An electronic device is provided. The electronic device includes a housing having an inner space. The electronic device may further include an antenna structure disposed in the inner space of the housing and including a printed circuit board (PCB) having a first board surface facing a first direction, a second board surface facing a second direction opposite to the first direction, and a lateral board surface surrounding a space between the first and second board surfaces, a first antenna array disposed in the space between the first and second board surfaces and forming a beam pattern in a third direction that the lateral board surface faces, and a second antenna array disposed at a position spaced apart from the first antenna array and forming a beam pattern in the first direction.

A chip antenna module includes a substrate, a plurality of chip antennas disposed on a first surface of the substrate, and an electronic element mounted on a second surface of the substrate, wherein each of the plurality of chip antennas includes a first ceramic substrate mounted on the first surface of the substrate, a second ceramic substrate opposing the first ceramic substrate, a first patch disposed on the first ceramic substrate, and a second patch disposed on the second ceramic substrate, and the first ceramic substrate and the second ceramic substrate are spaced apart from each other.

This application relates to a device for signal transmission (e.g., radio frequency transmission) and a method for forming the device. For example, the method includes: depositing an insulating layer that includes polybenzobisoxazole (PBO) on a carrier; forming a backside layer including polyimide (PI) over the adhesive layer; forming a die-attach film (DAF) over the backside layer; forming one or more through-insulator via (TIV)-wall structures and one or more TIV-grating structures on the second backside layer; placing a die, such as a radio frequency (RF) integrated circuit (IC) die, on the DAF; encapsulating the die, the one or more TIV-wall structures, and the one or more TIV-grating structures, with a molding compound to form an antenna package including one or more antenna regions; and forming a redistribution layer (RDL) structure on the encapsulated package. The RDL structure can include one or more antenna structures coupled to the die. Each of the one or more antenna structures can be positioned over the one or more antenna regions.

An expandable antenna includes: a plurality of ribs arranged with a regulated angular pitch at an outer circumferential portion of a hub; and a metal mesh installed between the plurality of adjacent ribs, wherein each of the plurality of ribs is formed in a horizontally elongated thin flat plate shape with elasticity, and a segment to which the metal mesh is attached is formed in a parabolic shape. A flat plane of each of the plurality of ribs is arranged so as to be substantially parallel to a central axis of the hub. The object of the present invention is to provide the expandable antenna which can be easily expanded in outer space with a simple structure and can realize a desired shape after expansion.

An antenna apparatus includes first dipole antenna patterns, feed lines, a first ground plane, and a first blocking pattern. The feed lines are connected to corresponding ones of the first dipole antenna patterns. The first ground plane is disposed on a side of the first dipole antenna patterns and spaced apart from each of the first dipole antenna patterns. The first blocking pattern, connected to and extending from the first ground plane, is disposed between adjacent ones of the first dipole antenna patterns.

An antenna apparatus includes first dipole antenna patterns, feed lines, a first ground plane, and a first blocking pattern. The feed lines are connected to corresponding ones of the first dipole antenna patterns. The first ground plane is disposed on a side of the first dipole antenna patterns and spaced apart from each of the first dipole antenna patterns. The first blocking pattern, connected to and extending from the first ground plane, is disposed between adjacent ones of the first dipole antenna patterns.

An electronic device includes a first conductive plate, a second conductive plate that is spaced from the first conductive plate and is disposed parallel to the first conductive plate, a conductive element that is disposed in a space between the first conductive plate and the second conductive plate, a wireless communication circuit that is electrically connected with the first conductive plate and the conductive element, and a printed circuit board that is coupled with at least one side of the first conductive plate, at least one side of the second conductive plate, and one end of the conductive element. The wireless communication circuit is configured to transmit/receive a first radio frequency (RF) signal having a vertical polarization characteristic using the first conductive plate and the second conductive plate and to transmit/receive a second RF signal having a horizontal polarization characteristic using the conductive element.

An electronic device includes a first conductive plate, a second conductive plate that is spaced from the first conductive plate and is disposed parallel to the first conductive plate, a conductive element that is disposed in a space between the first conductive plate and the second conductive plate, a wireless communication circuit that is electrically connected with the first conductive plate and the conductive element, and a printed circuit board that is coupled with at least one side of the first conductive plate, at least one side of the second conductive plate, and one end of the conductive element. The wireless communication circuit is configured to transmit/receive a first radio frequency (RF) signal having a vertical polarization characteristic using the first conductive plate and the second conductive plate and to transmit/receive a second RF signal having a horizontal polarization characteristic using the conductive element.

An antenna is provided with a dielectric layer, a metal layer provided on one surface of the dielectric layer, a radiation element provided on the other surface of the dielectric layer, the radiation element including a slit portion in a central portion, a radiation system of which is magnetic field current radiation by electric field induction, a contactless feed element arranged above the slit portion, and a parasitic radiation element, a radiation system of which is electric field current radiation by magnetic field induction.

A chip antenna includes a first dielectric substrate, a second dielectric substrate spaced apart from and opposing the first dielectric substrate, a first patch disposed on the first dielectric substrate, a second patch disposed on the second dielectric substrate, and a mounting pad and a feed pad disposed on a mounting surface of the first dielectric substrate. The first dielectric substrate, mounted on a mounting substrate through the mounting pad, is electrically connected to the mounting substrate through the feed pad. One of the first dielectric substrate and the second dielectric substrate is formed of ceramic and another is formed of polytetrafluoroethylene (PTFE).