An antenna stack includes a glass cover having an outer face, an inside face opposite the outer face, and a body therebetween. The glass cover additionally has a cavity formed therein, extending into the body from the inside face. The antenna stack further includes an antenna patch positioned within the cavity, and a waveguide layer. The waveguide layer includes polycrystalline ceramic underlying the glass cover. Conductive vias extend through the polycrystalline ceramic and partition the waveguide layer to form feed channels through the polycrystalline ceramic, and major surfaces of the polycrystalline ceramic are overlaid with a conductor having openings that open to the feed channels. The antenna patch is spaced apart from the waveguide layer to facilitate evanescent wave coupling between the feed channels and the antenna patch.

Antenna arrays, including a broadband single or dual polarized, tightly coupled radiator arrays.

A phased array antenna includes an array of antenna element modules. Each of the array of antenna element modules includes a dielectric substrate having a lower surface and a radiating element. Each of the antenna element modules also includes an integrated circuit (IC) chip adhered to the lower surface of the dielectric substrate. The IC chip includes a circuit to adjust a signal communicated with the radiating element. The phased array antenna also includes a multi-layer substrate underlying the array of antenna element modules, the multi-layer substrate including a beam forming network (BFN) circuit formed on a layer of the multi-layer substrate and the BFN circuit is in electrical communication with the IC chip of each of the array of antenna element modules.

Reconfigurable antenna, comprising: an emissive region, comprising at least one radiating source designed to emit electromagnetic waves; an electromagnetic lens, comprising: a set of phase-shifting cells, comprising switches configured so as to introduce a phase shift to the electromagnetic waves, bias lines, designed to bias the switches; an electromagnetic coupling region, arranged between the emissive region and the electromagnetic lens in order to generate electromagnetic coupling between the electromagnetic waves and the set of phase-shifting cells; the electromagnetic coupling region comprises a set of electrically conductive elements, arranged so to form a contour of a resonant cavity guiding the electromagnetic waves towards the electromagnetic lens, the set of electrically conductive elements comprising first tracks electrically connected to the bias lines.

A structure including a first wafer, including first active components configured so as to introduce a phase shift; a first metal layer, formed on a first surface of the first wafer; a first interconnect structure, formed on a second surface of the first wafer, including first bias lines; a set of first planar antennas, formed on the first interconnect structure; a second wafer; a second metal layer, formed on a first surface of the second wafer; a set of second planar antennas, formed on a second surface of the second wafer; the first and second wafers being joined by way of the first and second metal layers such that the first and second planar antennas are aligned, the first and second metal layers forming a ground plane.

A high gain of an antenna is achieved while suppressing interference of a radio wave from an RFIC. A plurality of serial-type radiation element rows 41 are arranged in parallel. A parallel feed line 45 branches from a feed terminal of an electronic component 11, and connects radiation elements 42, at ends of the serial-type radiation element row 41 farthest from the electronic component 11, to the feed terminal of the electronic component 11. All of the serial-type radiation element rows have an identical path length, along the parallel feed line 45, from each of the radiation elements 42 at the ends farthest from the electronic component 11 to the feed terminal of the electronic component 11. An amplifier 61 is connected to the parallel feed line on a halfway portion of the parallel feed line 45. The amplifier 61 amplifies a signal passing through the parallel feed line 45.

A bowtie antenna arrangement including at least one bowtie structure including bowtie arm sections made of an electrically conducting material with each an end portion facing an end portion of another bowtie arm section, a base portion including a conducting ground plane, the bowtie structure being connected to a feeding arrangement. The bowtie arm sections are planar, made of a conducting sheet or plate element and are arranged in a bowtie arm section plane located in parallel with, at a first distance from a first side of the base portion, the, or each, bowtie arm structure being connected to a feeding port on a second side of the base portion.

A component carrier with a base structure, an antenna arrangement, and an electronic component are disclosed. The antenna arrangement has a first antenna element and a second antenna element, wherein both antennas elements are embedded within the base structure. The electronic component is embedded within the base structure and is operatively connected both with the first antenna element and the second antenna element. The electronic component is an active electronic component capable of providing a first transmit signal to the first antenna element and a second transmit signal to the second antenna element and/or processing a first receive signal received from the first antenna element and a second receive signal received from the second antenna element. Further, an electronic apparatus comprising such a component carrier and a manufacturing method for such a component carrier are described.

A microwave antenna apparatus comprises a semiconductor package module comprising a mold layer, a semiconductor element, a coupling element and a redistribution layer, and an antenna module mounted on top of the semiconductor package module, said antenna module comprising an antenna substrate, one or more antenna elements, an antenna feed layer and an antenna ground layer. The footprint of the antenna module is larger than the footprint of the semiconductor package module.

A high gain of an antenna is achieved while suppressing interference of a radio wave from an RFIC. A plurality of serial-type radiation element rows 41 are arranged in parallel. A parallel feed line 45 branches from a feed terminal of an electronic component 11, and connects radiation elements 42, at ends of the serial-type radiation element row 41 farthest from the electronic component 11, to the feed terminal of the electronic component 11. All of the serial-type radiation element rows have an identical path length, along the parallel feed line 45, from each of the radiation elements 42 at the ends farthest from the electronic component 11 to the feed terminal of the electronic component 11. An amplifier 61 is connected to the parallel feed line on a halfway portion of the parallel feed line 45. The amplifier 61 amplifies a signal passing through the parallel feed line 45.