A multiband antenna, having a reflector, and a first array of first radiating elements having a first operational frequency band, the first radiating elements being a plurality of dipole arms, each dipole arm including a plurality of conductive segments coupled in series by a plurality of inductive elements; and a second array of second radiating elements having a second operational frequency band, wherein the plurality of conductive segments each have a length less than one-half wavelength at the second operational frequency band.

An antenna structure includes a dipole antenna element, a meandering connection line, and a cascade radiation element. The dipole antenna element includes a feeding radiation element and a grounding radiation element. The feeding radiation element has at least one open slot. The cascade radiation element is coupled through the meandering connection line to the feeding radiation element.

An antenna structure includes a dipole antenna element, a meandering connection line, and a cascade radiation element. The dipole antenna element includes a feeding radiation element and a grounding radiation element. The feeding radiation element has at least one open slot. The cascade radiation element is coupled through the meandering connection line to the feeding radiation element.

A ground layer is disposed within a dielectric substrate. An antenna pattern that operates as an antenna is disposed so as to be closer to a first surface of the dielectric substrate than the ground layer is. A high-frequency device that supplies a high-frequency signal to the antenna pattern is mounted in or on a second surface of the dielectric substrate, which is opposite to the first surface. A plurality of signal conductor columns and a plurality of ground conductor columns that are made of a conductive material project from the second surface. Each of the signal conductor columns is connected to the high-frequency device by a wiring pattern, which is provided in or on the dielectric substrate, and the ground conductor columns are connected to the ground layer.

In one aspect, the present disclosure relates to a manufactured utility apparatus that includes a base module, an ice bridge module attached to the base module, and an equipment cabinet module attached to the base module. The manufactured utility apparatus may include a cable securing module attached to the base module. The cable securing module may be configured to electrically connect the utility apparatus and a utility resource. The manufactured utility apparatus may further include an H-frame module attached to the base module, and an antenna module attached to the base module, the antenna module being operatively connected to the utility resource. The manufactured utility apparatus may include a grounding module configured to electrically ground the utility apparatus and the utility resource.

In one aspect, the present disclosure relates to a manufactured utility apparatus that includes a base module, an ice bridge module attached to the base module, and an equipment cabinet module attached to the base module. The manufactured utility apparatus may include a cable securing module attached to the base module. The cable securing module may be configured to electrically connect the utility apparatus and a utility resource. The manufactured utility apparatus may further include an H-frame module attached to the base module, and an antenna module attached to the base module, the antenna module being operatively connected to the utility resource. The manufactured utility apparatus may include a grounding module configured to electrically ground the utility apparatus and the utility resource.

Three elements of a first (¼) wavelength element and a second (¼) wavelength element which have a length of (¼) wavelength at an arbitrary frequency designated in advance and a half-wavelength element which has a length of a half-wavelength at the arbitrary frequency are arranged in a three-orthogonal state where those are orthogonal to each other, one end portion of the first (¼) wavelength element is joined to one end portion of the second (¼) wavelength element, another end portion of the second (¼) wavelength element is joined to one end portion of the half-wavelength element, a feeding point for antenna power feeding is arranged in a position in which the one end portion of the first (¼) wavelength element is joined to the one end portion of the second (¼) wavelength element, and an antenna is formed as a one-wavelength twisted Z-shaped three-orthogonal dipole antenna.

An antenna apparatus includes a ground layer having a through-hole; a feed via disposed to pass through the through-hole; a patch antenna pattern disposed on the ground layer and electrically connected to one end of the feed via; a first coupling patch pattern disposed on the patch antenna pattern; a second coupling patch pattern disposed between the first coupling patch pattern and the patch antenna pattern; and a dielectric layer disposed in at least of a portion a space between the first coupling patch pattern and the second coupling patch pattern so that a dielectric constant of at least a portion of a space between the patch antenna pattern and the second coupling patch pattern is lower than a dielectric constant of the space between the first coupling patch portion and the second coupling patch pattern.

A chip antenna module includes a substrate, a plurality of chip antennas disposed on a first surface of the substrate, and an electronic element mounted on a second surface of the substrate, wherein each of the plurality of chip antennas includes a first ceramic substrate mounted on the first surface of the substrate, a second ceramic substrate opposing the first ceramic substrate, a first patch disposed on the first ceramic substrate, and a second patch disposed on the second ceramic substrate, and the first ceramic substrate and the second ceramic substrate are spaced apart from each other.

An antenna apparatus includes: a feed via; a patch antenna pattern electrically connected to one end of the feed via; a ground layer disposed in a position vertically lower than a position of the patch antenna pattern, and having a through-hole through which the feed via passes; a first conductive ring pattern laterally spaced apart from the patch antenna pattern, and having a first through region laterally surrounding the patch antenna pattern; and a second conductive ring pattern disposed in a position vertically higher than a position of the first conductive ring pattern, and having a second through region laterally surrounding the patch antenna pattern, wherein an area of the second through region is greater than an area of the first through region.