Exemplary embodiments are provided of internally fed directional folded Yagi antenna assemblies. In an exemplary embodiment, an antenna assembly generally includes a boom, a cable assembly, and a plurality of dipole elements spaced apart along the boom. The dipole elements include a folded dipole element. The feed cable assembly is internally fed inside the boom and a first section of the folded dipole element.

Package structures are provided having antenna-in-packages that are integrated with semiconductor RFIC (radio frequency integrated circuit) chips to form compact integrated radio/wireless communications systems that operate in the millimeter wave (mmWave) frequency range with radiation in broadside and end-fire directions.

A microwave system comprising a center fed parabolic reflector; a radio transceiver, said transceiver disposed on a circuit board and coupled to a radiator, said radiator disposed on the circuit board and extending orthogonally from a surface of the circuit board. Embodiments also include directors on the circuit board and a sub-reflector comprising a thin plate disposed on a weather proof cover and said sub-reflector having a substantially concave surface with a focus directed towards the radiator. The circuit board may be physically integrated within the feed mechanism of the center fed parabolic reflector and the radio transceiver is configured to provide OSI layer support.

A dipole-shaped antenna element arrangement comprises two pairs of radiator halves which are arranged so as to be rotated by 90° to one another and are oriented in a radiator plane at a distance in front of a reflector and in parallel therewith. The radiator halves are arranged on a balancing and/or support arrangement. There is a passive beam-shaping frame which is arranged at a distance from the radiator halves towards the reflector. The passive beam-shaping frame has at the corners thereof a broadening of the peripheral frame web thereof, said broadening of the frame web extending in parallel with the radiator plane and/or transversely to the radiator plane.

A holographic antenna comprises an optically transparent substrate; a hologram arranged on a first surface of the substrate, the hologram comprising two or more hologram stripes, each having a plurality of linearly arranged hologram pixels, each comprising a switching component; a ground plane arranged on a second surface, opposite the first surface, of the substrate; one or more surface wave launchers arranged on or in a surface of the substrate, the one or more surface wave launchers being configured to feed a feeding signal in a frequency range above 50 GHz into the hologram; and control lines connected to the switching components of the hologram pixels for controlling the hologram pixels individually or in groups.

A holographic antenna comprises an optically transparent substrate; a hologram arranged on a first surface of the substrate, the hologram comprising two or more hologram stripes, each having a plurality of linearly arranged hologram pixels, each comprising a switching component; a ground plane arranged on a second surface, opposite the first surface, of the substrate; one or more surface wave launchers arranged on or in a surface of the substrate, the one or more surface wave launchers being configured to feed a feeding signal in a frequency range above 50 GHz into the hologram; and control lines connected to the switching components of the hologram pixels for controlling the hologram pixels individually or in groups.

An antenna system including an array of conductors connected to a feed line, wherein the array is configured to (1) emit electromagnetic radiation in response to an input signal being input to the array through the feed line or (2) output an output signal to the feed line in response to electromagnetic radiation being received on the array; and a director disposed in front of the array, wherein the director has a first reactive load having a complex impedance that is tailored to increase a directivity of the antenna system by reactively loading the conductors.

An antenna apparatus includes a ground layer having a through-hole; a feed via disposed to pass through the through-hole; a patch antenna pattern disposed on the ground layer and electrically connected to one end of the feed via; a first coupling patch pattern disposed on the patch antenna pattern; a second coupling patch pattern disposed between the first coupling patch pattern and the patch antenna pattern; and a dielectric layer disposed in at least of a portion a space between the first coupling patch pattern and the second coupling patch pattern so that a dielectric constant of at least a portion of a space between the patch antenna pattern and the second coupling patch pattern is lower than a dielectric constant of the space between the first coupling patch portion and the second coupling patch pattern.

An antenna apparatus includes a ground layer having a through-hole; a feed via disposed to pass through the through-hole; a patch antenna pattern disposed on the ground layer and electrically connected to one end of the feed via; a first coupling patch pattern disposed on the patch antenna pattern; a second coupling patch pattern disposed between the first coupling patch pattern and the patch antenna pattern; and a dielectric layer disposed in at least of a portion a space between the first coupling patch pattern and the second coupling patch pattern so that a dielectric constant of at least a portion of a space between the patch antenna pattern and the second coupling patch pattern is lower than a dielectric constant of the space between the first coupling patch portion and the second coupling patch pattern.

A chip antenna includes a first ceramic substrate, a second ceramic substrate, a first patch antenna, a second patch antenna, and a feed via. The second ceramic substrate is disposed to oppose the first ceramic substrate. The first patch antenna includes a seed layer, disposed on a surface of the first ceramic substrate, and a plating layer disposed on the seed layer. The second patch antenna disposed on the second ceramic substrate. The feed via includes a seed layer, formed along an internal wall of a via hole penetrating through the first ceramic substrate in a thickness direction, and a conductive material surrounded by the seed layer in the via hole. The seed layer of the first patch antenna and the seed layer of the feed via are connected to each other.