Patent classifications
H01Q21/0075
APERTURE SHARED SLOT-BASED SUB-6 GHZ AND MM-WAVE IOT ANTENNA FOR 5G APPLICATIONS
An antenna system and a method for fabricating an antenna system are disclosed. The antenna system includes a substrate having a top side and a bottom side, a single straight microstrip line on the top side of the substrate, a microstrip power divider (PD) on the top side of the substrate, and a ground plane on the bottom side. An input end of the single straight microstrip line is adjacent and vertical to a first edge of the substrate, and an output end of the single straight microstrip line is open. An input end of the microstrip PD is adjacent and vertical to a second edge of the substrate, and eight output ends of the microstrip PD are open. The first edge is parallel to the second edge. Further, three concentric square slots are etched on the ground plane.
TERAHERTZ WIDEBAND ANTENNA AND METHOD OF DESIGNING THE SAME
Provided is a terahertz wideband antenna and a method for designing the same. According to various embodiments, the wideband antenna used for mobile communication in the terahertz wave communication band may include an antenna board including a first surface and a second surface opposite to the first surface, and a plurality of dipole antennas arranged on the antenna board, each of the plurality of dipole antennas may include a feeder disposed on the first surface and a radiator disposed on the second surface and physically spaced apart from the feeder, the feeder may be wire-bonded to a corresponding channel of a plurality of channels of a beam former, and the radiator may be coupled to the feeder to receive a signal from the feeder.
Integrated stripline feed network for linear antenna array
An embodiment of an integrated stripline feed network for a linear antenna array comprises a power distribution network coupled to the linear antenna array; a feed signal input/output component coupled to the power distribution network; wherein the input/output component receives a feed signal and splits the feed signal for distributing to a plurality of antenna elements of the linear antenna array through the power distribution network. The integrated stripline feed network is configured to be integrated into a support body of the linear antenna array, wherein, the support body structurally supports the linear antenna array.
Antennas including an array of dual radiating elements and power dividers for wireless electronic devices
A wireless electronic device includes dual radiating antennas, with each of the dual radiating antennas including a first radiating element and a second radiating element. The wireless electronic device includes power dividers, a respective one of which is associated with a respective one of the dual radiating antennas and is configured to divide the power of a signal into a first portion of the power and a second portion of the power. The first portion of the power is applied to a respective first radiating element and the second portion of the power is applied to the respective second radiating element. The wireless electronic device is configured to resonate at a resonant frequency corresponding to the first radiating element and/or the second radiating element of at least one of the plurality of dual radiating antennas when excited by a signal transmitted by at least one of the plurality of dual radiating antennas.
Dipole antenna
A dipole antenna is disclosed, which is formed on an electrical circuit substrate having a ground plane and comprises a first antenna group, a second antenna group and a feeding microstrip line, wherein the first antenna group and the second antenna group have the length of a quarter wavelength on the substrate, two feeding points are formed by the intersections of the individual vertical radiating metallic line and the radiating metallic line on two sides, and the feeding microstrip line is connected between the two vertical radiating metallic lines thereby enhancing the radiation signals.
WIRELESS COMMUNICATION BACKPLANE
An apparatus for wireless communications between communication modules, the apparatus including a main transmission line which has a plurality of coupling points, wherein the apparatus comprises a plurality of main antennas, and wherein each main antenna is linked to a coupling area for a directional coupling between the main antenna and the main transmission line at a coupling point and each main antenna is adapted to communicate with an auxiliary antenna linked to a communication module.
ANTENNA STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME
The disclosure relates to a pre-5.sup.th-Generation (5G) or 5G communication system to be provided for supporting higher data rates Beyond 4.sup.th-Generation (4G) communication system such as Long Term Evolution (LTE). According to an embodiment of the disclosure, an antenna structure of a wireless communication system may include: at least one antenna element including at least one antenna, a power divider configured to feed the at least one antenna element, and a substrate, the at least one antenna element and the power divider may be disposed on the substrate, and, the substrate may include a first dielectric layer having an air layer in a region corresponding to a first region in which the power divider is disposed on the substrate, and a second dielectric layer disposed between the first dielectric layer and the power divider.
MxN MILLIMETER WAVE AND TERAHERTZ PLANAR DIPOLE END-FIRE ARRAY ANTENNA
The present disclosure belongs to the field of radio frequency circuit design, and in particular relates to a M×N millimeter wave and terahertz planar dipole end-fire array antenna. The M×N millimeter wave and terahertz planar dipole end-fire array antenna is composed of M paths of N× end-fire linear array antennas arranged at equal intervals, and the distance d between two adjacent N× end-fire linear array antennas is less than λ, where λ is the wavelength, and both M and N are integers greater than 1. By connecting linear type feed networks of the M paths of N× end-fire linear array antennas to M-path in-phase radio frequency signal transmitter and controlling the distance between two adjacent N× end-fire linear array antennas to be less than the effective wavelength, a higher gain and a higher half-power width can be realized, and the power consumption of the transmitter can be reduced.
BEAMFORMER INTEGRATED CIRCUITS WITH MULTIPLE-STAGE HYBRID SPLITTER/COMBINER CIRCUITS
A multiple-stage splitter/combiner circuit includes first and second splitter/combiner circuits coupled together. The first splitter/combiner circuit has first, second, and third input/output (I/O) ports, a first quarter wave line with a first end coupled to the first I/O port and a second end coupled to the second I/O port, a second quarter wave line with a first end coupled to the first I/O port and a second end coupled to the third I/O port, and a first resistor with first and second terminals coupled to the second and third I/O ports, respectively. The second splitter/combiner circuit has fourth, fifth, and sixth I/O ports, and a ring of multiple quarter wave lines, which includes third and fourth quarter wave lines. The third and fourth quarter wave lines each extend from the fourth I/O port in different directions from each other to the fifth and sixth I/O ports, respectively.
ANTENNA MODULE
An antenna module includes a multilayer board, a phased array antenna that includes antenna elements arranged on an outer face of a second conductor layer included in the multilayer board and adjusts one or more beam directions of the antenna elements, a radio frequency (RF) chip that is arranged on an outer face of first conductor layers included in the multilayer board and outputs the radio frequency signal, a matching circuit that is arranged on the outer face of the first conductor layers and adjusts matching between impedance of the antenna elements and impedance of the RF chip, a through hole that couples the first conductor layers and the second conductor layer, and one or more vias that are on an outer side in a diameter direction of the through hole and couples the first conductor layers.