elements formed therein, where the antenna elements extending radially from the central feed point. Each antenna element comprises a feed line that is coupled to the central feed point, the feed line including a feed conductor and a ground conductor, and at least two dipole radiators coupled to the feed line, each dipole radiator comprising a first dipole arm that is coupled to the feed conductor and a second dipole arm that is coupled to the ground conductor. A first length of a first of the dipole radiators is different than a second length of a second of the dipole radiators. Each of the dipole radiators is fed in-phase.

An antenna comprises a printed circuit board that includes a central feed point and a plurality of antenna elements formed therein, where the antenna elements extending radially from the central feed point. Each antenna element comprises a feed line that is coupled to the central feed point, the feed line including a feed conductor and a ground conductor, and at least two dipole radiators coupled to the feed line, each dipole radiator comprising a first dipole arm that is coupled to the feed conductor and a second dipole arm that is coupled to the ground conductor. A first length of a first of the dipole radiators is different than a second length of a second of the dipole radiators. Each of the dipole radiators is fed in-phase.

A ground layer is disposed within a dielectric substrate. An antenna pattern that operates as an antenna is disposed so as to be closer to a first surface of the dielectric substrate than the ground layer is. A high-frequency device that supplies a high-frequency signal to the antenna pattern is mounted in or on a second surface of the dielectric substrate, which is opposite to the first surface. A plurality of signal conductor columns and a plurality of ground conductor columns that are made of a conductive material project from the second surface. Each of the signal conductor columns is connected to the high-frequency device by a wiring pattern, which is provided in or on the dielectric substrate, and the ground conductor columns are connected to the ground layer.

A control module is installed in a multi-antenna device having a wireless chip, and comprises a multi-antenna system, an antenna control unit, an application unit and a microprocessor. The multi-antenna system comprises antenna units. Each antenna unit comprises a main antenna and a reflecting unit, with the main antenna generating a radiation pattern in a single polarization direction, and the reflecting unit parallel to the single polarization direction and partially surrounding the main antenna. When a diode is conducted, the reflecting unit forms a rectangular closed slot structure as a reflector of the main antenna; conversely, the reflecting unit does not serve as the reflector. According to the signal strength or data receiving rates of the antenna units, the application unit controls the microprocessor to associate with an algorithm processing procedure to determine whether to conduct the diode for changing a radiation pattern of the multi-antenna system.

An antenna device is disclosed. The antenna device includes a main antenna element and a sub antenna element, the sub antenna element being configured to form a mutual coupling with the main antenna element where a central axis of the sub antenna element forms an angle different from a right angle with a central axis of the main antenna element.

A control module is installed in a multi-antenna device having a wireless chip, and comprises a multi-antenna system, an antenna control unit, an application unit and a microprocessor. The multi-antenna system comprises antenna units. Each antenna unit comprises a main antenna and a reflecting unit, with the main antenna generating a radiation pattern in a single polarization direction, and the reflecting unit parallel to the single polarization direction and partially surrounding the main antenna. When a diode is conducted, the reflecting unit forms a rectangular closed slot structure as a reflector of the main antenna; conversely, the reflecting unit does not serve as the reflector. According to the signal strength or data receiving rates of the antenna units, the application unit controls the microprocessor to associate with an algorithm processing procedure to determine whether to conduct the diode for changing a radiation pattern of the multi-antenna system.

In conventional packaging strategies for mm wave applications, the size of the package is dictated by the antenna size, which is often much larger than the RFIC (radio frequency integrated circuit). Also, the operations are often limited to a single frequency which limits their utility. In addition, multiple addition build-up layers are required to provide the necessary separation between the antennas and ground layers. To address these issues, it is proposed to provide a device that includes an antenna package, an RFIC package, and an interconnect assembly between the antenna and the RFIC packages. The interconnect assembly may comprise a plurality of interconnects with high aspect ratios and configured to connect one or more antennas of the antenna package with an RFIC of the RFIC package. An air gap may be formed in between the antenna package and the RFIC package for performance improvement.

A ground layer is disposed within a dielectric substrate. An antenna pattern that operates as an antenna is disposed so as to be closer to a first surface of the dielectric substrate than the ground layer is. A high-frequency device that supplies a high-frequency signal to the antenna pattern is mounted in or on a second surface of the dielectric substrate, which is opposite to the first surface. A plurality of signal conductor columns and a plurality of ground conductor columns that are made of a conductive material project from the second surface. Each of the signal conductor columns is connected to the high-frequency device by a wiring pattern, which is provided in or on the dielectric substrate, and the ground conductor columns are connected to the ground layer.

A ground layer is disposed within a dielectric substrate. An antenna pattern that operates as an antenna is disposed so as to be closer to a first surface of the dielectric substrate than the ground layer is. A high-frequency device that supplies a high-frequency signal to the antenna pattern is mounted in or on a second surface of the dielectric substrate, which is opposite to the first surface. A plurality of signal conductor columns and a plurality of ground conductor columns that are made of a conductive material project from the second surface. Each of the signal conductor columns is connected to the high-frequency device by a wiring pattern, which is provided in or on the dielectric substrate, and the ground conductor columns are connected to the ground layer.