A semiconductor device package includes a substrate, a reflector, a radiator and a first director. The reflector is disposed on a surface of the substrate. The radiator is disposed over the reflector. The first director is disposed over the radiator. The reflector, the radiator and the first director have different elevations with respect to the surface of the substrate. The radiator and the first director define an antenna.

A multiport planar antenna system with digital reconfigurability to adjust a beam-steering function of the system is described herein. A substrate is provided and a grid of parasitic elements is printed on a surface of the substrate. One or more driven, radiating elements such as monopole or dipole antennas are printed on the substrate proximate the parasitic elements. Switching elements between adjacent parasitic elements are then configured to steer the radiation direction in a particular direction in the azimuth plane. The small form factor of the planar antenna system can be used in a multiple-input, multiple-output (MIMO) application used by fifth generation (SG) devices such as mobile phones, internet of things (IoT) devices, and vehicles.

The present disclosure provides several embodiments of integrated conformal antennas that are designed to be integrated into handheld devices and support operation at millimeter-wave operating frequency band that includes 28 GHz. The antennas have low mutual coupling despite close proximity, and maintain a front-to-back radiation ratio of 10 dB or better within the operating frequency band. The integrated conformal antennas are further capable of supporting operation of the device in different orientations, different forward gains, or a combination thereof.

This patent document describes techniques related to antenna system of an in-flight entertainment and communication (IFEC) system provided in a commercial passenger vehicle. The antenna system comprises monitors associated with passenger seats on the commercial passenger vehicle and configured to display entertainment content for passengers, wireless transceivers disposed outside of the monitors and configured to transceive radio signals that have beam patterns defined according to locations of the wireless transceivers relative to passenger seats, and one or more processors communicatively coupled to the wireless transceivers and configured to support the wireless connectivity for the passengers through the wireless transceivers.

A radio frequency (RF) system includes an RF integrated circuit (IC) die, and an antenna coupled to the RF IC die. The RF system further includes a reflector layer over the RF IC die, the reflector layer extending over at least a portion of the antenna, a combination of the antenna and the reflector layer having a radiation pattern that comprises a main lobe in a first direction parallel to a top surface of the reflector layer.

A radio frequency (RF) system includes an RF integrated circuit (IC) die, and an antenna coupled to the RF IC die. The RF system further includes a reflector layer over the RF IC die, the reflector layer extending over at least a portion of the antenna, a combination of the antenna and the reflector layer having a radiation pattern that comprises a main lobe in a first direction parallel to a top surface of the reflector layer.

A system includes a first antenna and a second antenna. The first antenna includes an antenna section. The antenna section includes a first antenna segment, a second antenna segment adjacent to the first antenna segment, and a notch circuit disposed within a notch between the first antenna segment and the second antenna segment. The notch circuit prevents a first frequency of a signal from passing from the first antenna segment to the second antenna segment while allowing a second frequency from the signal to pass from the first antenna segment to the second antenna segment. The second antenna is disposed proximate to the first antenna. The first antenna occupies a second near field region of the second antenna and the second antenna occupies a first near field region of the first antenna.

A system includes a first antenna and a second antenna. The first antenna includes an antenna section. The antenna section includes a first antenna segment, a second antenna segment adjacent to the first antenna segment, and a notch circuit disposed within a notch between the first antenna segment and the second antenna segment. The notch circuit prevents a first frequency of a signal from passing from the first antenna segment to the second antenna segment while allowing a second frequency from the signal to pass from the first antenna segment to the second antenna segment. The second antenna is disposed proximate to the first antenna. The first antenna occupies a second near field region of the second antenna and the second antenna occupies a first near field region of the first antenna.

A package structure including a first redistribution circuit structure, a semiconductor die, first antennas and second antennas is provided. The semiconductor die is located on and electrically connected to the first redistribution circuit structure. The first antennas and the second antennas are located over the first redistribution circuit structure and electrically connected to the semiconductor die through the first redistribution circuit structure. A first group of the first antennas are located at a first position, a first group of the second antennas are located at a second position, and the first position is different from the second position in a stacking direction of the first redistribution circuit structure and the semiconductor die.

A package structure including a first redistribution circuit structure, a semiconductor die, first antennas and second antennas is provided. The semiconductor die is located on and electrically connected to the first redistribution circuit structure. The first antennas and the second antennas are located over the first redistribution circuit structure and electrically connected to the semiconductor die through the first redistribution circuit structure. A first group of the first antennas are located at a first position, a first group of the second antennas are located at a second position, and the first position is different from the second position in a stacking direction of the first redistribution circuit structure and the semiconductor die.