A mobile device includes a body, an antenna structure, and a floating radiation element. The body includes a frame and a housing. The frame is positioned on a first plane. The housing includes a parallel region and a cutting retraction region. The parallel region is positioned on a second plane which is parallel to the first plane. The floating radiation element is adjacent to the antenna structure, and is configured to enhance the radiation efficiency of the antenna structure. The antenna structure has a first vertical projection on the housing, and the first vertical projection is inside the parallel region. The floating radiation element has a second vertical projection on the housing, and the second vertical projection is inside the cutting retraction region. The frame is at least partially made of a nonconductive material. The housing is at least partially made of a conductive material.

A mobile device includes a body, an antenna structure, and a floating radiation element. The body includes a frame and a housing. The frame is positioned on a first plane. The housing includes a parallel region and a cutting retraction region. The parallel region is positioned on a second plane which is parallel to the first plane. The floating radiation element is adjacent to the antenna structure, and is configured to enhance the radiation efficiency of the antenna structure. The antenna structure has a first vertical projection on the housing, and the first vertical projection is inside the parallel region. The floating radiation element has a second vertical projection on the housing, and the second vertical projection is inside the cutting retraction region. The frame is at least partially made of a nonconductive material. The housing is at least partially made of a conductive material.

An antenna apparatus includes: a ground plane having a through-hole; a feed line disposed below the ground plane; an insulating layer disposed between the feed line and the ground plane; a feed via electrically connected to the feed line, and passing through the through-hole; and a chip patch antenna electrically connected to the feed via. The chip patch antenna includes: a patch antenna pattern electrically connected to the feed via; an upper coupling pattern disposed above the patch antenna pattern; edge coupling patterns surrounding a portion of the patch antenna pattern; upper edge coupling patterns surrounding a portion of the upper coupling pattern; and a dielectric layer disposed in a first region between the patch antenna pattern and the upper coupling pattern, and in a second region between the edge coupling patterns and the upper edge coupling patterns, and having a dielectric constant higher than that of the insulating layer.

A dual-polarized radiating element for a base station antenna includes a first dipole that extends along a first axis, the first dipole including a first dipole arm and a second dipole arm and a second dipole that extends along a second axis, the second dipole including a third dipole arm and a fourth dipole arm and the second axis being generally perpendicular to the first axis, where each of the first through fourth dipole arms has first and second spaced-apart conductive segments that together form a generally oval shape.

Provided is a linear polarization array antenna device for vehicle that is low-cost and has a high gain, by forming an array antenna and a transmission line by conductor patterns on a substrate. The present invention is provided with: a dipole antenna array in which a plurality of dipole antennas formed by the conductor patterns provided on a dielectric substrate are arranged; and two parallel transmission lines formed by the conductor patterns provided on the dielectric substrate, wherein power is supplied to the dipole antennas via the transmission lines. The two parallel transmission lines have a structure in which a pair of conductor patterns face each other across the dielectric substrate interposed between the pair of the conductor patterns.

Provided is a linear polarization array antenna device for vehicle that is low-cost and has a high gain, by forming an array antenna and a transmission line by conductor patterns on a substrate. The present invention is provided with: a dipole antenna array in which a plurality of dipole antennas formed by the conductor patterns provided on a dielectric substrate are arranged; and two parallel transmission lines formed by the conductor patterns provided on the dielectric substrate, wherein power is supplied to the dipole antennas via the transmission lines. The two parallel transmission lines have a structure in which a pair of conductor patterns face each other across the dielectric substrate interposed between the pair of the conductor patterns.

A chip antenna module includes a substrate, a plurality of chip antennas disposed on a first surface of the substrate, and an electronic element mounted on a second surface of the substrate, wherein each of the plurality of chip antennas includes a first ceramic substrate mounted on the first surface of the substrate, a second ceramic substrate opposing the first ceramic substrate, a first patch disposed on the first ceramic substrate, and a second patch disposed on the second ceramic substrate, and the first ceramic substrate and the second ceramic substrate are spaced apart from each other.

In conventional packaging strategies for mm wave applications, the size of the package is dictated by the antenna size, which is often much larger than the RFIC (radio frequency integrated circuit). Also, the operations are often limited to a single frequency which limits their utility. In addition, multiple addition build-up layers are required to provide the necessary separation between the antennas and ground layers. To address these issues, it is proposed to provide a device that includes an antenna package, an RFIC package, and an interconnect assembly between the antenna and the RFIC packages. The interconnect assembly may comprise a plurality of interconnects with high aspect ratios and configured to connect one or more antennas of the antenna package with an RFIC of the RFIC package. An air gap may be formed in between the antenna package and the RFIC package for performance improvement.

In conventional packaging strategies for mm wave applications, the size of the package is dictated by the antenna size, which is often much larger than the RFIC (radio frequency integrated circuit). Also, the operations are often limited to a single frequency which limits their utility. In addition, multiple addition build-up layers are required to provide the necessary separation between the antennas and ground layers. To address these issues, it is proposed to provide a device that includes an antenna package, an RFIC package, and an interconnect assembly between the antenna and the RFIC packages. The interconnect assembly may comprise a plurality of interconnects with high aspect ratios and configured to connect one or more antennas of the antenna package with an RFIC of the RFIC package. An air gap may be formed in between the antenna package and the RFIC package for performance improvement.

An antenna apparatus includes first dipole antenna patterns, feed lines, a first ground plane, and a first blocking pattern. The feed lines are connected to corresponding ones of the first dipole antenna patterns. The first ground plane is disposed on a side of the first dipole antenna patterns and spaced apart from each of the first dipole antenna patterns. The first blocking pattern, connected to and extending from the first ground plane, is disposed between adjacent ones of the first dipole antenna patterns.